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AMD XC5VLX110-2FF1153I

Part No.:
XC5VLX110-2FF1153I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1153-BBGA, FCBGA
Datasheet:
AetrixXC5VLX110-2FF1153I.pdf
Description:
IC FPGA 800 I/O 1153FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,624

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Product details

Overview

XC5VLX110-2FF1153I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 6.48 Gb/s transceiver capability, and -2 speed grade in a 1153-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1153) package. It serves as a high-performance programmable logic fabric for radar signal processing, high-speed serial interface bridging, and reconfigurable computing acceleration.

For engineers reviewing the XC5VLX110-2FF1153I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, CLB density, block RAM capacity, and thermal performance under sustained 2.5 Gb/s serial link operation.

Technical Context

The XC5VLX110-2FF1153I implements a hierarchical architecture with Configurable Logic Blocks (CLBs), 18×36 dual-port block RAMs, and RocketIO GTP transceivers supporting protocols including PCI Express Gen1, SATA, and Serial RapidIO. It integrates dedicated DSP48E slices for high-throughput arithmetic operations and supports SelectIO standards up to LVDS 2.5 V.

Configuration occurs via Master SelectMAP or JTAG, with bitstream encryption available using AES-256. The device operates across industrial temperature range (–40°C to +100°C junction) and requires separate VCCINT (1.0 V), VCCAUX (2.5 V), and VCCO (1.2–3.3 V) supplies per I/O bank.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells110,592 - total configurable logic resources for complex state machines and datapaths
Block RAM4,032 kbits - distributed memory for FIFOs, buffers, and lookup tables
Transceiver Speed6.48 Gb/s - maximum line rate per RocketIO GTP channel for multi-lane SerDes links
I/O Pins640 user I/Os - configurable across 12 I/O banks with independent voltage support
Speed Grade-2 - guarantees timing closure at 2.5 Gb/s transceiver operation and 500 MHz system clocking
Operating Temp–40°C to +100°C - qualified for industrial and extended-temperature embedded systems
VCCINT1.0 V ±3% - core supply requiring low-noise regulation for stable LUT/FF operation

Pinout & Package

XC5VLX110-2FF1153I uses a 1153-pin Flip-Chip Fine-Pitch BGA (FFG1153) package with 35×35 array, 1.0 mm ball pitch, and thermal lid. Pin functions are organized into dedicated configuration, clock, JTAG, and multi-standard I/O banks.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration Clock InputDrives internal configuration logic during Master SelectMAP mode; must be stable before INIT_B deassertion
DINConfiguration Data InputSerial data input for bitstream loading in Master SelectMAP; tied high when unused
INIT_BConfiguration Status OutputOpen-drain active-low signal indicating configuration memory readiness or error condition
PROGRAM_BConfiguration Reset InputActive-low asynchronous reset that clears configuration memory and restarts boot sequence
TCK/TMS/TDI/TDOJTAG Boundary-Scan InterfaceIEEE 1149.1-compliant test and debug interface; supports programming and real-time debugging
MRCC/PRCCDedicated Clock InputsMulti-Region Clock Capable inputs feeding global clock networks with low skew to all CLBs

Key Features

FeatureDesign Value
Integrated GTP Transceivers12 RocketIO GTP transceivers supporting 100 Mb/s–6.48 Gb/s with built-in 8B/10B encoding and elastic buffers
DSP48E Slices288 dedicated arithmetic units enabling 250+ GMAC/s for FIR filtering and FFT computation
SelectIO TechnologySupports 21 I/O standards including LVDS, SSTL, HSTL, and differential signaling with programmable slew rate and drive strength
Partial ReconfigurationEnables dynamic module swapping without full device reset-critical for runtime protocol adaptation and fault recovery
AES Bitstream EncryptionHardware-accelerated 256-bit AES decryption prevents unauthorized configuration and IP theft

Applications

Radar Signal ProcessingHigh-Speed Protocol Bridging

Use Scenario: Real-time pulse-Doppler processing in airborne weather radar systems with adaptive beamforming.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs, CFAR detection, and digital down-conversion; GTP transceivers interface with ADC/DAC over JESD204B-like links.

Use Value: 110K logic cells and 288 DSP48E slices enable sub-microsecond latency FFT kernels while sustaining 2.5 Gb/s ADC data ingestion.

Use Scenario: Converting between PCI Express Gen1 x4 and Serial RapidIO 1.2 x4 in military comms backplanes.

IC Role / Device Role / Timing Role: Protocol translation engine with embedded PCIe endpoint and SRIO endpoint cores; GTP lanes handle physical layer serialization.

Use Value: Dual-standard transceivers eliminate external bridge ICs, reducing board area and power by 35% versus discrete PHY solutions.

Reconfigurable Computing AcceleratorIndustrial Machine Vision Controller

Use Scenario: Offloading convolutional neural network inference in edge AI gateways for predictive maintenance analytics.

IC Role / Device Role / Timing Role: Programmable accelerator executing custom CNN layers; block RAM and DSP slices implement weight storage and MAC accumulation.

Use Value: 4,032 kbits of block RAM enables on-chip storage of 128-channel filter weights, avoiding DDR bandwidth bottlenecks.

Use Scenario: Synchronizing multi-camera image capture, preprocessing (demosaic, gamma correction), and GigE Vision packetization in semiconductor inspection tools.

IC Role / Device Role / Timing Role: Image pipeline controller with pixel-clock domain crossing, frame buffering, and TCP/IP stack offload.

Use Value: 640 user I/Os support concurrent LVDS camera interfaces (up to 8×) and Gigabit Ethernet PHY control signals without multiplexing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX110-1FF1153ISlower -1 speed grade; max transceiver rate 3.75 Gb/s; lower static power consumptionSuitable for cost-sensitive designs where 2.5 Gb/s serial links suffice and timing margin is relaxedSelect when thermal budget is constrained and full -2 performance is unnecessary
XCVU9P-2FLGA2104IUltraScale architecture; 2588K logic cells; 24 GTY transceivers up to 32.75 Gb/s; larger FFG2104 packageTargets next-gen 100G Ethernet, 5G baseband, and AI training acceleration requiring higher throughputChoose for migration paths demanding >10× logic density and PAM4-ready SerDes

Compared with XC5VLX110-1FF1153I, the XC5VLX110-2FF1153I delivers guaranteed 6.48 Gb/s transceiver operation and tighter timing margins, while the XCVU9P-2FLGA2104I offers architectural scalability but requires PCB redesign and toolchain migration.

Availability

XC5VLX1153I is available at Aetrix Electronics and suitable for radar signal processing, high-speed protocol bridging, and reconfigurable computing acceleration requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC5VLX110-2FF1153I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU technologies for data center, AI, and embedded markets.

The Virtex-5 family was designed for high-performance, serial connectivity–intensive applications such as aerospace avionics, medical imaging, and wired communications infrastructure.

FAQ

What is the maximum supported transceiver line rate for XC5VLX110-2FF1153I?

The XC5VLX110-2FF1153I supports a maximum transceiver line rate of 6.48 Gb/s per RocketIO GTP channel. This rating is guaranteed under industrial temperature conditions and applies to protocols including PCI Express Gen1, SATA II, and Serial RapidIO. The -2 speed grade ensures timing closure at this rate without derating. XC5VLX110-2FF1153I achieves this using on-die PLLs and adaptive equalization within the GTP transceiver blocks.

Does XC5VLX110-2FF1153I support partial reconfiguration?

Yes, XC5VLX110-2FF1153I supports hardware-accelerated partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated configuration logic. This allows dynamic swapping of functional modules-such as protocol engines or filter banks-without resetting the entire device. XC5VLX110-2FF1153I requires Xilinx ISE 14.7 or later and specific floorplanning constraints to implement secure, verified partial bitstreams.

What I/O standards are supported by XC5VLX110-2FF1153I?

XC5VLX110-2FF1153I supports 21 SelectIO standards including LVDS, LVPECL, SSTL-2, HSTL-I, and differential signaling variants. Each of its 12 I/O banks can be independently configured for voltages from 1.2 V to 3.3 V. XC5VLX110-2FF1153I provides programmable drive strength, slew rate control, and on-chip termination for impedance matching-critical for signal integrity in high-speed parallel buses.

What is the operating temperature range for XC5VLX110-2FF1153I?

XC5VLX110-2FF1153I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is validated per Xilinx DS106 and applies to the FFG1153 package with appropriate thermal management. XC5VLX110-2FF1153I maintains timing compliance and configuration integrity across this range, making it suitable for avionics, downhole drilling, and outdoor telecom equipment.

How is configuration security implemented in XC5VLX110-2FF1153I?

XC5VLX110-2FF1153I implements AES-256 bitstream encryption using on-die dedicated cipher engines. Configuration bitstreams must be encrypted during generation in Xilinx ISE, and decrypted in hardware during startup. XC5VLX110-2FF1153I also supports HMAC authentication and zeroizes keys on tamper detection. This protects intellectual property and prevents cloning of deployed logic designs.

XC5VLX110-2FF1153I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LX
Package/Case:
1153-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
8640
Number of Logic Elements/Cells:
110592
Total RAM Bits:
4718592
Number of I/O:
800
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1153-FCBGA (35x35)

XC5VLX110-2FF1153I FAQ

1.How can I place an order for XC5VLX110-2FF1153I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX110-2FF1153I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX110-2FF1153I reliable?

The price and inventory of XC5VLX110-2FF1153I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110-2FF1153I is usually 5 days.

3.What payment methods are accepted for XC5VLX110-2FF1153I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110-2FF1153I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX110-2FF1153I?

XC5VLX110-2FF1153I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX110-2FF1153I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX110-2FF1153I?

For technical support, including XC5VLX110-2FF1153I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110-2FF1153I requirements.

6.How does Aetrix verify that XC5VLX110-2FF1153I is sourced from the original manufacturer or authorized distributors?

All XC5VLX110-2FF1153I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110-2FF1153I meets industry standards.

7.What is the process for return or replacement of XC5VLX110-2FF1153I?

All XC5VLX110-2FF1153I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110-2FF1153I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX110-2FF1153I part is unused and in its original packaging.

Return procedure for XC5VLX110-2FF1153I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX110-2FF1153I Tags

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  • XC5VLX110-2FF1153I Datasheet
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  • XC5VLX110-2FF1153I Images
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