AMD XC5VLX110-2FF676C
- Part No.:
- XC5VLX110-2FF676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC5VLX110-2FF676C.pdf
- Description:
- IC FPGA 440 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,988
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Product details
Overview
XC5VLX110-2FF676C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 640 DSP48E slices, 4.9 Mb of block RAM, and a -2 speed grade with guaranteed 650 MHz I/O performance. It is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FF676) package and used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC5VLX110-2FF676C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, DSP slice count, embedded memory capacity, I/O voltage support (1.2 V to 3.3 V), and thermal design power (TDP) for cooling validation.
Technical Context
The XC5VLX110-2FF676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for arithmetic-intensive tasks, and integrated 36-Kb block RAMs with true dual-port capability. It supports SelectIO™ technology with programmable I/O standards including LVCMOS, SSTL, HSTL, and differential signaling (LVDS, RSDS).
It includes built-in clock management resources: six Digital Clock Managers (DCMs) and two Phase-Locked Loops (PLLs), enabling precise clock synthesis, phase alignment, and frequency multiplication up to 1.2 GHz. Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG interfaces using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 110,592 - determines maximum combinational/sequential logic capacity for complex state machines or protocol stacks |
| DSP Slices | 640 × DSP48E - enables parallel multiply-accumulate operations at up to 550 MHz for radar or video filtering |
| Block RAM | 4.9 Mb - supports large FIFOs, frame buffers, or lookup tables without external memory |
| I/O Pins | 440 user I/Os - provides high pin-count connectivity for multi-interface systems (PCIe, DDR2, Aurora) |
| Speed Grade | -2 - guarantees timing closure at 650 MHz I/O toggle rate and 500 MHz internal clock frequency |
| Supply Voltages | VCCINT = 1.0 V, VCCAUX = 2.5 V, VCCO = 1.2–3.3 V - requires three independent power rails with tight regulation |
Pinout & Package
XC5VLX110-2FF676C is packaged in a 676-ball Flip-Chip Fine-Pitch BGA (FF676) with 1.0 mm ball pitch, 27 mm × 27 mm body size, and thermal lid for enhanced heat dissipation in high-clock-rate operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master mode PROM or processor loading |
| DIN | Configuration Data Input | Serial data input for SelectMAP or slave serial configuration modes |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset Input | Asynchronous active-low reset that clears configuration memory and restarts loading sequence |
| Done | Configuration Completion Indicator | Open-drain output asserted high when configuration bitstream load completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 65 nm copper process | Enables higher logic density and lower dynamic power versus 90 nm Virtex-4 generation |
| Dedicated PCI Express® Endpoint Block | Hard IP supporting x1/x2/x4 Gen1 PCIe root port or endpoint without consuming LUT resources |
| Integrated Memory Controller | Supports DDR2-533 and QDR II SRAM interfaces with calibration and timing closure assistance |
| Multi-Gigabit Transceivers (optional per device) | Not present on XC5VLX110-2FF676C - this variant lacks RocketIO transceivers; only available on LXT/SXT variants |
| Partial Reconfiguration Support | Allows dynamic module swapping in-system without full device reset or interrupting active logic |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable hardware accelerator implementing FFT, CFAR, and matrix inversion pipelines. Use Value: 640 DSP48E slices enable concurrent 1024-point FFTs at 100+ MSPS, reducing latency versus fixed-ASIC solutions. | Use Scenario: High-speed image reconstruction in CT and MRI scanners requiring low-latency pipeline processing. IC Role / Device Role / Timing Role: Co-processor offloading convolution, back-projection, and noise reduction algorithms from host CPU. Use Value: 4.9 Mb block RAM supports dual-frame buffering while 440 I/Os interface directly to ADCs and DACs. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and discrete I/O aggregation in flight control computers. IC Role / Device Role / Timing Role: Protocol bridge and deterministic real-time scheduler managing time-triggered communication windows. Use Value: -2 speed grade ensures sub-50 ns I/O response time for safety-critical bus arbitration and watchdog supervision. | Use Scenario: Bit-error-rate testing and protocol validation for 3 Gbps serial links (e.g., SATA, SAS). IC Role / Device Role / Timing Role: Programmable pattern generator and error detector synchronized to external reference clocks. Use Value: SelectIO™ support for 1.8 V LVDS and adjustable output drive strength enables precise waveform shaping across temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110-1FF676C | Slower -1 speed grade: max 550 MHz I/O toggle rate and 400 MHz internal clock; lower static power | Suitable for cost-sensitive designs where timing margin exceeds requirements | Select when full -2 timing headroom is unnecessary and thermal/power budget is constrained |
| XC5VLX155T-2FF1136C | Larger device with 155,648 logic cells, 960 DSP48E slices, and FF1136 package; includes RocketIO transceivers | Required for designs needing >10 Gbps serial I/O or >120,000 logic cells | Choose only if XC5VLX110-2FF676C fails timing closure or lacks transceiver capability |
Compared with XC5VLX110-2FF676C, the -1 variant trades performance for lower power and cost, while the LX155T offers greater logic/DSP capacity and serial transceivers at the expense of larger footprint and higher TDP - neither is pin-compatible.
Availability
XC5VLX110-2FF676C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across extended production lifecycles.
Supply support for XC5VLX110-2FF676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, aerospace, and industrial markets.
The Virtex-5 family was originally designed by Xilinx to deliver high-performance reconfigurable logic for compute-intensive, I/O-rich applications such as wireless infrastructure, defense electronics, and scientific instrumentation.
FAQ
What is the maximum operating junction temperature for XC5VLX110-2FF676C?
The XC5VLX110-2FF676C has a maximum allowable junction temperature of 100 °C under continuous operation. Thermal design must ensure this limit is not exceeded using appropriate heatsinking, airflow, and PCB copper pour. The device includes on-die temperature sensors accessible via JTAG for real-time monitoring during system validation and field operation of XC5VLX110-2FF676C.
Does XC5VLX110-2FF676C support partial reconfiguration?
Yes, XC5VLX110-2FF676C supports partial reconfiguration through Xilinx ISE Design Suite tools and associated bitstream generation flow. This allows runtime modification of specific logic regions without resetting the entire device or disrupting active functions - a critical capability for mission-critical XC5VLX110-2FF676C deployments in defense and telecom infrastructure.
What configuration modes are supported by XC5VLX110-2FF676C?
XC5VLX110-2FF676C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial modes. Master SelectMAP uses an internal oscillator to drive external PROM; Slave SelectMAP enables processor-controlled loading; JTAG is used for debugging and programming; Serial mode loads configuration via single-bit stream. All modes are fully documented in the XC5VLX110-2FF676C configuration user guide.
Is XC5VLX110-2FF676C RoHS compliant?
Yes, XC5VLX110-2FF676C is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The FF676 package uses lead-free solder spheres and complies with IPC/JEDEC standard J-STD-033 for handling and reflow profile compliance of XC5VLX110-2FF676C.
Can XC5VLX110-2FF676C interface directly with DDR2-800 memory?
No, XC5VLX110-2FF676C supports DDR2-533 (266 MHz clock) with its integrated memory controller; DDR2-800 requires 400 MHz clock and exceeds the controller's rated specification. Attempting to run beyond DDR2-533 may result in timing violations or data corruption. System designs must adhere to the validated DDR2-533 interface parameters defined in the XC5VLX110-2FF676C data sheet.
XC5VLX110-2FF676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8640
- Number of Logic Elements/Cells:
- 110592
- Total RAM Bits:
- 4718592
- Number of I/O:
- 440
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC5VLX110-2FF676C FAQ
1.How can I place an order for XC5VLX110-2FF676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX110-2FF676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX110-2FF676C reliable?
The price and inventory of XC5VLX110-2FF676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110-2FF676C is usually 5 days.
3.What payment methods are accepted for XC5VLX110-2FF676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110-2FF676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX110-2FF676C?
XC5VLX110-2FF676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX110-2FF676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX110-2FF676C?
For technical support, including XC5VLX110-2FF676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110-2FF676C requirements.
6.How does Aetrix verify that XC5VLX110-2FF676C is sourced from the original manufacturer or authorized distributors?
All XC5VLX110-2FF676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110-2FF676C meets industry standards.
7.What is the process for return or replacement of XC5VLX110-2FF676C?
All XC5VLX110-2FF676C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110-2FF676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX110-2FF676C part is unused and in its original packaging.
Return procedure for XC5VLX110-2FF676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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