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AMD XC5VLX110-2FF676I

Part No.:
XC5VLX110-2FF676I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXC5VLX110-2FF676I.pdf
Description:
IC FPGA 440 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,069

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Product details

Overview

XC5VLX110-2FF676I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 6.48 Mb of block RAM, and 240 DSP48E slices. It uses a 65 nm copper process, supports -2 speed grade timing, and is packaged in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FF676) with I/O voltage support up to 3.3 V. It is deployed in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC5VLX110-2FF676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, embedded memory depth, DSP slice count, I/O bank configuration, and thermal performance under sustained clocking at 550 MHz.

Technical Context

The XC5VLX110-2FF676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for multiply-accumulate operations, and distributed/Block RAM resources. It supports multi-standard I/O including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS and RSDS.

It integrates SelectIO technology with programmable input/output standards per bank, on-chip termination (OCT), and dynamic impedance control. The device includes integrated PCI Express® Gen1 endpoints, tri-mode Ethernet MACs, and clock management tiles with DCMs and PLLs supporting frequency synthesis and phase alignment.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells110,592 - total available LUT-based logic resources for custom digital logic implementation
Block RAM6.48 Mb - distributed across 576 x 18 Kb BRAM primitives, usable as dual-port memory or FIFO
DSP Slices240 × DSP48E - each supports 25 × 18 signed multiplication with pre-adder and pipeline registers
I/O Pins448 user I/O - configurable per-bank voltage (1.2 V to 3.3 V) and standard (LVDS, SSTL, etc.)
Speed Grade-2 - guarantees timing closure up to 550 MHz system clock in worst-case industrial conditions
PackageFF676 - 676-ball flip-chip BGA, 27 × 27 mm body, 1.0 mm ball pitch, RoHS-compliant
Operating Temp-40°C to +100°C - specified for industrial temperature range (I-grade)

Pinout & Package

XC5VLX110-2FF676I is housed in a 676-ball flip-chip fine-pitch BGA (FF676) package with 27 × 27 array, 1.0 mm ball pitch, and thermal pad center. Pin functions are organized into 16 I/O banks, each supporting independent VCCO and VREF settings.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling
VCCAUXAuxiliary power supply2.5 V supply for configuration logic, JTAG, and certain I/O banks; shared with transceivers
VCCOI/O bank powerConfigurable per-bank (1.2–3.3 V); sets output swing and input threshold for associated pins
VRN/VRPReference voltage inputsProvide precision reference for differential I/O standards (e.g., SSTL, HSTL) within same bank
CLK_INDedicated clock inputConnects to DCM or PLL for clock domain generation; supports single-ended or differential signaling
PROGRAM_BConfiguration resetActive-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence

Key Features

FeatureDesign Value
Advanced 65 nm processEnables higher logic density and lower static power vs. prior 90 nm Virtex-4 generation
DSP48E sliceHardwired 25×18 multiplier with built-in pre-adder and accumulator register for deterministic MAC latency
SelectIO technologyPer-bank I/O voltage and standard configuration enables mixed-voltage board design without level shifters
Integrated PCIe endpointHard IP block compliant with PCI Express Base 1.1 specification, reducing soft-core resource usage
DCM and PLL clock managersSupport jitter reduction, frequency synthesis, phase shifting, and duty-cycle correction for multiple clock domains

Applications

Radar Signal ProcessingMedical Imaging Acceleration

Use Scenario: Real-time beamforming and pulse-Doppler filtering in phased-array radar systems.

IC Role / Device Role / Timing Role: Reconfigurable compute engine performing parallel FFTs, FIR filtering, and data packing before ADC/DAC interfacing.

Use Value: 240 DSP48E slices enable simultaneous execution of 240 complex MAC operations per clock cycle at 550 MHz.

Use Scenario: High-throughput image reconstruction in CT and MRI backend processing units.

IC Role / Device Role / Timing Role: Offloads iterative back-projection and convolution algorithms from host CPU to hardware-accelerated pipeline.

Use Value: 6.48 Mb block RAM provides sufficient on-die memory for multi-slice buffer storage without external DDR latency penalty.

High-Speed Test EquipmentAvionics Data Concentrators

Use Scenario: Protocol-aware pattern generation and response analysis in automated test systems for SerDes links.

IC Role / Device Role / Timing Role: Programmable logic layer synchronizing multi-channel digital I/O with sub-nanosecond skew control via DCM/PLL.

Use Value: 448 user I/O pins support concurrent testing of up to 32 differential lanes with independent voltage and termination per bank.

Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B protocol bridging in flight control subsystems.

IC Role / Device Role / Timing Role: Deterministic real-time packet routing and time-stamped message scheduling using hard IP and custom state machines.

Use Value: Industrial temperature rating (-40°C to +100°C) and FF676 package mechanical robustness meet DO-254 airborne hardware requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-capacity FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX110-1FF676ISlower -1 speed grade; max system clock ~450 MHz vs. 550 MHz for -2 gradeSuitable for cost-sensitive designs where timing margin allows relaxed clock targetsSelect when full -2 timing headroom is unnecessary and BOM cost reduction is prioritized
XCVU9P-2FLGA2104IUltraScale+ architecture; 2588K logic cells, 46 Mb BRAM, 600+ DSP slices, 2104-pin packageTargets next-gen systems requiring >2× logic density, PCIe Gen3/4, and hardened 100G EthernetChoose for new designs needing scalability beyond Virtex-5 capabilities and long-term roadmap support

Compared with XC5VLX110-2FF676I, the -1 variant trades timing performance for cost, while the XCVU9P offers generational advancement in density, bandwidth, and interface capability-making it suitable for greenfield designs but requiring PCB and toolchain migration.

Availability

XC5VLX110-2FF676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX110-2FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Virtex-5 family was designed for high-performance, logic- and DSP-intensive applications in aerospace, defense, and high-end instrumentation where predictable timing and mixed-signal I/O flexibility are critical.

FAQ

What is the maximum operating frequency supported by XC5VLX110-2FF676I?

The XC5VLX110-2FF676I is rated for a -2 speed grade, guaranteeing timing closure up to 550 MHz for system clocks under worst-case industrial temperature and voltage conditions. This applies to internal logic paths routed through DCM- or PLL-managed clock networks, not raw I/O toggle rates. Actual achievable frequency depends on design placement, routing congestion, and clock domain structure. The XC5VLX110-2FF676I datasheet specifies setup/hold slack and clock-to-out delays consistent with this rating.

Does XC5VLX110-2FF676I support PCI Express Gen1 endpoints?

Yes, XC5VLX110-2FF676I integrates hard IP PCIe Gen1 endpoint blocks compliant with PCI Express Base 1.1 specification. These blocks handle link training, transaction layer packet (TLP) generation, and flow control without consuming fabric logic resources. The XC5VLX110-2FF676I supports up to x8 lane configurations depending on I/O bank allocation and clocking resources.

What I/O standards are supported by XC5VLX110-2FF676I?

The XC5VLX110-2FF676I supports LVCMOS, LVTTL, SSTL-18/25, HSTL-I/II, and differential standards including LVDS, RSDS, and BLVDS. Each of its 16 I/O banks can be independently configured for voltage (1.2 V to 3.3 V) and standard. The XC5VLX110-2FF676I does not support MIPI or sub-1.0 V standards like SSTL-15.

Is XC5VLX110-2FF676I qualified for industrial temperature operation?

Yes, the XC5VLX110-2FF676I is rated for the industrial temperature range of -40°C to +100°C (I-grade). This qualification covers junction temperature limits, timing parameters, and I/O electrical characteristics across the full range. Thermal management must ensure case temperature remains within spec under sustained 550 MHz operation. The XC5VLX110-2FF676I meets JEDEC JESD22-A104 reliability testing for industrial use.

How much block RAM is available in XC5VLX110-2FF676I?

The XC5VLX110-2FF676I provides 6.48 Mb of total block RAM, implemented as 576 individual 18 Kb BRAM primitives. Each BRAM can operate in single-port, simple dual-port, or true dual-port mode with independent read/write clocks. The XC5VLX110-2FF676I supports byte-write enable and parity generation for error detection in safety-critical applications.

XC5VLX110-2FF676I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LX
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
8640
Number of Logic Elements/Cells:
110592
Total RAM Bits:
4718592
Number of I/O:
440
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XC5VLX110-2FF676I FAQ

1.How can I place an order for XC5VLX110-2FF676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX110-2FF676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX110-2FF676I reliable?

The price and inventory of XC5VLX110-2FF676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110-2FF676I is usually 5 days.

3.What payment methods are accepted for XC5VLX110-2FF676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110-2FF676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX110-2FF676I?

XC5VLX110-2FF676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX110-2FF676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX110-2FF676I?

For technical support, including XC5VLX110-2FF676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110-2FF676I requirements.

6.How does Aetrix verify that XC5VLX110-2FF676I is sourced from the original manufacturer or authorized distributors?

All XC5VLX110-2FF676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110-2FF676I meets industry standards.

7.What is the process for return or replacement of XC5VLX110-2FF676I?

All XC5VLX110-2FF676I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110-2FF676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX110-2FF676I part is unused and in its original packaging.

Return procedure for XC5VLX110-2FF676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX110-2FF676I Tags

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