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AMD XC5VLX110-2FFG1153C

Part No.:
XC5VLX110-2FFG1153C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1153-BBGA, FCBGA
Datasheet:
AetrixXC5VLX110-2FFG1153C.pdf
Description:
IC FPGA 800 I/O 1153FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,799

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Product details

Overview

XC5VLX110-2FFG1153C from AMD (formerly Xilinx) is a Virtex-5 LX family FPGA with 110,592 logic cells, 6.4 Gb/s transceiver capability, and 1153-pin Flip-Chip BGA (FFG) package; used in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC5VLX110-2FFG1153C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (640 user I/Os), speed grade (-2), thermal performance (100°C junction), and compliance with PCIe Gen1/Gen2 and SATA protocols.

Technical Context

The XC5VLX110-2FFG1153C implements a hierarchical FPGA architecture with 36-LUT logic slices, built-in DSP48E blocks (192 units), and Block RAM (4,824 kbits). It supports differential signaling standards including LVDS, RSDS, and BLVDS at up to 1.25 Gbps per I/O pair.

Its clocking system includes 32 DCMs and 16 PLLs for multi-domain clock synthesis and phase alignment; transceivers support serial protocols such as PCI Express, Serial RapidIO, and 10 Gigabit Ethernet without external PHYs.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells110,592 - determines maximum combinational and sequential logic capacity for complex state machines and datapaths
User I/O Pins640 - supports high-bandwidth parallel interfaces and multi-protocol I/O banking
Block RAM4,824 kbits - enables large on-chip data buffering and FIFO implementation without external memory
DSP Slices192 × DSP48E - delivers 37.2 GMAC/s peak multiply-accumulate throughput for real-time filtering and FFT
Transceiver Speed6.4 Gb/s - enables native 10GbE KR, PCIe Gen2 x8, and SRIO 2x links
Speed Grade-2 - guarantees timing closure at 500 MHz system clock with worst-case voltage/temperature margin
PackageFFG1153 - 1153-ball flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity

Pinout & Package

XC5VLX110-2FFG1153C uses a 1153-ball flip-chip BGA (FFG) package with 640 user-configurable I/Os distributed across 16 banks. Power and ground balls are arranged in dedicated rows to minimize noise coupling and support simultaneous switching noise (SSN) mitigation.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore supply1.0 V ±3% supply for logic fabric; requires low-noise regulation and local decoupling
VCCAUXAuxiliary supply2.5 V supply for configuration, clocking, and transceiver reference circuits
VCCOI/O bank supplyProgrammable 1.2–3.3 V per bank; enables mixed-voltage interface coexistence
CONFIG_IOConfiguration I/ODedicated pins for JTAG, SelectMAP, or SPI configuration modes
GTCLKTransceiver reference clockDifferential input for transceiver PLL; supports 10–625 MHz frequency range
MRCC/DRCCMulti-Region Clock CapableGlobal clock inputs with low-skew routing to multiple clock regions

Key Features

FeatureDesign Value
Advanced silicon modular architectureEnables predictable timing convergence and scalable floorplanning across Virtex-5 LX devices
Integrated PCI Express Endpoint v1.1Hard IP block supporting x1/x2/x4/x8 link widths with full protocol stack offload
Low-power 65 nm copper processReduces dynamic power by ~40% vs. previous 90 nm generation while increasing density
System Monitor (XADC)On-die 12-bit ADC monitoring die temperature, supply voltages, and external analog inputs
Partial Reconfiguration SupportAllows runtime logic module swapping without resetting the entire device

Applications

Radar Signal ProcessingMedical Imaging Backend

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes parallel filter banks and FFT engines; transceivers interface with ADC/DAC FMC modules.

Use Value: 192 DSP48E slices deliver >30 GMAC/s sustained compute for CFAR detection and STAP algorithms.

Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners.

IC Role / Device Role / Timing Role: Configurable logic manages multi-channel data ingestion, compression (JPEG2000), and PCIe Gen2 host transfer.

Use Value: 640 user I/Os enable concurrent connection to 16+ ADC channels and DDR2/DDR3 memory controllers.

Avionics Data ConcentratorHigh-Speed Test Equipment

Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control computers.

IC Role / Device Role / Timing Role: Soft-core microblaze processors handle protocol stacks; transceivers manage deterministic low-latency packet forwarding.

Use Value: -2 speed grade ensures sub-200 ns end-to-end latency for time-critical avionics messages.

Use Scenario: Bit-error-rate testing and protocol validation for 10GbE and SAS-2 interfaces.

IC Role / Device Role / Timing Role: Generates and analyzes PRBS patterns at 6.4 Gb/s using built-in transceiver PRBS generators/checkers.

Use Value: Native 6.4 Gb/s transceivers eliminate need for external retimers or gearbox ICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture, 2588K logic cells, 2104-pin FC-BGA, supports PCIe Gen3/Gen4Higher bandwidth and lower latency required for AI inference acceleration and 5G basebandChoose when migrating to 16 nm process, requiring >2× logic density and Gen3+ serial protocols
XC7K325T-2FFG901CKintex-7 architecture, 325K logic cells, 901-pin FFG package, 6.6 Gb/s transceiversCost-sensitive high-throughput video processing with DDR3/PCIe Gen2 endpointsChoose for balanced performance/cost in broadcast infrastructure where 110K logic cells are excessive

Compared with XC5VLX110-2FFG1153C, the XCVU9P offers 2.3× more logic and Gen4 PCIe but requires new PCB layout and toolchain migration; the XC7K325T provides Gen2 compatibility and mature Vivado support at lower cost, though with reduced DSP and transceiver channel count.

Availability

XC5VLX110-2FFG1153C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and high-speed test equipment requiring stable component supply across long-lifecycle programs.

Supply support for XC5VLX110-2FFG1153C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU technologies.

The Virtex-5 family was designed for high-performance reconfigurable computing in aerospace, defense, and wired communications infrastructure.

FAQ

What is the maximum operating junction temperature for XC5VLX110-2FFG1153C?

The XC5VLX110-2FFG1153C has a maximum operating junction temperature of 100°C, validated under worst-case voltage and thermal conditions. This rating applies to the -2 speed grade in the FFG1153 package and is specified in the Virtex-5 DC and Switching Characteristics datasheet (DS106). Thermal design must ensure junction temperature remains below this limit during sustained operation.

Does XC5VLX110-2FFG1153C support partial reconfiguration?

Yes, XC5VLX110-2FFG1153C supports partial reconfiguration through Xilinx ISE Design Suite tools and associated bitstream generation flow. This allows dynamic replacement of logic modules without resetting the entire device, enabling runtime adaptation in communication protocols and signal processing pipelines.

What configuration modes are supported by XC5VLX110-2FFG1153C?

XC5VLX110-2FFG1153C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Configuration I/O pins are dedicated and mapped to specific ball locations in the FFG1153 package, with mode selection controlled via MODE pins during power-up.

Is XC5VLX110-2FFG1153C RoHS compliant?

Yes, XC5VLX110-2FFG1153C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FFG1153 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) handling guidelines.

What transceiver protocols does XC5VLX110-2FFG1153C natively support?

XC5VLX110-2FFG1153C natively supports PCI Express Gen1/Gen2 (up to x8), Serial RapidIO Gen1/Gen2, 10 Gigabit Ethernet (10GBASE-R), and SATA II protocols using its integrated RocketIO GTP transceivers. Protocol compliance is verified per IEEE 802.3ap, PCI-SIG, and Serial ATA specifications.

XC5VLX110-2FFG1153C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LX
Package/Case:
1153-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
8640
Number of Logic Elements/Cells:
110592
Total RAM Bits:
4718592
Number of I/O:
800
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1153-FCBGA (35x35)

XC5VLX110-2FFG1153C FAQ

1.How can I place an order for XC5VLX110-2FFG1153C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX110-2FFG1153C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX110-2FFG1153C reliable?

The price and inventory of XC5VLX110-2FFG1153C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110-2FFG1153C is usually 5 days.

3.What payment methods are accepted for XC5VLX110-2FFG1153C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110-2FFG1153C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX110-2FFG1153C?

XC5VLX110-2FFG1153C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX110-2FFG1153C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX110-2FFG1153C?

For technical support, including XC5VLX110-2FFG1153C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110-2FFG1153C requirements.

6.How does Aetrix verify that XC5VLX110-2FFG1153C is sourced from the original manufacturer or authorized distributors?

All XC5VLX110-2FFG1153C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110-2FFG1153C meets industry standards.

7.What is the process for return or replacement of XC5VLX110-2FFG1153C?

All XC5VLX110-2FFG1153C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110-2FFG1153C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX110-2FFG1153C part is unused and in its original packaging.

Return procedure for XC5VLX110-2FFG1153C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX110-2FFG1153C Tags

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