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AMD XC5VLX110-2FFG1153I

Part No.:
XC5VLX110-2FFG1153I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1153-BBGA, FCBGA
Datasheet:
AetrixXC5VLX110-2FFG1153I.pdf
Description:
IC FPGA 800 I/O 1153FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,212

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Product details

Overview

XC5VLX110-2FFG1153I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 6.9 Gb/s transceiver capability, and -2 speed grade in a 1153-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It serves as a high-performance programmable logic fabric for reconfigurable digital signal processing in radar baseband subsystems.

For engineers reviewing the XC5VLX110-2FFG1153I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic cell count, I/O voltage support, and thermal performance under sustained DSP workloads.

Technical Context

The XC5VLX110-2FFG1153I implements a column-based architecture with dedicated DSP48E slices, Block RAM (BRAM) organized in 36 Kb dual-port blocks, and integrated PCI Express® Endpoint logic. It supports differential I/O standards including LVDS, SSTL, and HSTL across 640 user-configurable I/O pins.

This device uses a 65 nm copper process and operates at core voltage of 1.0 V ±3%, with configurable I/O banks supporting 1.2 V to 3.3 V signaling. Its -2 speed grade guarantees timing closure at 500 MHz system clock frequency for critical paths.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells110,592 - determines maximum combinational/sequential logic capacity for custom RTL implementation
Transceiver Speed6.9 Gb/s - enables direct interface to 10G Ethernet PHYs and JESD204B ADC/DAC links
I/O Pins640 - supports wide parallel buses and multi-lane serial protocols simultaneously
Block RAM4,824 Kb - provides on-chip memory for FIR filters, frame buffers, and protocol stacks
Speed Grade-2 - specifies worst-case propagation delay for timing-critical control paths at 1.0 V core
PackageFFG1153 - 35 × 35 mm flip-chip BGA with 1.0 mm ball pitch, qualified for industrial temperature range (-40°C to +100°C)

Pinout & Package

XC5VLX110-2FFG1153I is housed in a 1153-ball Flip-Chip Fine-Pitch BGA (FFG) package with perimeter and array I/O ball assignment, thermal vias under the die, and dedicated power/ground ball patterns per bank.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore Power Supply1.0 V ±3% supply for FPGA logic fabric and internal routing
VCCAUXAuxiliary Power2.5 V supply for configuration logic, clock management, and transceivers
VCCOI/O Bank PowerConfigurable 1.2–3.3 V per I/O bank to match external interface voltage levels
CLK_INDedicated Clock InputSingle-ended or differential input feeding Digital Clock Managers (DCMs) or PLLs
INIT_BConfiguration StatusOpen-drain output indicating successful bitstream loading or configuration error
GTX_RXN/TXNTransceiver Differential PairNegative terminal of 6.9 Gb/s serial link supporting PCIe Gen1/2 and SRIO

Key Features

FeatureDesign Value
DSP48E Slices640 - hardwired 25×18 multiplier + accumulator units enabling real-time FFT and beamforming
PCIe Endpoint LogicIntegrated Gen1 x8 endpoint - eliminates external bridge IC for host CPU communication
Multi-Gigabit Transceivers24 lanes @ 6.9 Gb/s - supports JESD204B subclass 1 for synchronized multi-ADC systems
Configurable I/O Banks16 banks with independent VCCO - allows mixed-voltage interfaces (e.g., 1.8 V memory + 3.3 V sensors)
Digital Clock Managers16 DCMs - provide jitter-reduced clock synthesis, phase shifting, and frequency synthesis without external PLLs

Applications

Radar Baseband ProcessingMedical Imaging Data Acquisition

Use Scenario: Real-time pulse-Doppler processing of phased-array radar returns with sub-microsecond latency requirements.

IC Role / Device Role / Timing Role: Reconfigurable signal processor executing adaptive filtering, CFAR detection, and beam steering algorithms.

Use Value: 640 DSP48E slices enable concurrent 1024-point FFTs at 200 MSPS, meeting STANAG 4676 waveform timing constraints.

Use Scenario: High-fidelity ultrasound echo digitization and beamformed RF data streaming to GPU-accelerated reconstruction engines.

IC Role / Device Role / Timing Role: JESD204B receiver aggregating 16-channel ADC data at 125 MSPS per lane into coherent time-aligned frames.

Use Value: 24 transceiver lanes support eight 12-bit/125 MSPS ADCs with deterministic latency and subclass 1 synchronization.

Avionics Data ConcentratorsHigh-Speed Test Equipment

Use Scenario: ARINC 664 (AFDX) end-system aggregation of sensor, actuator, and health-monitoring traffic across multiple LRUs.

IC Role / Device Role / Timing Role: Deterministic packet classifier and scheduler implementing virtual link bandwidth allocation and redundancy management.

Use Value: 640 user I/O pins and embedded PCIe endpoint allow direct connection to dual-host processors and 1000BASE-T PHYs without glue logic.

Use Scenario: Bit-error-rate testing of 10G optical modules using programmable PRBS pattern generation and error correlation.

IC Role / Device Role / Timing Role: High-accuracy deterministic delay generator and multi-channel parallel-to-serial converter.

Use Value: -2 speed grade ensures <15 ps cycle-to-cycle jitter on 156.25 MHz reference clocks driving SerDes CDR circuits.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture, 2588K logic cells, 25.8 Gb/s transceivers, 2104-pin FC-BGASupports PCIe Gen4 and 100G Ethernet; higher density but requires new PCB layoutSelect when migrating to 5G infrastructure or AI-accelerated edge inference with >100 TOPS equivalent throughput
XC7VX690T-2FFG1927IVirtex-7 architecture, 693,120 logic cells, 13.1 Gb/s transceivers, 1927-pin FFG packageHigher transceiver count (72 vs. 24), larger footprint, no native PCIe Gen2 endpointChoose for legacy-compatible upgrades requiring more BRAM and DSP resources while retaining similar toolchain flow

Compared with XC5VLX110-2FFG1153I, the XCVU9P-2FLGA2104I delivers 2.3× higher logic density and next-generation serial I/O, whereas the XC7VX690T-2FFG1927I offers greater BRAM and DSP capacity within the same design ecosystem but with increased board area and thermal load.

Availability

XC5VLX110-2FFG1153I is available at Aetrix Electronics and suitable for radar subsystems, medical imaging front-ends, and avionics data concentrators requiring stable component supply over extended production lifecycles.

Supply support for XC5VLX110-2FFG1153I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family for high-performance computing and signal processing markets.

The Virtex-5 family was engineered for demanding reconfigurable systems requiring deterministic low-latency processing, high-speed serial connectivity, and field-upgradable functionality in aerospace, defense, and instrumentation applications.

FAQ

What is the maximum supported transceiver line rate for XC5VLX110-2FFG1153I?

The XC5VLX110-2FFG1153I supports a maximum transceiver line rate of 6.9 Gb/s per lane. This specification is validated across all 24 transceiver quads in the device and enables compliance with JESD204B subclass 1, PCIe Gen2, and SRIO Gen2 standards. The XC5VLX110-2FFG1153I achieves this performance at junction temperatures up to +100°C under industrial operating conditions.

Does XC5VLX110-2FFG1153I include built-in PCI Express endpoint logic?

Yes, the XC5VLX110-2FFG1153I integrates hard IP PCIe Gen1 x8 endpoint logic compliant with the PCI Express Base Specification v1.1. This eliminates the need for external bridge chips and reduces latency in host-FPGA communication. The XC5VLX110-2FFG1153I supports both root complex and endpoint configurations via configuration space initialization.

What I/O standards are supported by XC5VLX110-2FFG1153I?

The XC5VLX110-2FFG1153I supports LVDS, LVPECL, SSTL-18/25, HSTL-I/II, and PCI-X across its 16 configurable I/O banks. Each bank operates independently with selectable VCCO from 1.2 V to 3.3 V. The XC5VLX110-2FFG1153I does not support DDR4 or MIPI D-PHY standards, which were introduced in later FPGA families.

What is the industrial temperature rating for XC5VLX1153I?

The XC5VLX110-2FFG1153I is rated for operation from -40°C to +100°C ambient temperature, qualified per Xilinx's industrial-grade specifications. Thermal derating begins above +85°C junction temperature, and the XC5VLX110-2FFG1153I requires active cooling in sustained high-utilization scenarios at maximum ambient.

How many Block RAM resources does XC5VLX110-2FFG1153I provide?

The XC5VLX110-2FFG1153I contains 4,824 Kb of total Block RAM, implemented as 36 Kb dual-port RAM blocks. These resources are distributed across the device fabric and support true dual-port read/write operations with independent clocks. The XC5VLX110-2FFG1153I allocates RAM blocks to support large FIR filter coefficients, video line buffers, and protocol descriptor tables without external memory access.

XC5VLX110-2FFG1153I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LX
Package/Case:
1153-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
8640
Number of Logic Elements/Cells:
110592
Total RAM Bits:
4718592
Number of I/O:
800
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1153-FCBGA (35x35)

XC5VLX110-2FFG1153I FAQ

1.How can I place an order for XC5VLX110-2FFG1153I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX110-2FFG1153I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX110-2FFG1153I reliable?

The price and inventory of XC5VLX110-2FFG1153I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110-2FFG1153I is usually 5 days.

3.What payment methods are accepted for XC5VLX110-2FFG1153I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110-2FFG1153I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX110-2FFG1153I?

XC5VLX110-2FFG1153I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX110-2FFG1153I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX110-2FFG1153I?

For technical support, including XC5VLX110-2FFG1153I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110-2FFG1153I requirements.

6.How does Aetrix verify that XC5VLX110-2FFG1153I is sourced from the original manufacturer or authorized distributors?

All XC5VLX110-2FFG1153I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110-2FFG1153I meets industry standards.

7.What is the process for return or replacement of XC5VLX110-2FFG1153I?

All XC5VLX110-2FFG1153I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110-2FFG1153I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX110-2FFG1153I part is unused and in its original packaging.

Return procedure for XC5VLX110-2FFG1153I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX110-2FFG1153I Tags

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