AMD XC5VLX110-2FFG676I

Overview

XC5VLX110-2FFG676I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 648 I/O pins, and -2 speed grade in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It integrates 4.95 Mb of block RAM, 240 DSP48E slices, and supports PCIe Gen1 x8 endpoint functionality in high-performance embedded vision and radar signal processing systems.

For engineers reviewing the XC5VLX110-2FFG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), differential signaling compliance (LVDS, SSTL, HSTL), embedded memory depth, and transceiver lane count for serial interface integration.

Technical Context

The XC5VLX110-2FFG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for arithmetic-intensive tasks, and integrated Block RAMs organized as 36 Kb dual-port RAM primitives. It supports multi-standard I/O banks with independent VCCO per bank and programmable slew rate control.

This device includes 12 RocketIO GTP transceivers operating up to 3.75 Gb/s, enabling serial protocols including SATA, Serial RapidIO, and CPRI. Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG interfaces using external SPI flash or PROM.

Key Specifications

Pinout & Package

XC5VLX110-2FFG676I is housed in a 676-ball Flip-Chip Fine-Pitch BGA (FFG) package with thermal lid, 1.0 mm ball pitch, and RoHS-compliant finish. Pin functions are organized into I/O banks, configuration banks, power/ground balls, and dedicated transceiver lanes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC5VLX110T-2FFG1136I, the XC5VLX110-2FFG676I offers identical logic density in a smaller footprint and lower cost, while XC5VLX110-2FFG676I lacks the transceiver count and I/O scalability of the UltraScale+ XCVU9P, making it suitable for mature, cost-sensitive, or space-constrained legacy upgrades.

Availability

XC5VLX110-2FFG676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX110-2FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Virtex-5 family was originally designed by Xilinx for high-performance, logic- and DSP-intensive applications in aerospace, defense, and wired infrastructure where deterministic timing and multi-standard I/O flexibility are critical.

FAQ

What is the maximum supported I/O standard voltage for XC5VLX110-2FFG676I?

The XC5VLX110-2FFG676I supports I/O standards from 1.2 V to 3.3 V per bank, with independent VCCO supply for each I/O bank. This allows mixed-voltage operation-such as LVDS at 2.5 V and SSTL-18 at 1.8 V-within the same device, provided each bank's VCCO matches its assigned standard. The XC5VLX110-2FFG676I datasheet specifies absolute maximum ratings and DC characteristics for each supported standard under corresponding VCCO conditions.

Does XC5VLX110-2FFG676I include built-in analog monitoring capability?

Yes, the XC5VLX110-2FFG676I integrates a System Monitor (XADC) block with dual 10-bit 1 MSPS ADCs. It monitors on-die temperature, internal VCCINT, auxiliary VCCAUX, and up to 17 external analog inputs. This capability enables real-time thermal throttling, supply health checking, and calibration in mission-critical systems. The XADC is accessible via dedicated JTAG or through FPGA logic in the XC5VLX110-2FFG676I design.

Can XC5VLX110-2FFG676I be configured via PCIe interface?

No, the XC5VLX110-2FFG676I does not support direct PCIe-based configuration. It uses standard configuration modes: Master/Slave SelectMAP (parallel NOR flash), JTAG, or serial SPI PROM. However, once configured, the XC5VLX110-2FFG676I can implement a PCIe Gen1 endpoint using its hard IP block, enabling host communication-but configuration itself must occur through dedicated configuration pins and external non-volatile memory.

What is the operating temperature range for XC5VLX110-2FFG676I?

The XC5VLX110-2FFG676I is rated for the industrial temperature range of –40 °C to +100 °C case temperature (T_C). This rating applies to the -2 speed grade in the FFG676 package and is validated per Xilinx specification DS100. Thermal design must ensure junction temperature remains within limits using appropriate heatsinking and airflow, especially under full DSP and transceiver utilization in the XC5VLX110-2FFG676I.

Is partial reconfiguration supported on XC5VLX110-2FFG676I?

Yes, the XC5VLX110-2FFG676I supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and frame-based bitstream loading mechanism. This allows dynamic replacement of specific logic modules-such as filter coefficients or protocol engines-without resetting the entire device or disrupting active I/O or memory operations. Partial reconfiguration is enabled in the XC5VLX110-2FFG676I using Xilinx ISE Design Suite with PlanAhead tools and requires careful floorplanning and bitstream partitioning.