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AMD XC5VLX110-3FFG1153C
- Part No.:
- XC5VLX110-3FFG1153C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1153-BBGA, FCBGA
- Datasheet:
-
XC5VLX110-3FFG1153C.pdf
- Description:
- IC FPGA 800 I/O 1153FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,189
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Product details
Overview
XC5VLX110-3FFG1153C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 6.48 Gb/s transceiver capability, and -3 speed grade in a 1153-pin FCBGA package; used in high-performance digital signal processing and reconfigurable computing systems requiring deterministic timing and multi-gigabit serial I/O.
For engineers reviewing the XC5VLX110-3FFG1153C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), embedded Block RAM (4,824 kbits), and compliance with PCIe Gen1/Gen2, SATA, and Serial RapidIO protocols.
Technical Context
The XC5VLX110-3FFG1153C implements a hierarchical FPGA architecture with six distinct logic tile types, including Configurable Logic Blocks (CLBs), DSP48E slices (192 units), and dedicated clock management tiles (CMTs) containing DCMs and PLLs. It supports differential signaling standards including LVDS, RSDS, and BLVDS across 640 user I/O pins.
Its transceivers operate at 6.48 Gb/s with built-in 8B/10B encoding, elastic buffers, and channel bonding; the device includes 24 RocketIO GTP transceivers and supports protocol-specific configurations for PCI Express, Serial ATA, and Fibre Channel without external PHYs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 110,592 - determines maximum combinational and sequential logic capacity for complex RTL implementations |
| Block RAM | 4,824 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external SRAM |
| Transceiver Speed | 6.48 Gb/s - enables single-lane PCIe Gen2 x1 or dual-lane SATA II links |
| User I/O Pins | 640 - supports high-density parallel bus interfaces and multi-standard I/O banking |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for critical paths in synthesis |
| Package | FFG1153 - 1153-ball Fine-Pitch Flip-Chip BGA with 1.0 mm pitch and thermal lid for industrial temperature operation |
Pinout & Package
XC5VLX110-3FFG1153C is housed in a 1153-ball FCBGA (Fine-Pitch Flip-Chip Ball Grid Array) package with 1.0 mm ball pitch, thermal lid, and industrial temperature range (-40°C to +100°C). Pin assignment follows Xilinx UG192 v3.3 for Virtex-5 LX family.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for CLBs, DSP slices, and interconnect; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, SelectIO, and clock management circuitry |
| VCCO | I/O bank power | Configurable per-bank (1.2 V–3.3 V) to support mixed-voltage interface designs |
| MR | Master reset input | Active-low asynchronous reset that clears configuration registers and halts state machines |
| CCLK | Configuration clock | Driven by external source during slave serial mode; controls bitstream loading rate |
| GTX_CLK0_M2P/GTX_CLK0_M2N | Differential transceiver reference clock | LVDS-pair input for GTP transceiver banks; must meet jitter < 1.0 ps RMS for 6.48 Gb/s operation |
Key Features
| Feature | Design Value |
|---|---|
| Embedded DSP48E Slices | 192 units with 25×18-bit multipliers, 48-bit accumulators, and pipeline registers for real-time filtering and FFT acceleration |
| SelectIO Technology | Supports 21 I/O standards including SSTL, HSTL, LVCMOS, and differential LVDS with programmable drive strength and slew rate |
| PCIe Endpoint Logic | Hard IP blocks compliant with PCIe Gen1/Gen2 Physical and Data Link Layers, reducing soft-core resource usage and latency |
| Multi-Standard Transceivers | 24 GTP transceivers configurable as SATA, Serial RapidIO, or custom protocols via GT wizard IP core |
| Partial Reconfiguration Support | Enables dynamic module swapping in operational systems without full reconfiguration or system reset |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; transceivers interface with ADC/DAC over JESD204B-like serial links. Use Value: 192 DSP48E slices enable concurrent 1024-point FFTs at 100 MHz clock; deterministic routing ensures sub-cycle timing predictability. | Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: Configurable logic accelerates back-projection and filtered back-projection; Block RAM buffers raw projection data. Use Value: 4,824 kbits of embedded RAM eliminates external memory bottlenecks for 512×512 sinogram buffering at >200 fps. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Soft-core microcontrollers manage protocol stacks; transceivers handle deterministic packetized data transport. Use Value: -3 speed grade guarantees worst-case timing closure for 1553B Manchester decoding at 1 Mbps with zero setup/hold violations. | Use Scenario: Bit-error-rate testing and protocol validation for 3 Gbps SATA and 2.5 Gbps PCIe links. IC Role / Device Role / Timing Role: GTP transceivers generate and analyze PRBS patterns; logic fabric implements pattern matching and error counters. Use Value: 6.48 Gb/s transceiver speed allows direct generation of SATA III (6 Gbps) test patterns using gearbox mode and 2x oversampling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110-2FFG1153C | Slower -2 speed grade; lower maximum clock frequency and higher timing margin requirements | Suitable for cost-sensitive designs where full -3 performance is unused | Select when timing closure is achieved at lower frequencies and thermal/power budgets are constrained |
| XCVU9P-2FFVA2104I | Virtex UltraScale+ device with 1.1M logic cells, 24.3 Gb/s transceivers, and DDR4 controller hard IP | Targets next-generation protocols (PCIe Gen4, CCIX) and larger algorithm footprints | Choose for new designs requiring higher bandwidth, lower latency, or long-term roadmap alignment beyond Virtex-5 lifecycle |
Compared with XC5VLX110-3FFG1153C, the -2 variant trades speed for cost and power efficiency, while the XCVU9P offers architectural scalability but requires PCB redesign and toolchain migration.
Availability
XC5VLX1153C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX110-3FFG1153C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support legacy Virtex families through its Adaptive SoC and FPGA business unit.
The Virtex-5 family was engineered for high-bandwidth, low-latency reconfigurable computing in aerospace, defense, and high-end instrumentation applications.
FAQ
What is the maximum supported transceiver data rate for XC5VLX110-3FFG1153C?
The XC5VLX110-3FFG1153C supports a maximum transceiver data rate of 6.48 Gb/s per lane using its RocketIO GTP transceivers. This rate is validated under industrial temperature conditions and meets jitter specifications for PCIe Gen2 and SATA II compliance. The XC5VLX110-3FFG1153C achieves this performance with built-in 8B/10B encoding and elastic buffers, enabling reliable serial link operation without external retiming.
Does XC5VLX110-3FFG1153C support partial reconfiguration?
Yes, the XC5VLX110-3FFG1153C supports partial reconfiguration through Xilinx ISE design tools and associated bitstream generation workflows. This capability allows dynamic replacement of logic modules while the rest of the design remains operational. The XC5VLX110-3FFG1153C implements this using frame-based configuration access and dedicated configuration port resources, enabling field-upgradable functionality in deployed systems.
What I/O standards are supported by XC5VLX110-3FFG1153C?
The XC5VLX110-3FFG1153C supports 21 SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS, RSDS, and BLVDS. Each of its 640 user I/O pins is assignable to one of 16 I/O banks, with independent VCCO voltage settings per bank ranging from 1.2 V to 3.3 V. This flexibility allows the XC5VLX110-3FFG1153C to interface directly with diverse memory, sensor, and communication peripherals.
Is XC5VLX110-3FFG1153C compatible with PCIe Gen2 endpoints?
Yes, the XC5VLX110-3FFG1153C includes hard PCIe Gen2 endpoint logic compliant with the Physical and Data Link Layers of the PCI Express Base Specification v2.0. It supports x1, x2, x4, and x8 link widths with automatic speed negotiation and error reporting. The XC5VLX110-3FFG1153C integrates dedicated DMA engines and TLP parsing logic, reducing soft-core implementation overhead and ensuring deterministic latency for real-time applications.
What is the industrial temperature range for XC5VLX110-3FFG1153C?
The XC5VLX110-3FFG1153C is rated for industrial temperature operation from -40°C to +100°C case temperature. This rating applies to the FFG1153 package variant and is verified per Xilinx specification DS100. Thermal management relies on the integrated thermal lid and recommended PCB copper pour under the package. The XC5VLX110-3FFG1153C maintains full timing and functional specification compliance across this range without derating.
XC5VLX110-3FFG1153C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1153-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8640
- Number of Logic Elements/Cells:
- 110592
- Total RAM Bits:
- 4718592
- Number of I/O:
- 800
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1153-FCBGA (35x35)
XC5VLX110-3FFG1153C FAQ
1.How can I place an order for XC5VLX110-3FFG1153C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX110-3FFG1153C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX110-3FFG1153C reliable?
The price and inventory of XC5VLX110-3FFG1153C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110-3FFG1153C is usually 5 days.
3.What payment methods are accepted for XC5VLX110-3FFG1153C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110-3FFG1153C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX110-3FFG1153C?
XC5VLX110-3FFG1153C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX110-3FFG1153C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX110-3FFG1153C?
For technical support, including XC5VLX110-3FFG1153C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110-3FFG1153C requirements.
6.How does Aetrix verify that XC5VLX110-3FFG1153C is sourced from the original manufacturer or authorized distributors?
All XC5VLX110-3FFG1153C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110-3FFG1153C meets industry standards.
7.What is the process for return or replacement of XC5VLX110-3FFG1153C?
All XC5VLX110-3FFG1153C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110-3FFG1153C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX110-3FFG1153C part is unused and in its original packaging.
Return procedure for XC5VLX110-3FFG1153C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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