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AMD XC5VLX110-3FFG676C
- Part No.:
- XC5VLX110-3FFG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC5VLX110-3FFG676C.pdf
- Description:
- IC FPGA 440 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,746
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Product details
Overview
XC5VLX110-3FFG676C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 640 DSP48E slices, and 4.9 Mb of block RAM. It uses a 65 nm copper process, supports -3 speed grade (fastest commercial grade), and is packaged in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) with 1.0 V core voltage. It targets high-performance digital signal processing in radar baseband subsystems.
For engineers reviewing the XC5VLX110-3FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (448 user I/Os), differential signaling support (LVDS, RSDS, BLVDS), transceiver line rate (up to 3.75 Gb/s), and configuration interface options (Master SelectMAP, Slave Serial).
Technical Context
The XC5VLX110-3FFG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for arithmetic-intensive operations, and integrated multi-gigabit transceivers (MGTs). It supports PCI Express Gen1 x8, Serial RapidIO, and Aurora protocols via its 16 MGT lanes.
Configuration is performed via external SPI flash or JTAG, with dual-boot capability and bitstream encryption support. The device includes clock management tiles (CMTs) with DCMs and PLLs for jitter reduction and frequency synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 110,592 - total programmable fabric resources for custom digital logic implementation |
| DSP Slices | 640 DSP48E - fixed-point multiply-accumulate units operating up to 550 MHz |
| Block RAM | 4.9 Mb - distributed and block memory for data buffering and lookup tables |
| User I/O Pins | 448 - configurable single-ended and differential I/O standards including LVCMOS, LVDS, RSDS |
| Transceivers | 16 × 3.75 Gb/s - serial I/O for high-speed protocols like PCIe Gen1 and SRIO |
| Speed Grade | -3 - fastest commercial timing grade, enabling highest system clock frequencies |
| Core Voltage | 1.0 V ±3% - low-voltage operation reducing dynamic power consumption |
Pinout & Package
XC5VLX110-3FFG676C is housed in a 676-ball Flip-Chip Fine-Pitch BGA (FFG676) package with 1.0 mm ball pitch, thermal lid, and standard JEDEC MO-251AC footprint. Pin functions are organized into I/O banks, configuration pins, clock inputs, and dedicated transceiver banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Input clock for Master SelectMAP configuration mode; drives internal configuration logic |
| DIN | Configuration Data In | Serial data input during Slave Serial or SelectMAP configuration |
| INIT_B | Configuration Status | Open-drain output indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and restarts configuration sequence |
| MRCC/MRCC_N | Multi-Region Clock Input | Dedicated differential pair for high-slew-rate clock distribution to multiple clock regions |
| GTX_CLK0_N/P | Transceiver Reference Clock | Differential reference clock input for GTX transceiver bank 0 (up to 3.75 Gb/s) |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 65 nm Process | Enables higher density and lower static power vs. previous 90 nm Virtex-4 generation |
| Dual-Register Flip-Flops | Increases logic utilization efficiency and reduces routing congestion in high-fanout designs |
| Integrated PCIe Endpoint Block | Hard IP supporting Gen1 x1/x2/x4/x8 link layer and transaction layer without soft-core overhead |
| System Monitor (XADC) | On-chip 17-channel 12-bit ADC for real-time temperature, voltage, and analog monitoring |
| Bitstream Encryption | AES-256 decryption prevents unauthorized configuration and intellectual property theft |
Applications
| Radar Baseband Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler signal processing in airborne SAR systems requiring adaptive filtering and FFT acceleration. IC Role / Device Role / Timing Role: Primary programmable fabric executing time-critical beamforming and CFAR algorithms with deterministic latency. Use Value: 640 DSP48E slices deliver >200 GMAC/s throughput at 200 MHz, enabling sub-millisecond response for target tracking loops. | Use Scenario: High-throughput image reconstruction pipeline in CT scanner backends handling 16-bit projection data streams. IC Role / Device Role / Timing Role: Interface bridge between ASIC-based detector front-end and DDR2 memory subsystem, managing burst transfers and pixel alignment. Use Value: 448 user I/Os support concurrent LVDS camera links and DDR2 memory interface, eliminating external glue logic. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 protocol aggregation in flight control computers. IC Role / Device Role / Timing Role: Protocol-aware packet processor with deterministic timestamping and priority queuing across mixed-criticality networks. Use Value: Integrated hard PCIe endpoint enables direct host CPU access to AFDX buffers with <500 ns interrupt latency. | Use Scenario: Bit-error-rate tester (BERT) pattern generator and analyzer for 3 Gb/s serial interfaces. IC Role / Device Role / Timing Role: Programmable pattern engine synchronized to ultra-low-jitter GTX transceivers for precise edge placement. Use Value: 16 GTX transceivers operate at 3.75 Gb/s with <0.3 ps RMS jitter, meeting IEEE 802.3 compliance for 1000BASE-T testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110-2FFG676C | Slower -2 speed grade; 15–20% lower maximum clock frequency in critical paths | Suitable for cost-sensitive avionics where full -3 timing margin is not required | Select when system-level timing slack allows relaxed speed grade to reduce cost and power |
| XCVU9P-2FFVA2104I | Virtex UltraScale+ device with 1.1M logic cells, 2.5x more DSP, and 16.3 Gb/s transceivers | Required for new designs targeting PCIe Gen3/Gen4, 10G Ethernet, or AI-accelerated inference | Choose for next-generation platforms needing higher bandwidth and scalability beyond Virtex-5 capabilities |
Compared with XC5VLX110-3FFG676C, the -2 variant trades performance for cost and power efficiency, while the XCVU9P offers generational improvements in density, transceiver speed, and protocol support-making it suitable for forward-looking architectures but requiring PCB and firmware redesign.
Availability
XC5VLX110-3FFG676C is available at Aetrix Electronics and suitable for radar baseband processing, medical imaging backend systems, and avionics data concentrators requiring stable component supply throughout extended product lifecycles.
Supply support for XC5VLX110-3FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-5 family was designed for high-performance, high-bandwidth applications such as wired communications infrastructure, defense radar, and medical imaging systems requiring deterministic latency and hardware acceleration.
FAQ
What is the maximum supported transceiver line rate for XC5VLX110-3FFG676C?
The XC5VLX110-3FFG676C supports a maximum transceiver line rate of 3.75 Gb/s per channel across its 16 GTX transceivers. This enables compliance with PCIe Gen1 x8, Serial RapidIO 1.2, and Aurora 64B/66B protocols. The actual achievable rate depends on board layout, reference clock quality, and signal integrity tuning, but the silicon specification guarantees operation up to 3.75 Gb/s under specified voltage and temperature conditions.
Does XC5VLX110-3FFG676C support bitstream encryption?
Yes, XC5VLX110-3FFG676C includes AES-256 bitstream encryption capability using a 256-bit key stored in on-chip battery-backed RAM or external eFUSE. This feature protects intellectual property by preventing unauthorized readback or cloning of the programmed configuration. Encryption is enabled during bitstream generation in Vivado Design Suite (or legacy ISE), and the device automatically decrypts on power-up when the correct key is present.
What configuration modes are supported by XC5VLX110-3FFG676C?
XC5VLX110-3FFG676C supports multiple configuration modes: Master SelectMAP (parallel), Slave SelectMAP (parallel), Slave Serial (SPI flash), JTAG boundary-scan, and System ACE. Configuration can be initiated via PROGRAM_B pin or automatically on power-up from SPI flash. Dual-boot capability allows fallback to a secondary bitstream if CRC verification fails on the primary image.
How many block RAM columns does XC5VLX110-3FFG676C contain?
XC5VLX110-3FFG676C contains 128 block RAM columns, each providing 36 Kb of storage (dual-port, byte-write capable), totaling 4.9 Mb of block RAM. These columns are distributed across the device fabric and can be configured as true dual-port RAM, ROM, or shift register, with independent clocking per port. Each column supports synchronous read/write with minimum 1-cycle latency.
Is XC5VLX110-3FFG676C RoHS compliant and lead-free?
Yes, XC5VLX110-3FFG676C is RoHS-compliant and manufactured with lead-free (Pb-free) packaging. The FFG676 package uses matte tin surface finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation, including substance declarations and test reports, is available through AMD's official product change notifications and material content portals.
XC5VLX110-3FFG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8640
- Number of Logic Elements/Cells:
- 110592
- Total RAM Bits:
- 4718592
- Number of I/O:
- 440
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC5VLX110-3FFG676C FAQ
1.How can I place an order for XC5VLX110-3FFG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX110-3FFG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX110-3FFG676C reliable?
The price and inventory of XC5VLX110-3FFG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110-3FFG676C is usually 5 days.
3.What payment methods are accepted for XC5VLX110-3FFG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110-3FFG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX110-3FFG676C?
XC5VLX110-3FFG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX110-3FFG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX110-3FFG676C?
For technical support, including XC5VLX110-3FFG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110-3FFG676C requirements.
6.How does Aetrix verify that XC5VLX110-3FFG676C is sourced from the original manufacturer or authorized distributors?
All XC5VLX110-3FFG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110-3FFG676C meets industry standards.
7.What is the process for return or replacement of XC5VLX110-3FFG676C?
All XC5VLX110-3FFG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110-3FFG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX110-3FFG676C part is unused and in its original packaging.
Return procedure for XC5VLX110-3FFG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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