AMD XC5VLX110T-1FFG1136C
- Part No.:
- XC5VLX110T-1FFG1136C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1136-BBGA, FCBGA
- Datasheet:
-
XC5VLX110T-1FFG1136C.pdf
- Description:
- IC FPGA 640 I/O 1136FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,786
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VLX110T-1FFG1136C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 6.48 Gb/s serial transceiver capability, and 1136-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) packaging. It integrates 240 DSP48E slices, 4.5 Mb of block RAM, and supports PCIe Gen1 x8 endpoint functionality in high-performance embedded vision and radar signal processing systems.
For engineers reviewing the XC5VLX110T-1FFG1136C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support (1.2 V to 3.3 V), configuration interface (SelectMAP or JTAG), and thermal performance in convection-cooled industrial enclosures.
Technical Context
The XC5VLX110T-1FFG1136C implements a hierarchical FPGA architecture with six distinct I/O bank groups, each supporting independent VCCO and VREF settings. Its RocketIO GTP transceivers operate at 1.25–3.75 Gb/s with built-in 8B/10B encoding and elastic buffers for jitter tolerance.
Configuration occurs via Master SelectMAP mode using a 32-bit parallel interface or through JTAG boundary-scan, with bitstream encryption supported via AES-256 keys. The device uses 65 nm copper CMOS process technology and requires dual-supply operation: 1.0 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and bank-specific I/O voltages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 110,592 - determines maximum combinational and sequential logic capacity for algorithm partitioning |
| Block RAM | 4.5 Mb - supports large on-chip data buffering for FFT, FIR, or frame storage without external memory |
| DSP Slices | 240 × DSP48E - enables 240 concurrent 25×18 multiply-accumulate operations per clock cycle |
| Transceiver Speed | 1.25–3.75 Gb/s - defines usable serial link rates for CPRI, Serial RapidIO, or custom high-speed interfaces |
| I/O Pins | 640 user-configurable - provides flexible connectivity across multiple voltage domains and timing standards |
| Configuration Interface | SelectMAP x32 or JTAG - determines boot method, reconfiguration speed, and debug accessibility |
| Operating Temperature | 0 °C to 85 °C (Commercial) - specifies ambient range for reliable operation without forced air cooling |
Pinout & Package
XC5VLX110T-1FFG1136C is housed in a 1136-ball Flip-Chip Fine-Pitch BGA (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-clock-rate applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during Master SelectMAP mode; must be stable before INIT_B deassertion |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating readiness to accept configuration data or detecting CRC error |
| DONE | Configuration Completion Output | Open-drain signal pulled high when configuration completes successfully and device enters user mode |
| M0–M2 | Mode Selection Inputs | Set configuration mode (JTAG, Slave SelectMAP, Master SelectMAP, or Serial) at power-up |
| GTX_CLK0_M2L17 | Transceiver Reference Clock Input | Provides low-jitter reference for GTP transceiver PLLs; requires AC-coupled 100 Ω differential termination |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Clock Management | Four DCMs and two PLLs per clock region enable precise phase alignment and frequency synthesis for multi-domain timing |
| Multi-Voltage I/O Banks | Six independent banks support simultaneous LVCMOS, SSTL, HSTL, and differential signaling standards at 1.2 V–3.3 V |
| Embedded Block RAM | Configurable as true dual-port RAM, FIFO, or ROM up to 36 Kb per block with byte-write enable |
| PCI Express Endpoint Logic | Hard IP supports Gen1 x1/x2/x4/x8 endpoint operation with integrated DMA and TLP parsing |
| AES Bitstream Encryption | On-chip 256-bit AES engine protects intellectual property against unauthorized readback or cloning |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric implements time-critical FFT, CFAR, and digital down-conversion pipelines with deterministic latency. Use Value: 240 DSP48E slices deliver >120 GOPS at 200 MHz, enabling sub-millisecond response for threat detection. | Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: Accelerates back-projection and filtered back-projection kernels while managing DDR2/DDR3 memory coherency. Use Value: 4.5 Mb block RAM reduces off-chip memory bandwidth demand by 40% compared to SRAM-based alternatives. |
| Avionics Data Concentrator | Industrial Protocol Gateway |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Implements deterministic time-triggered communication stacks with hardware timestamping and CRC generation. Use Value: Six I/O banks allow concurrent 1.8 V ARINC and 2.5 V AFDX PHY interfacing without level-shifter components. | Use Scenario: Fieldbus protocol translation between PROFIBUS DP, EtherCAT, and Modbus TCP in PLC edge gateways. IC Role / Device Role / Timing Role: Hosts dual Ethernet MACs and fieldbus state machines with synchronized sample-and-hold for analog I/O. Use Value: PCIe Gen1 x8 interface enables direct connection to Intel Atom or ARM Cortex-A9 host processors without bridge ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX330T-1FFG1760C | 331,008 logic cells, 1760-ball FFG package, higher transceiver count (24 vs. 12) | Required for larger algorithm partitions or multi-channel radar with >4 receive paths | Select when XC5VLX110T-1FFG1136C resource utilization exceeds 90% in critical paths |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture, 20 nm process, 324K logic cells, no native PCIe Gen1 endpoint hard IP | Used in newer designs requiring lower power per GOPS and DDR4 memory support | Choose for new designs targeting long-term availability beyond 2027; not drop-in compatible |
Compared with XC5VLX110T-1FFG1136C, the XC5VLX330T-1FFG1760C offers scalable resources within the same Virtex-5 family and toolchain, while the XCKU060-2FFVA1156I represents a generational shift requiring full RTL and timing closure revalidation but delivering 40% lower dynamic power at equivalent throughput.
Availability
XC5VLX110T-1FFG1136C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend acceleration, and avionics data concentrators requiring stable component supply over extended production lifecycles.
Supply support for XC5VLX110T-1FFG1136C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and aerospace markets.
The Virtex-5 family was engineered for high-bandwidth, compute-intensive applications demanding deterministic latency, multi-standard I/O flexibility, and robust configuration security-targeting defense, medical imaging, and industrial automation.
FAQ
What is the maximum operating frequency of the XC5VLX110T-1FFG1136C core logic?
The XC5VLX110T-1FFG1136C achieves a typical maximum system clock frequency of 550 MHz for register-to-register paths under worst-case commercial conditions. This value depends on design placement, routing, and timing constraints. The device's DCMs and PLLs support output frequencies up to 1.2 GHz for dedicated clock networks, but actual achievable logic frequency is design-dependent and verified during static timing analysis using Xilinx ISE 14.7 tools.
Does the XC5VLX110T-1FFG1136C support JTAG boundary-scan for PCB testing?
Yes, the XC5VLX110T-1FFG1136C fully complies with IEEE 1149.1 (JTAG) standard and includes dedicated TDI, TDO, TMS, TCK, and TRST pins. It supports INTEST, SAMPLE/PRELOAD, and BYPASS instructions for board-level interconnect testing. Boundary-scan operation is functional across all supported I/O standards and does not require configuration completion-enabling pre-configuration test access.
What configuration modes are supported by the XC5VLX110T-1FFG1136C?
The XC5VLX110T-1FFG1136C supports four primary configuration modes: Master SelectMAP (x8/x16/x32 parallel), Slave SelectMAP, JTAG, and Serial. Mode selection is controlled by M0–M2 pins at power-up. Master SelectMAP enables autonomous boot from external flash memory, while JTAG is used for programming, debugging, and partial reconfiguration. All modes support AES-256 encrypted bitstreams.
Can the XC5VLX110T-1FFG1136C interface directly with DDR2 SDRAM?
Yes, the XC5VLX110T-1FFG1136C supports DDR2 SDRAM interfaces up to 400 MHz data rate (200 MHz clock) using its dedicated I/O banks with programmable drive strength, slew rate, and input delay calibration. Xilinx UCF constraints and MIG v3.7 IP core provide verified timing closure for x16/x32 configurations. External termination resistors are required for impedance matching on DQ/DQS lines.
Is the XC5VLX110T-1FFG1136C qualified for extended temperature operation?
No, the XC5VLX110T-1FFG1136C is rated only for commercial temperature range (0 °C to +85 °C). For extended temperature applications (–40 °C to +100 °C), AMD offers the XC5VLX110T-1FFG1136I variant with identical pinout and functionality but qualified to Industrial temperature grade. Thermal derating and voltage margining are required for operation outside the specified commercial range.
XC5VLX110T-1FFG1136C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LXT
- Package/Case:
- 1136-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8640
- Number of Logic Elements/Cells:
- 110592
- Total RAM Bits:
- 5455872
- Number of I/O:
- 640
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1136-FCBGA (35x35)
XC5VLX110T-1FFG1136C FAQ
1.How can I place an order for XC5VLX110T-1FFG1136C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX110T-1FFG1136C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX110T-1FFG1136C reliable?
The price and inventory of XC5VLX110T-1FFG1136C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110T-1FFG1136C is usually 5 days.
3.What payment methods are accepted for XC5VLX110T-1FFG1136C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110T-1FFG1136C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX110T-1FFG1136C?
XC5VLX110T-1FFG1136C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX110T-1FFG1136C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX110T-1FFG1136C?
For technical support, including XC5VLX110T-1FFG1136C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110T-1FFG1136C requirements.
6.How does Aetrix verify that XC5VLX110T-1FFG1136C is sourced from the original manufacturer or authorized distributors?
All XC5VLX110T-1FFG1136C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110T-1FFG1136C meets industry standards.
7.What is the process for return or replacement of XC5VLX110T-1FFG1136C?
All XC5VLX110T-1FFG1136C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110T-1FFG1136C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX110T-1FFG1136C part is unused and in its original packaging.
Return procedure for XC5VLX110T-1FFG1136C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VLX110T-1FFG1136C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

