My Inquiry
My Account
AMD XC5VLX110T-1FFG1136CES
- Part No.:
- XC5VLX110T-1FFG1136CES
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1136-BBGA, FCBGA
- Datasheet:
-
XC5VLX110T-1FFG1136CES.pdf
- Description:
- IC FPGA 640 I/O 1136FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,971
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VLX110T-1FFG1136CES from AMD is a Virtex-5 FPGA featuring 110,592 logic cells, 6.48 Gb/s transceiver capability, and 1136-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) packaging. It integrates 240 DSP48E slices, 4.9 Mb of block RAM, and supports PCIe Gen1 x8 endpoint functionality in high-speed communications infrastructure.
For engineers reviewing the XC5VLX110T-1FFG1136CES datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver line rate, I/O bank voltage flexibility (1.2 V to 3.3 V), thermal performance in FFG1136 package, and compatibility with Xilinx ISE Design Suite v14.7.
Technical Context
The XC5VLX110T-1FFG1136CES implements a column-based architecture with dedicated routing for clock, reset, and control signals. It includes 24 RocketIO GTP transceivers operating up to 3.75 Gb/s per lane and supports multi-gigabit serial protocols including SATA, Serial RapidIO, and CPRI.
This device belongs to the Virtex-5 LXT family and uses 65 nm copper process technology. Its configuration interface supports Master SelectMAP, Slave SelectMAP, and JTAG modes with dual-boot capability via internal M[2:0] pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 110,592 - provides scalable programmable fabric for complex digital signal processing and protocol bridging |
| Block RAM | 4.9 Mb - enables large on-chip data buffering and FIFO implementation without external memory |
| DSP Slices | 240 × DSP48E - delivers 18×25-bit multiply-accumulate operations at up to 500 MHz for real-time filtering |
| Transceivers | 24 × GTP - supports 600 Mb/s to 3.75 Gb/s serial links with embedded 8B/10B encoding and clock correction |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, Differential Signaling - allows direct interfacing with DDR2/3, Ethernet PHYs, and ADC/DACs |
| Configuration Mode | Master/Slave SelectMAP, JTAG - enables flexible programming via parallel flash, serial PROM, or host processor |
Pinout & Package
XC5VLX110T-1FFG1136CES is housed in a 1136-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, designed for high thermal dissipation and signal integrity in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA logic and interconnect; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, JTAG, and transceiver reference clocks |
| VCCO_0 | I/O bank power | Programmable 1.2–3.3 V output driver supply per bank; sets compatible I/O standard |
| MR | Global master reset | Asynchronous active-low reset that clears configuration registers and halts operation |
| CCLK | Configuration clock | Input clock for Master SelectMAP mode; frequency ≤ 50 MHz determines configuration speed |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full reconfiguration, reducing system downtime in telecom baseband processing |
| Embedded PCI Express Endpoint | Hard IP block supporting Gen1 x1/x2/x4/x8 link widths with integrated DMA and TLP parsing |
| Multi-Standard Transceivers | GTP transceivers configurable for SATA, SRIO, CPRI, and custom protocols via GTPE2 attributes |
| Advanced Clock Management | Eight DCMs and two PLLs per clock region provide jitter filtering, phase shifting, and frequency synthesis |
| System Monitor Integration | On-die temperature and supply voltage sensors accessible via JTAG or I2C for thermal-aware runtime management |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in LTE and WiMAX base stations. IC Role / Device Role / Timing Role: FPGA fabric executes OFDM symbol generation, MIMO matrix inversion, and adaptive equalization algorithms. Use Value: 240 DSP48E slices enable concurrent 4×4 MIMO processing at 122.88 MSPS with deterministic latency under 2 µs. | Use Scenario: High-precision waveform generation and analysis in automated test systems. IC Role / Device Role / Timing Role: Configurable logic synchronizes multi-channel DAC/ADC sampling and performs real-time FFT spectral analysis. Use Value: 4.9 Mb block RAM buffers 16k-point time-domain samples; GTP transceivers stream results over PCIe Gen1 x8 at 2 GB/s aggregate bandwidth. |
| Avionics Data Concentrators | Industrial Imaging Systems |
Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and AFDX traffic in flight control computers. IC Role / Device Role / Timing Role: FPGA implements deterministic time-triggered switching fabric with hardware timestamping. Use Value: Dedicated clock routing and 8 DCMs ensure sub-5 ns skew across 1136-ball I/O for synchronized bus arbitration. | Use Scenario: Real-time image preprocessing and compression in medical endoscopy and machine vision cameras. IC Role / Device Role / Timing Role: Parallel pixel pipeline processes 12-bit RGB data at 120 fps with Bayer demosaicing and JPEG-LS encoding. Use Value: LVDS I/O banks interface directly with CMOS image sensors; 110K logic cells implement pipelined convolution kernels without external frame buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110T-2FFG1136I | Higher speed grade (-2 vs -1); 15% faster maximum clock frequency in critical paths | Suitable for designs requiring tighter timing closure in PCIe endpoint or CPRI fronthaul interfaces | Select when design fails timing at -1 grade and cannot be retimed or pipelined further |
| XCVU9P-L2FLGA2104E | UltraScale architecture; 2.5× more logic cells, 16.3 Gb/s GTY transceivers, but larger footprint and higher power | Targeted at next-generation 5G NR and AI-accelerated edge inference where legacy Virtex-5 lacks bandwidth | Choose only if migrating from Virtex-5 to support >6 Gb/s serial protocols or >200K LUT capacity |
Compared with XC5VLX110T-1FFG1136CES, the -2 speed grade offers margin for timing-critical SerDes links, while the UltraScale XCVU9P enables architectural scaling beyond transceiver and logic limits-neither is pin-compatible, and both require full PCB and toolchain revision.
Availability
XC5VLX110T-1FFG1136CES is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX1136CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.
The Virtex-5 family was engineered for high-bandwidth, low-latency programmable logic in communications infrastructure and defense electronics, emphasizing transceiver integration and deterministic timing.
FAQ
What is the maximum supported transceiver data rate for XC5VLX110T-1FFG1136CES?
The XC5VLX110T-1FFG1136CES supports GTP transceivers rated up to 3.75 Gb/s per lane. This rate is validated under specified voltage (VCCAUX = 2.5 V ±5%) and temperature (0°C to 85°C case) conditions per DS106 documentation. The XC5VLX110T-1FFG1136CES does not support rates above 3.75 Gb/s, as higher speeds require GTY transceivers found in UltraScale devices.
Does XC5VLX110T-1FFG1136CES support partial reconfiguration?
Yes, the XC5VLX110T-1FFG1136CES supports partial reconfiguration through its hierarchical design flow and dedicated configuration logic. This capability is documented in UG191 and requires use of Xilinx ISE Design Suite v14.7 with appropriate bitstream generation settings. The XC5VLX110T-1FFG1136CES enables dynamic module swaps without resetting the entire device, preserving state in unmodified regions.
What configuration modes are supported by XC5VLX110T-1FFG1136CES?
The XC5VLX110T-1FFG1136CES supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Configuration is initiated via mode pins M[2:0], and dual-boot capability is enabled using the fallback address feature. The XC5VLX110T-1FFG1136CES requires external non-volatile memory for Master SelectMAP and can be programmed in-system via JTAG boundary-scan.
Is XC5VLX110T-1FFG1136CES RoHS compliant?
Yes, the XC5VLX110T-1FFG1136CES is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) per AMD specification DS106 Rev 2.2. The FFG1136 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 requirements.
What is the thermal resistance (θJA) of XC5VLX110T-1FFG1136CES in its standard package?
The XC5VLX110T-1FFG1136CES has a junction-to-ambient thermal resistance (θJA) of 3.5°C/W under JEDEC JESD51-2 conditions with a 4-layer PCB and 1 oz copper. This value assumes 100% copper pour on top and bottom layers and 2000 mm² thermal pad area. The XC5VLX110T-1FFG1136CES requires active cooling or heatsink attachment for sustained operation above 5 W power dissipation.
XC5VLX110T-1FFG1136CES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LXT
- Package/Case:
- 1136-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8640
- Number of Logic Elements/Cells:
- 110592
- Total RAM Bits:
- 5455872
- Number of I/O:
- 640
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1136-FCBGA (35x35)
XC5VLX110T-1FFG1136CES FAQ
1.How can I place an order for XC5VLX110T-1FFG1136CES through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX110T-1FFG1136CES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX110T-1FFG1136CES reliable?
The price and inventory of XC5VLX110T-1FFG1136CES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX110T-1FFG1136CES is usually 5 days.
3.What payment methods are accepted for XC5VLX110T-1FFG1136CES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX110T-1FFG1136CES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX110T-1FFG1136CES?
XC5VLX110T-1FFG1136CES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX110T-1FFG1136CES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX110T-1FFG1136CES?
For technical support, including XC5VLX110T-1FFG1136CES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX110T-1FFG1136CES requirements.
6.How does Aetrix verify that XC5VLX110T-1FFG1136CES is sourced from the original manufacturer or authorized distributors?
All XC5VLX110T-1FFG1136CES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX110T-1FFG1136CES meets industry standards.
7.What is the process for return or replacement of XC5VLX110T-1FFG1136CES?
All XC5VLX110T-1FFG1136CES units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX110T-1FFG1136CES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX110T-1FFG1136CES part is unused and in its original packaging.
Return procedure for XC5VLX110T-1FFG1136CES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VLX110T-1FFG1136CES Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
