AMD XC5VLX110T-2FFG1136I

Overview

XC5VLX110T-2FFG1136I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 110,592 logic cells, 6.48 Gb/s transceiver capability, and -2 speed grade in a 1136-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package. It serves as a high-performance programmable logic fabric for protocol bridging, DSP acceleration, and embedded vision processing in aerospace avionics systems.

For engineers reviewing the XC5VLX110T-2FFG1136I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver compliance with PCIe Gen1/2, embedded Block RAM capacity of 4,860 kbits, and support for DDR2 SDRAM interfaces up to 533 MHz.

Technical Context

The XC5VLX110T-2FFG1136I implements a hierarchical FPGA architecture with six distinct logic tile types-LUT-based CLBs, dedicated DSP48E slices, high-speed serial transceivers (RocketIO), Block RAM, clock management tiles (CMT), and configuration logic. Its dual-register LUTs enable efficient arithmetic and logic implementation while maintaining deterministic timing closure.

This device integrates 24 RocketIO GTP transceivers operating at 1.0–3.75 Gb/s per lane, supports PCI Express x4 endpoint functionality, and includes 24 CMTs with DCM and PLL for multi-domain clock synthesis and jitter reduction across mixed-signal subsystems.

Key Specifications

Pinout & Package

XC5VLX110T-2FFG1136I is housed in a 1136-ball Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 27×27 mm body size and 1.0 mm ball pitch. The package supports thermal dissipation up to 12 W under typical avionics airflow conditions and features perimeter and array power/ground ball distribution for low-impedance supply delivery.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC5VLX110T-2FFG1136I, the XC6VLX130T offers better static power efficiency and denser DSP resources, while the XCVU9P delivers significantly higher serial bandwidth and logic scale-both require PCB redesign and toolchain migration.

Availability

XC5VLX110T-2FFG1136I is available at Aetrix Electronics and suitable for aerospace avionics, satellite telemetry, electronic warfare systems, and radar signal processing requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX110T-2FFG1136I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for high-performance embedded and datacenter applications.

The Virtex-5 family was designed by Xilinx to deliver balanced logic, memory, and serial I/O resources for demanding real-time signal processing, protocol acceleration, and reconfigurable computing in defense and aerospace systems.

FAQ

What is the maximum supported data rate for transceivers on the XC5VLX110T-2FFG1136I?

The XC5VLX110T-2FFG1136I integrates 24 RocketIO GTP transceivers, each supporting data rates from 1.0 Gb/s to 3.75 Gb/s. This range enables compliance with PCIe Gen1 (2.5 Gb/s) and Gen2 (5.0 Gb/s encoded, 2.5 Gb/s raw) standards. The XC5VLX110T-2FFG1136I transceiver specification is documented in Xilinx DS100 and DS107, with actual achievable rates dependent on board layout, reference clock stability, and signal integrity margins.

Does the XC5VLX110T-2FFG1136I support partial reconfiguration?

Yes, the XC5VLX110T-2FFG1136I supports partial reconfiguration through its configuration port and internal configuration access port (ICAP). This allows dynamic replacement of logic modules during operation without resetting the entire device. The XC5VLX110T-2FFG1136I implementation requires use of Xilinx ISE 14.7 tools and adherence to modular design constraints outlined in UG192 and XAPP118.

What I/O standards are supported by the XC5VLX110T-2FFG1136I?

The XC5VLX110T-2FFG1136I supports 21 I/O standards across its 32 configurable banks, including LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL, and LVDS. Each bank operates independently at voltages from 1.2 V to 3.3 V. The XC5VLX110T-2FFG1136I documentation specifies DC and switching characteristics for each standard in DS100 Table 24 and Xilinx UG190.

Is the XC5VLX110T-2FFG1136I qualified for extended temperature operation?

Yes, the XC5VLX110T-2FFG1136I is offered in the Industrial (-40°C to +100°C case temperature) grade, indicated by the final 'I' in the part number. This qualification includes burn-in, extended temperature testing, and screening per Xilinx specification XCN16012. The XC5VLX110T-2FFG1136I is commonly deployed in avionics and ground vehicle systems requiring operation across this full industrial range.

What configuration modes does the XC5VLX110T-2FFG1136I support?

The XC5VLX110T-2FFG1136I supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. Master SelectMAP uses an 8-bit parallel interface to load configuration data from external flash memory, while Serial mode reads bitstream from SPI flash. The XC5VLX110T-2FFG1136I also supports fallback and multi-boot configurations using external M[2:0] pins per UG191.