AMD XC5VLX155-1FFG1760C

Overview

XC5VLX155-1FFG1760C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 155,328 logic cells, 12.5 Mb of block RAM, 640 DSP48E slices, and 720 user I/Os in a 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It targets high-performance digital signal processing, aerospace avionics data handling, and reconfigurable computing acceleration.

For engineers reviewing the XC5VLX155-1FFG1760C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), maximum system clock frequency (550 MHz), transceiver line rate (3.75 Gb/s), and thermal design power (19.2 W at typical operation).

Technical Context

The XC5VLX155-1FFG1760C implements a hierarchical FPGA architecture with six distinct logic tile types-LUT-based CLBs, dedicated DSP blocks, high-speed serial transceivers (RocketIO GTP), Block RAM, Clock Management Tiles (CMT), and SelectIO interface resources. It supports multi-voltage I/O banks with independent termination and slew-rate control per bank.

This device integrates 24 RocketIO GTP transceivers operating up to 3.75 Gb/s, each with embedded 8B/10B encoding, elastic buffers, and PRBS pattern generation. The CMT includes dual DCMs and one PLL for jitter reduction, phase alignment, and frequency synthesis across multiple clock domains.

Key Specifications

Pinout & Package

Package: 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG), 35 mm × 35 mm, 1.0 mm ball pitch, RoHS-compliant, thermally enhanced with integrated heat slug.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC5VLX155-1FFG1760C, the XCVU9P and XC7VX690T provide significantly higher logic density and serial bandwidth but require new PCB layout, updated power delivery, and revised thermal management-making them migration paths rather than drop-in alternatives.

Availability

XC5VLX155-1FFG1760C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX155-1FFG1760C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Virtex-5 family was engineered for high-bandwidth, compute-intensive applications demanding deterministic timing, mixed-signal integration, and long-term industrial availability-especially in defense, aerospace, and scientific instrumentation.

FAQ

What is the maximum supported I/O standard voltage for XC5VLX155-1FFG1760C?

The XC5VLX155-1FFG1760C supports I/O bank voltages from 1.2 V to 3.3 V, configurable per bank. Each bank can be independently set to LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, SSTL15, SSTL18, HSTL_I, or differential standards including LVDS and RSDS. This enables direct interfacing with diverse peripheral families without level shifters.

Does XC5VLX155-1FFG1760C include built-in analog monitoring capability?

Yes, the XC5VLX155-1FFG1760C integrates a System Monitor (XADC) with a 17-channel 12-bit ADC. It continuously measures on-die temperature, internal supply voltages (VCCINT, VCCAUX, VCCBRAM), and up to four external analog inputs. This provides real-time health monitoring for safety-critical applications such as avionics and medical equipment.

Can XC5VLX155-1FFG1760C support PCI Express Gen1 x4 endpoint functionality?

Yes, the XC5VLX155-1FFG1760C includes hard IP blocks for PCI Express Gen1 endpoint operation at x1, x2, and x4 widths. It delivers full DMA, message-signaled interrupts (MSI), and configuration space access without consuming logic resources-verified in Xilinx UG195 and supported in ISE 14.7 toolchain.

What thermal management is required for sustained operation of XC5VLX155-1FFG1760C?

Sustained operation of XC5VLX155-1FFG1760C requires a thermal solution capable of dissipating 19.2 W under typical conditions. AMD recommends a 35 mm × 35 mm copper heat slug with forced-air cooling (≥200 LFM) and ≥4 oz. internal PCB copper layers. Junction temperature must remain below 100°C per Xilinx DS106 specification.

Is partial reconfiguration supported on XC5VLX155-1FFG1760C?

Yes, partial reconfiguration is fully supported on XC5VLX155-1FFG1760C using the ISE 14.7 toolflow and PlanAhead implementation tools. It allows dynamic swapping of logical modules-such as filter coefficients or protocol engines-without resetting the entire device, enabling runtime adaptation in radar and test equipment applications.