AMD XC5VLX155-2FFG1153C
- Part No.:
- XC5VLX155-2FFG1153C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1153-BBGA, FCBGA
- Datasheet:
-
XC5VLX155-2FFG1153C.pdf
- Description:
- IC FPGA 800 I/O 1153FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VLX155-2FFG1153C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 155,328 logic cells, 12.5 Mb of block RAM, and 640 DSP48E slices. It operates at -2 speed grade (1.25 GHz internal clock), uses 65 nm copper process, and is packaged in a 1153-pin FCBGA with 0.8 mm pitch. It targets high-performance digital signal processing in radar baseband subsystems.
For engineers reviewing the XC5VLX155-2FFG1153C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, embedded memory capacity, DSP slice count, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and thermal performance in convection-cooled enclosures.
Technical Context
The XC5VLX155-2FFG1153C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated routing. It supports multi-gigabit transceivers (up to 3.75 Gb/s), SelectIO technology with programmable slew rate and drive strength, and integrated PCI Express® Endpoint v1.1 hard IP.
It includes dual-register flip-flops per LUT, built-in clock management tiles (CMT) with DCM and PLL, and supports JTAG boundary-scan IEEE 1149.1 compliance. Configuration occurs via Master SelectMAP, Slave SelectMAP, or Serial modes using external PROM or processor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 155,328 - determines maximum combinational and sequential logic capacity for complex state machines and datapaths |
| Block RAM | 12.5 Mb - enables large on-chip buffering for video frame stores, FFT twiddle tables, or packet buffering |
| DSP48E Slices | 640 - provides dedicated 25×18-bit multiply-accumulate capability for real-time filtering and beamforming |
| I/O Standards | Supports LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL/HSTL - allows direct interface to DDR2/DDR3 memory and legacy peripherals |
| Max I/O Count | 640 user I/Os - enables high-bandwidth parallel data acquisition and multi-channel sensor interfacing |
| Speed Grade | -2 - guarantees timing closure up to 1.25 GHz internal clock frequency under worst-case industrial temperature conditions |
| Configuration Mode | Master/Slave SelectMAP, Serial - supports flexible boot sources including flash memory or host processor control |
Pinout & Package
XC5VLX155-2FFG1153C is housed in a 1153-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 0.8 mm ball pitch, 35 mm × 35 mm body size, and Pb-free/roHS-compliant construction. Thermal characteristics include 1.2°C/W junction-to-case and 14.5°C/W junction-to-board (JEDEC 2s2p).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during master mode; must be stable before INIT_B assertion |
| INIT_B | Configuration Initialization Output | Open-drain active-low signal indicating readiness to accept configuration data |
| DONE | Configuration Completion Output | Open-drain active-high signal confirming successful bitstream loading and device startup |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., Master SelectMAP, Slave Serial) at power-up; sampled on PROGRAM_B release |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Clock Management | Integrated DCM and PLL in CMTs provide jitter reduction, phase shifting, and frequency synthesis without external components |
| PCIe Hard IP | Dedicated endpoint logic supporting x1/x2/x4 Gen1 PCIe links reduces RTL integration effort and ensures protocol compliance |
| SelectIO Technology | Per-pin I/O standard selection and programmable drive/slew enables mixed-voltage board design and signal integrity optimization |
| Multi-Gigabit Transceivers | Up to 3.75 Gb/s serial line rates support JESD204B ADC/DAC interfaces and high-speed backplane links |
| Partial Reconfiguration Support | Enables dynamic logic module swapping during operation - critical for adaptive radar waveform updates and protocol stack upgrades |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based air surveillance radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes matched filtering, CFAR detection, and beamformer coefficient updates; CMTs synchronize ADC sampling clocks and radar timing triggers. Use Value: 640 DSP48E slices enable simultaneous 128-channel Doppler FFTs; 12.5 Mb block RAM buffers full PRI intervals for clutter map generation. | Use Scenario: Multi-channel oscilloscope front-end capturing 1 GS/s per channel across 8 analog inputs. IC Role / Device Role / Timing Role: XC5VLX155-2FFG1153C aggregates parallel ADC outputs, performs real-time decimation and histogramming, and streams processed data over PCIe. Use Value: 640 user I/Os support 8×12-bit parallel ADC interfaces; PCIe hard IP delivers sustained 2 GB/s host transfer bandwidth. |
| Avionics Data Concentrators | Medical Imaging Beamforming |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B data aggregation in flight control computers. IC Role / Device Role / Timing Role: Implements protocol engines, time-triggered scheduling, and deterministic packet switching; CMTs maintain sub-microsecond timestamp accuracy. Use Value: Dual-register LUTs ensure deterministic latency for safety-critical message forwarding; SelectIO supports mixed 3.3 V/5 V legacy bus interfacing. | Use Scenario: Ultrasound system digital beamformer applying dynamic delays and apodization across 256 transducer elements. IC Role / Device Role / Timing Role: Configurable logic computes delay profiles and applies FIR filtering per channel; DSP48E slices execute 256×256 matrix-vector multiplication in <1 µs. Use Value: 155,328 logic cells accommodate full-channel beamformer + B-mode image processing pipeline; 1.25 GHz internal clock meets real-time latency budget. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 16.5 Gb/s transceivers, 2104-pin FC-BGA | Targets next-gen 5G massive MIMO and AI inference acceleration requiring higher throughput and lower latency | Choose when migrating to 16 nm process, needing >2× logic density or >4× transceiver speed; requires PCB redesign |
| XC7VX690T-2FFG1930I | Virtex-7 architecture, 693,120 logic cells, 13.1 Gb/s transceivers, 1930-pin FCBGA | Suitable for high-throughput video encoding and software-defined radio with wider memory bandwidth | Choose for mature 28 nm platform with larger block RAM (56.8 Mb) and higher I/O count (700); compatible thermal envelope but larger footprint |
Compared with XC5VLX155-2FFG1153C, the XCVU9P-2FLGA2104I offers significantly higher transceiver speed and logic density but demands new layout and toolchain migration, while the XC7VX690T-2FFG1930I extends the Virtex family with greater memory and I/O resources within a thermally similar industrial-grade package.
Availability
XC5VLX155-2FFG1153C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX155-2FFG1153C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU technologies for data center, AI, and embedded markets.
The Virtex-5 family was originally designed by Xilinx for high-performance logic-intensive applications demanding high-speed serial connectivity, large on-chip memory, and deterministic timing - especially in defense, aerospace, and test equipment.
FAQ
What is the maximum operating junction temperature for XC5VLX155-2FFG1153C?
The XC5VLX155-2FFG1153C has a maximum operating junction temperature of 100°C under industrial temperature grade (-2 speed grade, C suffix). This rating is validated per Xilinx DS100 specification and applies to continuous operation with adequate board-level thermal management meeting JEDEC JESD51-2 standards.
Does XC5VLX155-2FFG1153C support partial reconfiguration?
Yes, XC5VLX155-2FFG1153C supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated configuration logic. This capability enables runtime swapping of logic modules without resetting the entire device, which is used in adaptive radar waveform updates and protocol stack upgrades in deployed systems.
What configuration memory options are compatible with XC5VLX155-2FFG1153C?
XC5VLX155-2FFG1153C supports configuration from SPI serial flash (e.g., Micron MT25QL series), parallel NOR flash (e.g., Spansion S29GL series), or host processor via SelectMAP interface. Configuration bitstream size is approximately 12.8 MB for full device programming in compressed mode.
Is XC5VLX155-2FFG1153C RoHS compliant?
Yes, XC5VLX155-2FFG1153C is RoHS compliant and Pb-free per Xilinx documentation DS100 and packaging specification FFG1153. The package uses matte tin finish on solder balls and meets EU Directive 2011/65/EU requirements without exemptions.
What is the I/O voltage range supported by XC5VLX155-2FFG1153C banks?
XC5VLX155-2FFG1153C supports bank-specific I/O voltages ranging from 1.2 V to 3.3 V, including 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V. Each I/O bank is independently configurable, enabling mixed-voltage interfaces such as DDR2 memory (1.8 V) alongside legacy peripherals (3.3 V) on the same device.
XC5VLX155-2FFG1153C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1153-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12160
- Number of Logic Elements/Cells:
- 155648
- Total RAM Bits:
- 7077888
- Number of I/O:
- 800
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1153-FCBGA (35x35)
XC5VLX155-2FFG1153C FAQ
1.How can I place an order for XC5VLX155-2FFG1153C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX155-2FFG1153C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX155-2FFG1153C reliable?
The price and inventory of XC5VLX155-2FFG1153C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX155-2FFG1153C is usually 5 days.
3.What payment methods are accepted for XC5VLX155-2FFG1153C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX155-2FFG1153C transactions.
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XC5VLX155-2FFG1153C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX155-2FFG1153C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX155-2FFG1153C?
For technical support, including XC5VLX155-2FFG1153C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX155-2FFG1153C requirements.
6.How does Aetrix verify that XC5VLX155-2FFG1153C is sourced from the original manufacturer or authorized distributors?
All XC5VLX155-2FFG1153C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX155-2FFG1153C meets industry standards.
7.What is the process for return or replacement of XC5VLX155-2FFG1153C?
All XC5VLX155-2FFG1153C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX155-2FFG1153C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX155-2FFG1153C part is unused and in its original packaging.
Return procedure for XC5VLX155-2FFG1153C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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