AMD XC5VLX155-2FFG1760C

Overview

XC5VLX155-2FFG1760C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 155,328 logic cells, 12.8 Gb/s serial transceiver bandwidth, and -2 speed grade in a 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It serves as a high-performance reconfigurable fabric for protocol bridging in 10G Ethernet line cards.

For engineers reviewing the XC5VLX155-2FFG1760C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance with IEEE 802.3ae, embedded Block RAM depth of 18 Kb per block, and support for DDR2 SDRAM interfaces up to 400 MHz.

Technical Context

The XC5VLX155-2FFG1760C implements a column-based architecture with dedicated DSP48E slices for arithmetic-intensive tasks and integrated PCI Express® v1.1 endpoints. Its clock management tiles include dual DCMs and PLLs supporting phase alignment across multiple I/O banks.

This device supports SelectIO™ standards including LVDS, SSTL-18, and HSTL Class I/II, with programmable slew rate and drive strength per bank. I/O voltage ranges are configurable from 1.2 V to 3.3 V, enabling direct interfacing with legacy and modern peripherals.

Key Specifications

Pinout & Package

XC5VLX155-2FFG1760C is housed in a 1760-ball Flip-Chip Fine-Pitch BGA (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC5VLX155-2FFG1760C, the XC5VLX330-2FFG1760C provides scalable logic headroom within identical mechanical and thermal constraints, while the XC6VLX240T-2FFG1156C delivers architectural upgrades at the cost of board redesign and revised thermal management.

Availability

XC5VLX155-2FFG1760C is available at Aetrix Electronics and suitable for 10G networking infrastructure, medical imaging systems, and avionics data concentrators requiring stable component supply over extended production lifecycles.

Supply support for XC5VLX155-2FFG1760C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex-5 family was engineered for high-bandwidth, low-latency system integration in wired infrastructure and real-time signal processing applications where deterministic timing and multi-standard I/O flexibility are critical.

FAQ

What is the maximum supported data rate for GTPE2 transceivers in XC5VLX155-2FFG1760C?

The XC5VLX155-2FFG1760C supports GTPE2 transceivers rated up to 12.8 Gb/s per channel. This rating applies under specified operating conditions: junction temperature ≤85°C, VCCAUX = 2.5 V ±3%, and proper reference clock jitter compliance per UG192. The XC5VLX155-2FFG1760C achieves this rate using adaptive equalization and continuous-time linear equalization (CTLE) within each transceiver block.

Does XC5VLX155-2FFG1760C support DDR2 SDRAM interfaces at 400 MHz?

Yes, XC5VLX155-2FFG1760C supports DDR2 SDRAM interfaces up to 400 MHz clock frequency using its dedicated source-synchronous I/O logic and IDELAY2/ODDR2 primitives. This capability is verified in Xilinx UG191 for Bank 0 and Bank 1 configured with SSTL-18 I/O standard and VCCO = 1.8 V. The XC5VLX155-2FFG1760C meets setup/hold timing margins per JEDEC specification under worst-case PVT corners.

How many DCMs and PLLs are available in XC5VLX155-2FFG1760C?

The XC5VLX155-2FFG1760C integrates 16 Digital Clock Managers (DCMs) and 8 Phase-Locked Loops (PLLS). These are distributed across eight clock regions, with two DCMs and one PLL per region. Each DCM supports frequency synthesis, phase shifting, and duty cycle correction, while PLLs provide wider multiplication ranges and lower jitter for high-speed transceiver clocks. All clock resources are accessible to the XC5VLX155-2FFG1760C fabric via dedicated routing networks.

Is partial reconfiguration supported on XC5VLX155-2FFG1760C?

Yes, XC5VLX155-2FFG1760C supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated frame-based bitstream loading mechanism. This allows dynamic replacement of designated logic modules without resetting the entire device. The XC5VLX155-2FFG1760C requires use of Xilinx PlanAhead or Vivado tools (legacy support) and adherence to floorplanning rules defined in UG204 to ensure safe module boundaries and routing isolation.

What thermal management considerations apply to XC5VLX155-2FFG1760C in continuous operation?

XC5VLX155-2FFG1760C requires a thermal solution capable of maintaining junction temperature ≤100°C under full utilization. Its FFG1760 package includes an integrated heat spreader; recommended PCB layout uses ≥6 thermal vias per power ball and 2 oz copper planes on inner layers. Thermal simulation data in Xilinx AR# 32741 confirms that with 2.5 W dynamic power and 0.8 W static power, a 15°C/W heatsink achieves safe operation at 70°C ambient. The XC5VLX155-2FFG1760C thermal specifications are validated per JESD51-2A.