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AMD XC5VLX155-3FF1153C
- Part No.:
- XC5VLX155-3FF1153C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1153-BBGA, FCBGA
- Datasheet:
-
XC5VLX155-3FF1153C.pdf
- Description:
- IC FPGA 800 I/O 1153FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,543
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Product details
Overview
XC5VLX155-3FF1153C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 155,328 logic cells, 12.5 Mb of block RAM, and 640 DSP48E slices. It uses a 65 nm copper process, supports -3 speed grade (fastest commercial grade), and is packaged in a 1153-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1153) for high-density board designs in telecom infrastructure.
For engineers reviewing the XC5VLX155-3FF1153C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), differential signaling support (LVDS, RSDS, BLVDS), multi-gigabit transceiver capability (up to 3.75 Gb/s), and configuration interface options (Master SelectMAP, Slave Serial, JTAG).
Technical Context
The XC5VLX155-3FF1153C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and integrated memory controllers. It supports PCI Express® Gen1 x8, Serial RapidIO®, and 10 Gigabit Ethernet MAC interfaces via hard IP blocks and programmable fabric.
Configuration is performed via internal Spartan-3A FPGA or external PROM/Flash using 3.3 V or 1.8 V I/O banks. The device includes SelectIO™ technology with programmable slew rate, drive strength, and on-chip termination for signal integrity across multiple voltage standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 155,328 - determines maximum combinational and sequential logic capacity for complex digital systems |
| Block RAM | 12.5 Mb - enables large on-chip data buffering and FIFO implementation without external memory |
| DSP Slices | 640 × DSP48E - supports parallel multiply-accumulate operations at up to 550 MHz for signal processing |
| User I/O Pins | 720 - provides high interconnect density for multi-protocol interface consolidation |
| Transceiver Speed | Up to 3.75 Gb/s - enables serial protocols including SATA, PCIe Gen1, and SRIO |
| Speed Grade | -3 - guarantees timing closure at highest commercial performance level for critical paths |
| I/O Standards | LVCMOS, LVTTL, LVDS, RSDS, BLVDS, HSTL - ensures compatibility with diverse peripheral voltage domains |
Pinout & Package
XC5VLX155-3FF1153C is housed in a 1153-pin Flip-Chip Fine-Pitch BGA (FFG1153) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SelectMAP mode |
| DIN | Configuration Data Input | Serial data input for Slave Serial and JTAG configuration modes |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration memory readiness |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot |
| M0–M2 | Mode Selection Inputs | Three-pin encoding selects one of eight configuration modes (e.g., Master SelectMAP, Slave Parallel) |
| GTX_CLK0_M2C_P/N | Differential Transceiver Reference Clock | Provides low-jitter clock source for multi-gigabit transceivers in MGT bank |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Clock Management | Four DCMs and two PLLs per device enable precise clock synthesis, phase alignment, and jitter reduction across multiple domains |
| Integrated Memory Controller | Hard-core DDR2/DDR3 controller supports up to 400 MHz operation with 128-bit data bus width |
| SelectIO Technology | Per-pin I/O standard assignment, programmable drive strength (2–24 mA), and on-die termination (25–150 Ω) simplify PCB routing |
| PCIe Hard IP Block | Dedicated Gen1 x1/x2/x4/x8 endpoint logic reduces RTL integration effort and guarantees compliance |
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reconfiguration, reducing system downtime |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding for LTE-A and 5G NR physical layer processing. IC Role / Device Role / Timing Role: Programmable baseband processor implementing FFT, FIR, and turbo decoding pipelines with deterministic latency. Use Value: 640 DSP48E slices deliver >2.1 TMAC/s throughput at 250 MHz, enabling real-time Layer 1 processing within single device. | Use Scenario: High-precision waveform generation and analysis in automated test systems for semiconductor validation. IC Role / Device Role / Timing Role: Timing and pattern generator core synchronizing multi-channel DAC/ADC subsystems with sub-nanosecond skew control. Use Value: 720 user I/Os and LVDS-capable banks support 128+ simultaneous high-speed digital channels with matched trace routing. |
| Avionics Data Concentrators | Medical Imaging Back-End Processors |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control data networks. IC Role / Device Role / Timing Role: Protocol translation and time-triggered switching fabric with deterministic packet scheduling. Use Value: Dual PLLs and DCMs maintain <±50 ps jitter across 12 independent clock domains for safety-critical timing compliance. | Use Scenario: Real-time image reconstruction pipeline for CT and MRI scanners requiring high-throughput pixel data flow. IC Role / Device Role / Timing Role: High-bandwidth memory controller interfacing to DDR3 SDRAM and PCIe Gen1 host interface for raw data ingestion. Use Value: 12.5 Mb block RAM buffers full 512×512×16-bit sinogram frames, eliminating external frame memory bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 48.5 Mb BRAM, higher transceiver speed (16.3 Gb/s), but larger FFG2104 package | Targets next-gen 100G+ optical transport and AI inference acceleration where XC5VLX155-3FF1153C lacks sufficient bandwidth | Choose when migrating legacy Virtex-5 designs to higher throughput, accepting larger footprint and higher power |
| XC7VX485T-2FFG1157I | Virtex-7 architecture, 485,760 logic cells, 36.9 Mb BRAM, PCIe Gen2 x8 support, same 1153-ball FFG1157 footprint but different pin mapping | Suitable for upgrades requiring higher logic density and Gen2 PCIe while retaining similar board area constraints | Prefer for new designs needing >3× logic capacity and Gen2 compliance; requires PCB redesign due to non-pin-compatible pinout |
Compared with XC5VLX155-3FF1153C, the XCVU9P offers vastly greater bandwidth and logic scale but demands new thermal and power delivery design, while the XC7VX485T delivers Gen2 PCIe and higher density in a similarly sized package-yet mandates layout revision due to incompatible pin assignment.
Availability
XC5VLX155-3FF1153C is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply throughout extended product lifecycles.
Supply support for XC5VLX155-3FF1153C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family for high-performance computing and adaptive hardware applications.
The Virtex-5 family was designed for demanding signal processing, high-speed connectivity, and embedded vision applications requiring balanced logic, memory, and DSP resources in a single programmable platform.
FAQ
What is the maximum operating frequency of the XC5VLX155-3FF1153C?
The XC5VLX155-3FF1153C is rated for a -3 speed grade, guaranteeing timing closure up to 550 MHz for internal logic paths and 375 MHz for I/O registers under commercial temperature conditions. Actual achievable frequency depends on design complexity, routing congestion, and clock domain partitioning. The device's DCMs and PLLs support output frequencies up to 1.2 GHz with jitter specifications defined in DS100.
Does the XC5VLX155-3FF1153C support JTAG boundary-scan testing?
Yes, the XC5VLX155-3FF1153C fully supports IEEE 1149.1 JTAG boundary-scan for device-level verification and board-level interconnect testing. TDI, TDO, TMS, and TCK pins are dedicated and electrically isolated during configuration. JTAG is used for programming, debugging, and post-configuration diagnostics of the XC5VLX155-3FF1153C.
Can the XC5VLX155-3FF1153C be configured via SPI flash memory?
No, the XC5VLX155-3FF1153C does not support native SPI flash configuration. It requires parallel NOR flash (Master SelectMAP mode) or serial PROM (Slave Serial mode) with specific timing and voltage requirements. Configuration via SPI flash would require an external microcontroller or CPLD to translate SPI commands into the XC5VLX155-3FF1153C's supported interface protocol.
What thermal management considerations apply to the XC5VLX155-3FF1153C?
The XC5VLX155-3FF1153C has a maximum junction temperature of 100°C and requires active cooling in high-utilization scenarios. Its FFG1153 package includes a thermal lid; recommended PCB layout uses ≥6 thermal vias per power ball and 2 oz copper planes. Thermal simulation per UG193 shows 4.2 W typical power dissipation at 75% resource utilization with -3 speed grade timing.
Is partial reconfiguration supported on the XC5VLX155-3FF1153C?
Yes, the XC5VLX155-3FF1153C supports partial reconfiguration through the ICAP (Internal Configuration Access Port) and dedicated PR boundary logic. This allows runtime swapping of functional modules without resetting the entire device. Implementation requires Xilinx ISE 14.7 or later tools and adherence to floorplanning constraints defined in XAPP290 and XAPP1182 for the XC5VLX155-3FF1153C.
XC5VLX155-3FF1153C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1153-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12160
- Number of Logic Elements/Cells:
- 155648
- Total RAM Bits:
- 7077888
- Number of I/O:
- 800
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1153-FCBGA (35x35)
XC5VLX155-3FF1153C FAQ
1.How can I place an order for XC5VLX155-3FF1153C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX155-3FF1153C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX155-3FF1153C reliable?
The price and inventory of XC5VLX155-3FF1153C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX155-3FF1153C is usually 5 days.
3.What payment methods are accepted for XC5VLX155-3FF1153C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX155-3FF1153C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX155-3FF1153C?
XC5VLX155-3FF1153C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX155-3FF1153C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX155-3FF1153C?
For technical support, including XC5VLX155-3FF1153C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX155-3FF1153C requirements.
6.How does Aetrix verify that XC5VLX155-3FF1153C is sourced from the original manufacturer or authorized distributors?
All XC5VLX155-3FF1153C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX155-3FF1153C meets industry standards.
7.What is the process for return or replacement of XC5VLX155-3FF1153C?
All XC5VLX155-3FF1153C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX155-3FF1153C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX155-3FF1153C part is unused and in its original packaging.
Return procedure for XC5VLX155-3FF1153C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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