AMD XC5VLX155-3FFG1153C
- Part No.:
- XC5VLX155-3FFG1153C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1153-BBGA, FCBGA
- Datasheet:
-
XC5VLX155-3FFG1153C.pdf
- Description:
- IC FPGA 800 I/O 1153FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,044
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VLX155-3FFG1153C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 155,328 logic cells, 12.5 Mb of block RAM, 640 DSP48E slices, and operates at -3 speed grade with guaranteed 500 MHz system clock performance in the FFG1153 flip-chip BGA package. It targets high-bandwidth digital signal processing in radar baseband processing systems.
For engineers reviewing the XC5VLX155-3FFG1153C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), differential signaling compliance (LVDS, RSDS, BLVDS), and transceiver line rates up to 3.75 Gbps.
Technical Context
The XC5VLX155-3FFG1153C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for arithmetic-intensive tasks, and integrated SelectIO technology supporting single-ended and differential standards. Its clocking system includes 32 DCMs and 16 PLLs for precise clock synthesis and phase alignment.
It integrates 24 RocketIO GTP transceivers operating at 100 Mbps to 3.75 Gbps per lane, compliant with PCIe Gen1, SATA, and Serial RapidIO protocols. The device supports partial reconfiguration and uses 65 nm copper process technology with 1.0 V core voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 155,328 - total programmable LUT/flip-flop pairs for complex logic implementation |
| Block RAM | 12.5 Mb - distributed memory capacity usable as FIFOs, buffers, or lookup tables |
| DSP Slices | 640 DSP48E - hardwired multiply-accumulate units enabling real-time filtering and FFT |
| Transceivers | 24 GTP - serial I/O lanes supporting 100 Mbps–3.75 Gbps with embedded encoding/decoding |
| I/O Standards | LVDS, RSDS, BLVDS, SSTL, HSTL - supports mixed-voltage board interfaces up to 3.3 V |
| Speed Grade | -3 - guarantees timing closure at 500 MHz system clock under worst-case conditions |
| Package | FFG1153 - 1153-pin flip-chip BGA with 1.0 mm pitch, thermal lid, and 35×35 mm footprint |
Pinout & Package
XC5VLX155-3FFG1153C is housed in a 1153-pin flip-chip fine-pitch BGA (FFG1153) with thermal lid, 1.0 mm ball pitch, and 35×35 mm body size. Pin functions are organized into banks with independent VCCO and VREF per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, clock management, and JTAG interface |
| VCCO | I/O bank power | 1.2 V–3.3 V selectable per bank; sets output swing and input threshold |
| VRP/VRN | Reference voltage inputs | Provide termination reference for differential standards like LVDS within each I/O bank |
| CLK_IN | Dedicated clock input | Low-skew global routing path to DCM/PLL; supports single-ended or differential clocks |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness or error |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset-critical for adaptive radar waveform updates |
| Integrated PCIe Endpoint Logic | Hard IP for PCIe Gen1 x1/x2/x4 reduces soft-core overhead and ensures protocol compliance |
| Multi-Standard SelectIO | Single I/O pin supports LVDS, SSTL, HSTL, and others via configuration-reduces PCB layer count |
| DCM + PLL Clock Management | 32 DCMs and 16 PLLs allow independent clock domain generation and jitter reduction across subsystems |
| 65 nm Low-Power Process | Reduces dynamic and static power vs. 90 nm predecessors-enables higher density without thermal throttling |
Applications
| Radar Baseband Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler signal conditioning and beamforming in ground-based radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FIR filters and FFT engines; GTP transceivers stream ADC data from RF front-end. Use Value: 640 DSP48E slices enable >200 GMAC/s compute density for simultaneous multi-target tracking. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanner backends. IC Role / Device Role / Timing Role: Configurable logic processes raw k-space data; block RAM buffers multi-gigabyte datasets between acquisition and GPU transfer. Use Value: 12.5 Mb on-chip RAM eliminates external DDR latency bottlenecks during iterative reconstruction. |
| High-Speed Test Equipment | Avionics Data Concentrator |
Use Scenario: Protocol-aware bit-error-rate testing of 3 Gbps serial links in production test fixtures. IC Role / Device Role / Timing Role: GTP transceivers act as physical-layer loopback and pattern generator; DSP slices perform real-time error analysis. Use Value: Native 3.75 Gbps transceiver rate supports margin testing beyond SATA II and PCIe Gen1 spec limits. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data aggregation in flight control computers. IC Role / Device Role / Timing Role: Soft-core processor manages deterministic packet scheduling; I/O banks interface to multiple legacy avionics buses. Use Value: Mixed-voltage I/O (1.5 V/1.8 V/2.5 V/3.3 V) enables direct connection to diverse sensor and actuator modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 48.5 Mb BRAM, 64 GTY transceivers (up to 32.75 Gbps) | Targets next-gen 5G and AI inference where XC5VLX155-3FFG1153C lacks native AI engine or PAM4 support | Select when migrating from Virtex-5 for higher bandwidth, lower latency, or advanced SerDes requirements |
| XC6VLX240T-3FFG1156C | Virtex-6 family, 240,000 logic cells, 15.5 Mb BRAM, 32 GTP transceivers (same 3.75 Gbps max) | Offers larger logic capacity and improved power efficiency over XC5VLX155-3FFG1153C while retaining pin-compatible footprint with FFG1156 | Choose for design refreshes requiring more resources without changing PCB layout |
Compared with XC5VLX155-3FFG1153C, the XC6VLX240T-3FFG1156C delivers 55% more logic and 8% higher transceiver count in a mechanically similar package, whereas the XCVU9P-2FLGA2104I shifts to a new architecture with 10× higher SerDes bandwidth but requires full RTL and board redesign.
Availability
XC5VLX155-3FFG1153C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend acceleration, and avionics data concentration requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX155-3FFG1153C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Virtex-5 family was designed for high-performance logic, DSP, and serial connectivity in aerospace, defense, and wired communications infrastructure.
FAQ
What is the maximum guaranteed operating frequency of the XC5VLX155-3FFG1153C?
The XC5VLX155-3FFG1153C carries a -3 speed grade rating, guaranteeing full functionality at 500 MHz system clock frequency under worst-case voltage and temperature conditions. This applies to internal logic paths and synchronous elements as verified by Xilinx timing analysis tools using the provided speed files for the FFG1153 package.
Does the XC5VLX155-3FFG1153C support PCI Express Gen1 endpoints?
Yes, the XC5VLX155-3FFG1153C includes hard IP blocks for PCI Express Gen1 endpoint functionality, supporting x1, x2, and x4 link widths. These blocks are implemented in dedicated silicon and require no LUT resources, ensuring deterministic latency and full compliance with PCIe Base Specification 1.1.
What I/O standards are supported by the XC5VLX155-3FFG1153C?
The XC5VLX155-3FFG1153C supports LVDS, RSDS, BLVDS, SSTL-18/25, HSTL-I/II, and single-ended LVTTL/LVCMOS across its 640 user I/O pins. Each of the 20 I/O banks can be independently configured for different VCCO voltages (1.2 V to 3.3 V) and referenced standards.
Is partial reconfiguration supported on the XC5VLX155-3FFG1153C?
Yes, the XC5VLX155-3FFG1153C supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and frame-based bitstream loading. This allows dynamic replacement of logic modules without resetting the entire device, a capability used in adaptive radar and software-defined radio applications.
What is the block RAM capacity of the XC5VLX155-3FFG1153C?
The XC5VLX155-3FFG1153C provides 12.5 Mb of total block RAM, composed of 512 dual-port 36 Kb RAMB36 blocks. These can be configured as 36 Kb single-port, 18 Kb dual-port, or smaller partitions, and support byte-write enable and parity generation.
XC5VLX155-3FFG1153C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1153-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12160
- Number of Logic Elements/Cells:
- 155648
- Total RAM Bits:
- 7077888
- Number of I/O:
- 800
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1153-FCBGA (35x35)
XC5VLX155-3FFG1153C FAQ
1.How can I place an order for XC5VLX155-3FFG1153C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX155-3FFG1153C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX155-3FFG1153C reliable?
The price and inventory of XC5VLX155-3FFG1153C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX155-3FFG1153C is usually 5 days.
3.What payment methods are accepted for XC5VLX155-3FFG1153C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX155-3FFG1153C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX155-3FFG1153C?
XC5VLX155-3FFG1153C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX155-3FFG1153C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX155-3FFG1153C?
For technical support, including XC5VLX155-3FFG1153C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX155-3FFG1153C requirements.
6.How does Aetrix verify that XC5VLX155-3FFG1153C is sourced from the original manufacturer or authorized distributors?
All XC5VLX155-3FFG1153C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX155-3FFG1153C meets industry standards.
7.What is the process for return or replacement of XC5VLX155-3FFG1153C?
All XC5VLX155-3FFG1153C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX155-3FFG1153C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX155-3FFG1153C part is unused and in its original packaging.
Return procedure for XC5VLX155-3FFG1153C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VLX155-3FFG1153C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

