AMD XC5VLX155T-1FFG1738C
- Part No.:
- XC5VLX155T-1FFG1738C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1738-BBGA, FCBGA
- Datasheet:
-
XC5VLX155T-1FFG1738C.pdf
- Description:
- IC FPGA 680 I/O 1738FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VLX155T-1FFG1738C from AMD (formerly Xilinx) is a high-performance Virtex-5 FPGA featuring 155,328 logic cells, 12.5 Mb of block RAM, and 640 DSP48E slices. It supports PCIe Gen1 x8, DDR2-533 memory interfaces, and operates at -1 speed grade with 1.0V core voltage. It is used in high-bandwidth digital signal processing systems such as radar beamforming and multi-channel software-defined radio.
For engineers reviewing the XC5VLX155T-1FFG1738C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), transceiver capability (no integrated transceivers), thermal design for FFG1738 package, and compatibility with ISE 14.7 toolchain.
Technical Context
The XC5VLX155T-1FFG1738C implements a column-based architecture with configurable logic blocks (CLBs), dedicated DSP slices, and hierarchical clock networks. It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling up to 1.25 Gbps per I/O pair.
It lacks built-in multi-gigabit transceivers (MGTs), distinguishing it from the LX155T-1FFG1738I variant with transceivers. Configuration is performed via Master SelectMAP or JTAG using external PROM or processor-controlled interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 155,328 - determines maximum combinational/sequential logic capacity for complex state machines or pipeline stages |
| Block RAM | 12.5 Mb - enables large on-chip data buffering for FFT, filtering, or frame storage without external memory |
| DSP Slices | 640 × DSP48E - supports parallel multiply-accumulate operations at up to 550 MHz for real-time signal processing |
| User I/O Pins | 720 - provides high-density parallel interface support for ADC/DAC banks, memory controllers, or backplane connectivity |
| Speed Grade | -1 - guarantees timing closure at 1.0V core supply with specified maximum operating frequencies for CLB and I/O paths |
| Package | FFG1738 - 1738-pin flip-chip BGA, 35×35 mm, 1.0 mm pitch, requiring controlled-impedance PCB stackup and thermal vias |
Pinout & Package
XC5VLX155T-1FFG1738C is housed in a 1738-pin flip-chip BGA (FFG1738) package with 720 user-configurable I/Os distributed across 16 banks. Power delivery includes dedicated VCCINT, VCCAUX, VCCO, and VREF pins per bank; configuration pins (INIT_B, PROGRAM_B, CCLK, DIN) are located on Bank 0 and Bank 16.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SelectMAP mode; requires clean 50 MHz source |
| DIN | Configuration Data Input | Serial data input for bitstream loading; synchronous to CCLK edge |
| PROGRAM_B | Active-Low Configuration Reset | Forces reinitialization of configuration logic and clears current bitstream |
| INIT_B | Configuration Status Output | Open-drain indicator asserting low during configuration, high when complete and valid |
| VCCINT | Core Power Supply | 1.0V ±3% supply for CLBs, interconnect, and DSP slices; requires low-noise regulation |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Clock Management | Eight DCMs per device provide phase-matched clock synthesis, frequency synthesis, and jitter reduction for synchronous subsystems |
| SelectIO Technology | Supports 21 I/O standards including SSTL18_I, HSTL_I, and LVDS with programmable drive strength and slew rate control |
| Embedded Memory | 12.5 Mb total block RAM organized as 36 Kb dual-port RAM primitives, enabling true dual-clock FIFOs and memory-mapped peripherals |
| DSP48E Slice | 640 slices each integrate 25×18 multiplier, 48-bit accumulator, and pipeline registers for deterministic 1-cycle MAC operations |
| Partial Reconfiguration Support | Enables dynamic module swapping in runtime without full device reset, reducing system downtime in mission-critical applications |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical beamforming, matched filtering, and range-Doppler FFT pipelines with deterministic latency. Use Value: 640 DSP48E slices enable concurrent 128-channel FFTs at 100 MHz clock, eliminating need for external DSP processors. | Use Scenario: High-throughput ultrasound beamforming and CT image reconstruction in portable diagnostic equipment. IC Role / Device Role / Timing Role: Configurable logic manages parallel ADC acquisition, FIR filtering, and DICOM-compliant image compression pipelines. Use Value: 720 user I/Os support simultaneous connection to 32-channel ADC arrays and DDR2-533 memory for real-time pixel buffering. |
| Industrial Machine Vision | Avionics Data Concentrator |
Use Scenario: Sub-millisecond defect detection on high-speed production lines using multi-camera synchronized capture. IC Role / Device Role / Timing Role: FPGA implements precise inter-camera trigger synchronization, pixel-level morphological processing, and GigE Vision packet assembly. Use Value: 12.5 Mb block RAM buffers full-frame 12-bit images from four 2K×2K sensors before compression and transmission. | Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation with Ethernet/IP bridging in flight control computers. IC Role / Device Role / Timing Role: Logic fabric handles protocol translation, message scheduling, and CRC validation across mixed legacy and modern avionics buses. Use Value: SelectIO flexibility allows direct interfacing to 3.3V ARINC receivers and 5V MIL-STD-1553 transceivers within same I/O bank. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density logic and DSP-intensive applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX330T-1FFG1738C | Higher logic density (330,976 LUTs), same package and I/O count, but larger die area and higher static power | Used where additional logic resources are required for multi-function integration (e.g., embedded soft-core + signal processing) | Choose when XC5VLX155T-1FFG1738C resource utilization exceeds 85% in critical paths |
| XC6VLX240T-1FFG1156C | Virtex-6 generation with enhanced DSP48E1 slices, lower static power, and 1156-pin FFG1156 package (smaller footprint) | Preferred for new designs targeting longer lifecycle, improved power efficiency, and PCIe Gen2 support | Choose for greenfield projects requiring roadmap continuity beyond Virtex-5 end-of-life |
Compared with XC5VLX155T-1FFG1738C, the XC5VLX330T offers headroom for logic expansion but increases thermal load, while the XC6VLX240T delivers architectural improvements and smaller package at the cost of toolchain migration and revalidation effort.
Availability
XC5VLX155T-1FFG1738C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and industrial machine vision applications requiring stable component supply throughout extended product lifecycles.
Supply support for XC5VLX155T-1FFG1738C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Virtex-5 family was designed for high-performance logic, DSP, and connectivity applications in aerospace, defense, and medical imaging systems where deterministic timing and large on-chip memory are critical.
FAQ
What is the maximum supported memory interface speed for XC5VLX155T-1FFG1738C?
The XC5VLX155T-1FFG1738C supports DDR2-533 memory interfaces with 275 MHz clock frequency. Its I/O banks are configured for SSTL18_I standard, enabling reliable 533 Mbps data rates per pin. The FPGA's memory controller IP supports single-ended and differential address/control signals, and timing closure is validated up to 275 MHz under -1 speed grade conditions. XC5VLX155T-1FFG1738C does not support DDR3 or LPDDR interfaces.
Does XC5VLX155T-1FFG1738C include integrated multi-gigabit transceivers?
No, XC5VLX155T-1FFG1738C does not include integrated multi-gigabit transceivers. It belongs to the LX (Logic) subfamily of Virtex-5, which omits MGTs to reduce cost and power. High-speed serial connectivity must be implemented externally using discrete transceivers or parallel I/O with source-synchronous timing. This distinguishes XC5VLX155T-1FFG1738C from the SX (Signal Processing) or FX (Fusion + Transceivers) variants in the same generation.
Which Xilinx ISE version fully supports XC5VLX155T-1FFG1738C design flow and timing analysis?
XC5VLX155T-1FFG1738C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, and static timing analysis. Earlier versions (e.g., ISE 13.4) support basic functionality but lack updated speed files for -1 speed grade corner cases. ISE 14.7 includes verified device models, constraint templates, and bitstream generation compatible with XC5VLX155T-1FFG1738C FFG1738 package routing rules.
What thermal management considerations apply to XC5VLX155T-1FFG1738C in continuous operation?
XC5VLX155T-1FFG1738C requires active thermal management due to its 1738-pin FFG1738 package and typical power dissipation of 8–12 W under full utilization. Recommended PCB layout includes ≥12 thermal vias under the die area, 2 oz copper planes for VCCINT and ground, and a heatsink with ≥15°C/W thermal resistance. Junction temperature must remain below 100°C per Xilinx DS100 specification. XC5VLX155T-1FFG1738C thermal data is validated for commercial temperature grade (0°C to 85°C ambient).
Can XC5VLX155T-1FFG1738C be configured via JTAG only, or are other methods supported?
XC5VLX155T-1FFG1738C supports multiple configuration modes: JTAG, Master SelectMAP, Slave SelectMAP, and Serial Peripheral Interface (SPI). JTAG is used for debugging and initial programming, while Master SelectMAP enables autonomous boot from external flash. The configuration mode is selected via MODE pins (M2:M0); XC5VLX155T-1FFG1738C does not require external microcontroller control when using Master SelectMAP with PROM.
XC5VLX155T-1FFG1738C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LXT
- Package/Case:
- 1738-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12160
- Number of Logic Elements/Cells:
- 155648
- Total RAM Bits:
- 7815168
- Number of I/O:
- 680
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1738-FCBGA (42.5x42.5)
XC5VLX155T-1FFG1738C FAQ
1.How can I place an order for XC5VLX155T-1FFG1738C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX155T-1FFG1738C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX155T-1FFG1738C reliable?
The price and inventory of XC5VLX155T-1FFG1738C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX155T-1FFG1738C is usually 5 days.
3.What payment methods are accepted for XC5VLX155T-1FFG1738C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX155T-1FFG1738C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX155T-1FFG1738C?
XC5VLX155T-1FFG1738C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX155T-1FFG1738C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX155T-1FFG1738C?
For technical support, including XC5VLX155T-1FFG1738C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX155T-1FFG1738C requirements.
6.How does Aetrix verify that XC5VLX155T-1FFG1738C is sourced from the original manufacturer or authorized distributors?
All XC5VLX155T-1FFG1738C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX155T-1FFG1738C meets industry standards.
7.What is the process for return or replacement of XC5VLX155T-1FFG1738C?
All XC5VLX155T-1FFG1738C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX155T-1FFG1738C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX155T-1FFG1738C part is unused and in its original packaging.
Return procedure for XC5VLX155T-1FFG1738C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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