AMD XC5VLX155T-1FFG1738I
- Part No.:
- XC5VLX155T-1FFG1738I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1738-BBGA, FCBGA
- Datasheet:
-
XC5VLX155T-1FFG1738I.pdf
- Description:
- IC FPGA 680 I/O 1738FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VLX155T-1FFG1738I from AMD (formerly Xilinx) is a high-performance Virtex-5 FPGA featuring 155,648 logic cells, 12.5 Mb of block RAM, 640 DSP48E slices, and support for PCIe Gen1/Gen2, DDR2/DDR3 memory interfaces. It is used in high-speed data processing, radar signal conditioning, and reconfigurable computing systems.
For engineers reviewing the XC5VLX155T-1FFG1738I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), speed grade (-1), thermal performance (industrial temperature range –40°C to +100°C), and FFG1738 flip-chip BGA package compatibility with high-density PCB routing.
Technical Context
The XC5VLX155T-1FFG1738I implements a column-based architecture with dedicated routing for clock, reset, and control signals. It integrates SelectIO technology supporting LVDS, SSTL, HSTL, and differential signaling standards up to 1.25 Gbps per I/O pair.
Its embedded PowerPC 440 hard processor cores are not present in this LX family variant; instead, it delivers deterministic timing via hierarchical clock networks with 32 global clock buffers and 16 regional clock buffers, enabling sub-nanosecond skew across large designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 155,648 - total configurable logic resources for LUT-based combinatorial and sequential logic implementation |
| Block RAM | 12.5 Mb - distributed as 512 × 36 Kb blocks, supporting true dual-port operation and FIFO functionality |
| DSP Slices | 640 × DSP48E - each performs 25×18 signed multiplication with 48-bit accumulator and pipeline registers |
| User I/O Pins | 720 - supports bank-selectable voltage standards (1.2 V to 3.3 V) and programmable slew rate |
| Speed Grade | -1 - guarantees timing closure at maximum operating frequencies defined in Xilinx DS106 for this device |
| Operating Temp | –40°C to +100°C - industrial temperature rating verified per Xilinx qualification standards |
| Package | FFG1738 - 1738-pin flip-chip BGA, 35 mm × 35 mm, 1.0 mm ball pitch, RoHS-compliant |
Pinout & Package
XC5VLX155T-1FFG1738I is housed in a 1738-ball flip-chip BGA (FFG1738) package with 720 user-configurable I/Os distributed across 16 I/O banks. Power delivery includes dedicated VCCINT, VCCAUX, VCCO, and VREF pins per bank, plus multiple ground and decoupling ball assignments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, JTAG, and certain I/O banks; tolerant of ±5% variation |
| VCCO | I/O bank power | Bank-specific voltage (1.2–3.3 V) setting output drive strength and interface standard compliance |
| VREF | Reference voltage | Provides termination reference for SSTL/HSTL inputs; must be stable and filtered per bank |
| CLK_IN | Dedicated clock input | Connects to global clock network via BUFG; supports single-ended or differential (LVDS/LVPECL) sources |
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Supports 21 I/O standards including LVDS, RSDS, and SSTL-2/3 with programmable drive strength and on-die termination |
| PCI Express Endpoint | Integrated hard IP blocks for x1/x2/x4/x8 PCIe Gen1/Gen2 endpoints with full link training and error reporting |
| Memory Interface Support | Hardened DDR2/DDR3 controller logic with DQS alignment, write leveling, and read-leveling calibration |
| Embedded Clock Management | Eight DCMs and four PLLs per device enable precise clock synthesis, phase shifting, and jitter reduction |
| Partial Reconfiguration | Enables dynamic module swapping without full device reconfiguration, reducing system downtime and latency |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler filtering in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel filter banks and FFT engines; clock networks synchronize ADC sampling and DAC reconstruction paths. Use Value: 640 DSP48E slices deliver >200 GOPS peak compute density; 720 I/Os route high-speed JESD204B links to ADC/DAC arrays. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners. IC Role / Device Role / Timing Role: Configurable logic implements back-projection, iterative reconstruction, and real-time motion correction algorithms. Use Value: 12.5 Mb block RAM enables multi-frame buffering; DDR3 controller supports 800 MHz memory interfaces for sustained 12.8 GB/s bandwidth. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control systems. IC Role / Device Role / Timing Role: Implements protocol engines, time-stamping, and deterministic packet switching with hardware-accelerated CRC and encryption. Use Value: Industrial temperature rating ensures reliability in uncontrolled avionics bays; SelectIO supports mixed-voltage legacy bus interfacing. | Use Scenario: Bit-error-rate testing and protocol validation for 10G Ethernet and Fibre Channel links. IC Role / Device Role / Timing Role: Generates and analyzes PRBS patterns, implements SerDes loopback, and monitors eye diagrams via integrated transceivers. Use Value: PCIe Gen2 endpoint enables host-controlled test sequencing; 720 I/Os support parallel multi-channel stimulus/response capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX330T-1FFG1738I | Higher logic capacity (330,000 LCs), same package and speed grade; larger die area and higher static/dynamic power | Suitable for larger algorithm partitions requiring more parallelism or deeper pipelines | Select when design exceeds XC5VLX155T-1FFG1738I resource utilization by >20% across LUTs, RAM, and DSPs |
| XCKU060-2FFVA1156I | Kintex UltraScale device with 443,200 logic cells, 28.1 Gb/s transceivers, and DDR4 support; different pinout and migration path | Targets next-generation systems needing higher serial bandwidth or DDR4 memory integration | Consider for new designs where long-term roadmap continuity and higher throughput justify redesign effort |
Compared with XC5VLX155T-1FFG1738I, the XC5VLX330T-1FFG1738I offers direct package compatibility and identical I/O structure but requires thermal and power delivery upgrades; the XCKU060-2FFVA1156I provides architectural evolution with superior transceiver performance and memory bandwidth but mandates PCB and firmware rework.
Availability
XC5VLX155T-1FFG1738I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and avionics data concentrator applications requiring stable component supply and long-term industrial temperature support.
Supply support for XC5VLX155T-1FFG1738I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, aerospace, and industrial markets.
The Virtex-5 family was designed for high-performance, high-bandwidth applications demanding deterministic timing, large logic capacity, and hardened interface blocks - particularly in defense, scientific instrumentation, and wired infrastructure.
FAQ
What is the maximum supported memory interface speed for XC5VLX155T-1FFG1738I?
The XC5VLX155T-1FFG1738I supports DDR2-800 and DDR3-1066 memory interfaces using its hardened memory controller logic. This enables sustained data rates up to 1066 MT/s with full calibration support including write leveling and read leveling, as specified in Xilinx UG190 and DS106 documentation for the Virtex-5 LX family.
Does XC5VLX155T-1FFG1738I include built-in transceivers for high-speed serial communication?
No, the XC5VLX155T-1FFG1738I belongs to the LX (Logic eXtended) subfamily and does not integrate multi-gigabit transceivers. High-speed serial connectivity must be implemented externally or via parallel I/O interfaces such as LVDS or SelectIO-based protocols. Transceiver capability is available only in Virtex-5 FX (embedded PowerPC + RocketIO) and SX (DSP-optimized) variants.
What configuration modes are supported by XC5VLX155T-1FFG1738I?
The XC5VLX155T-1FFG1738I supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. Configuration bitstreams can be loaded from external SPI flash, PROM, or host processor via parallel or serial interfaces, with fallback support enabled through dual-PROM schemes per Xilinx UG191.
Is XC5VLX155T-1FFG1738I qualified for automotive applications?
No, XC5VLX155T-1FFG1738I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure rate reporting, and extended reliability testing required for under-hood or safety-critical vehicle systems.
Can XC5VLX155T-1FFG1738I implement partial reconfiguration in the field?
Yes, XC5VLX155T-1FFG1738I supports hardware-accelerated partial reconfiguration using Xilinx PlanAhead and Vivado tools. This allows dynamic swapping of functional modules without resetting the entire device, enabling runtime adaptation in radar waveform generation or protocol translation applications.
XC5VLX155T-1FFG1738I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LXT
- Package/Case:
- 1738-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12160
- Number of Logic Elements/Cells:
- 155648
- Total RAM Bits:
- 7815168
- Number of I/O:
- 680
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1738-FCBGA (42.5x42.5)
XC5VLX155T-1FFG1738I FAQ
1.How can I place an order for XC5VLX155T-1FFG1738I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX155T-1FFG1738I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC5VLX155T-1FFG1738I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX155T-1FFG1738I is usually 5 days.
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5.How can I obtain technical support or documentation for XC5VLX155T-1FFG1738I?
For technical support, including XC5VLX155T-1FFG1738I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX155T-1FFG1738I requirements.
6.How does Aetrix verify that XC5VLX155T-1FFG1738I is sourced from the original manufacturer or authorized distributors?
All XC5VLX155T-1FFG1738I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX155T-1FFG1738I meets industry standards.
7.What is the process for return or replacement of XC5VLX155T-1FFG1738I?
All XC5VLX155T-1FFG1738I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX155T-1FFG1738I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX155T-1FFG1738I part is unused and in its original packaging.
Return procedure for XC5VLX155T-1FFG1738I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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