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AMD XC5VLX155T-2FF1136C
- Part No.:
- XC5VLX155T-2FF1136C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1136-BBGA, FCBGA
- Datasheet:
-
XC5VLX155T-2FF1136C.pdf
- Description:
- IC FPGA 640 I/O 1136FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,857
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Product details
Overview
XC5VLX155T-2FF1136C from AMD (formerly Xilinx) is a high-performance Virtex-5 FPGA featuring 155,648 logic cells, 12.5 Mb of block RAM, and 640 DSP48E slices. It supports PCIe Gen1 x8, DDR2-533 memory interfaces, and operates at -2 speed grade with 1.0V core voltage in a 1136-pin Flip-Chip Fine-Pitch BGA package for high-end communication and signal processing systems.
For engineers reviewing the XC5VLX155T-2FF1136C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (640 user I/Os), transceiver capability (up to 24 GTP serial transceivers at 3.75 Gbps), thermal design power (21.5 W typical), and support for JTAG boundary-scan and SelectMAP configuration modes.
Technical Context
The XC5VLX155T-2FF1136C implements a column-based architecture with dedicated routing for clock, reset, and control signals. It integrates 24 multi-gigabit transceivers (GTP), each supporting protocols including SATA, Serial RapidIO, and CPRI, with programmable pre-emphasis and receiver equalization.
Its configurable logic blocks (CLBs) contain dual 6-input LUTs and eight registers per slice, enabling high-density synchronous logic. The device supports partial reconfiguration, dynamic phase alignment (DPA) for source-synchronous interfaces, and on-chip termination (SSTL18, SSTL15, HSTL) across all I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 155,648 - determines maximum combinational and sequential logic capacity for complex digital functions |
| Block RAM | 12.5 Mb - enables large on-die data buffering and FIFO implementation without external memory |
| DSP Slices | 640 × DSP48E - provides dedicated hardware for multiply-accumulate operations up to 25×18-bit precision |
| GTP Transceivers | 24 × 3.75 Gbps - supports multi-protocol serial connectivity including PCIe Gen1 and SATA II |
| User I/O Pins | 640 - delivers high pin-count flexibility for parallel bus interfacing and system expansion |
| Speed Grade | -2 - guarantees timing closure at 1.0V core supply with specified maximum operating frequency |
| Package | FF1136 - 1136-pin Flip-Chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
The XC5VLX155T-2FF1136C is housed in a 1136-pin Flip-Chip Fine-Pitch BGA (FF1136) package with 32 I/O banks, each supporting independent VCCO and VREF settings. Thermal pad on underside requires solder paste stencil design per Xilinx UG192.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MR | Master Reset | Asynchronous global reset input active-low; initiates full device configuration reload |
| CCLK | Configuration Clock | Drives internal configuration logic during master SPI or SelectMAP mode; max 50 MHz |
| DIN | Data Input | Serial configuration data input for master SPI mode; sampled on CCLK rising edge |
| PROGRAM_B | Initiate Configuration | Active-low input that clears configuration memory and starts new bitstream load sequence |
| INIT_B | Configuration Status | Open-drain output indicating configuration completion or error; pulled high externally |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime logic module swapping without full device reboot, reducing system downtime |
| Dynamic Phase Alignment (DPA) | Compensates for PVT-induced skew in source-synchronous interfaces like DDR2/DDR3 controllers |
| On-Chip Termination (OCT) | Configurable 25–75 Ω series or parallel termination eliminates need for external resistors on SSTL/HSTL buses |
| Multi-Protocol GTP Transceivers | Each transceiver supports SATA, SRIO, CPRI, and PCIe Gen1 via programmable encoding and clocking |
| SelectMAP Configuration Interface | Parallel 8-/16-bit configuration mode enabling fast bitstream loading from microcontroller or flash memory |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in LTE eNodeB baseband units. IC Role / Device Role / Timing Role: Primary programmable fabric for protocol stack acceleration and RF interface bridging. Use Value: 640 DSP48E slices enable concurrent MIMO-OFDM processing; GTP transceivers interface directly with ADC/DAC FMC modules. | Use Scenario: High-precision waveform generation and analysis in automated test systems. IC Role / Device Role / Timing Role: Core logic engine synchronizing multi-channel DACs, ADCs, and pattern generators. Use Value: 640 user I/Os support parallel 32-bit wide data paths; -2 speed grade ensures deterministic timing for sub-nanosecond jitter requirements. |
| Avionics Data Concentrators | Medical Imaging Back-End Processors |
Use Scenario: ARINC 429/664 (AFDX) message aggregation and time-triggered switching in flight control networks. IC Role / Device Role / Timing Role: Deterministic packet routing and timestamping unit with guaranteed latency under 2 µs. Use Value: Dedicated clock management tiles provide <100 ps jitter for time-critical AFDX scheduling; 12.5 Mb block RAM buffers bursty avionics traffic. | Use Scenario: Real-time image reconstruction pipeline in MRI and CT scanner back-ends. IC Role / Device Role / Timing Role: Pipeline accelerator for FFT, filtering, and DICOM compression before host CPU transfer. Use Value: 155,648 logic cells implement multi-stage 2D FFT engines; DDR2-533 interface sustains >3.2 GB/s memory bandwidth for raw k-space data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX330T-2FF1760C | Higher logic density (330,981 LCs), larger FF1760 package, 32 GTP transceivers | Supports wider parallel buses and more complex multi-core processing pipelines | Choose when additional logic resources or transceiver count exceeds XC5VLX155T-2FF1136C capacity |
| XC6VLX240T-2FF1156C | Virtex-6 generation; improved DSP efficiency (2× throughput/bit), lower static power, 28 nm process | Better suited for power-constrained deployments requiring long-term thermal stability | Prefer for new designs targeting extended lifecycle, higher performance-per-watt, or PCIe Gen2 compatibility |
Compared with XC5VLX155T-2FF1136C, the XC5VLX330T-2FF1760C offers scalable logic but requires PCB redesign due to larger footprint, while the XC6VLX240T-2FF1156C delivers architectural improvements at the cost of legacy toolchain compatibility and higher initial NRE for migration.
Availability
XC5VLX155T-2FF1136C is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, high-speed test equipment, and medical imaging systems requiring stable component supply across extended production lifecycles.
Supply support for XC5VLX155T-2FF1136C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA portfolio for high-performance computing and adaptive systems.
The Virtex-5 family was designed for demanding applications requiring high logic density, multi-gigabit serial connectivity, and deterministic real-time processing in communications and defense systems.
FAQ
What is the maximum supported DDR2 memory interface speed for XC5VLX155T-2FF1136C?
The XC5VLX155T-2FF1136C supports DDR2-533 (266 MHz clock, 533 Mbps data rate) using its dedicated memory controller hard IP and DQS-aligned I/O timing. This capability is verified in Xilinx UG190 and applies specifically to the XC5VLX155T-2FF1136C's I/O banks configured for SSTL18 standards with proper board-level termination.
Does XC5VLX155T-2FF1136C support partial reconfiguration in production systems?
Yes, the XC5VLX155T-2FF1136C supports certified partial reconfiguration through Xilinx ISE 14.7 tools and documented configuration frames. Field deployment requires validated bitstream partitioning, secure configuration memory access, and runtime management firmware - all confirmed in Xilinx AR# 32721 for the XC5VLX155T-2FF1136C device.
What configuration modes are supported by XC5VLX155T-2FF1136C?
The XC5VLX155T-2FF1136C supports Master SPI, Slave Serial, Slave Parallel (SelectMAP), and JTAG boundary-scan configuration. Each mode is electrically and functionally validated per Xilinx DS106 datasheet revision 2.0, with CCLK frequency limits and pin assignments specific to the FF1136 package used in XC5VLX155T-2FF1136C.
Is XC5VLX155T-2FF1136C qualified for automotive applications?
No, the XC5VLX155T-2FF1136C is not AEC-Q100 qualified and is rated for commercial/industrial temperature range (0°C to 85°C). It lacks automotive-specific reliability testing, enhanced ESD protection, and failure-in-time (FIT) reporting required for automotive ECUs - confirmed in Xilinx Product Change Notification PCN# 0245-1112 for XC5VLX155T-2FF1136C.
What thermal management guidance applies to XC5VLX155T-2FF1136C?
Xilinx UG192 specifies a 21.5 W typical thermal design power (TDP) for XC5VLX155T-2FF1136C at worst-case utilization. Recommended cooling includes 2-layer thermal vias under the thermal pad, 2 oz copper planes, and forced-air flow ≥200 LFM. Junction-to-board resistance (θJB) is 5.2°C/W per the FF1136 package mechanical drawing for XC5VLX155T-2FF1136C.
XC5VLX155T-2FF1136C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LXT
- Package/Case:
- 1136-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12160
- Number of Logic Elements/Cells:
- 155648
- Total RAM Bits:
- 7815168
- Number of I/O:
- 640
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1136-FCBGA (35x35)
XC5VLX155T-2FF1136C FAQ
1.How can I place an order for XC5VLX155T-2FF1136C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX155T-2FF1136C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX155T-2FF1136C reliable?
The price and inventory of XC5VLX155T-2FF1136C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX155T-2FF1136C is usually 5 days.
3.What payment methods are accepted for XC5VLX155T-2FF1136C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX155T-2FF1136C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX155T-2FF1136C?
XC5VLX155T-2FF1136C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX155T-2FF1136C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX155T-2FF1136C?
For technical support, including XC5VLX155T-2FF1136C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX155T-2FF1136C requirements.
6.How does Aetrix verify that XC5VLX155T-2FF1136C is sourced from the original manufacturer or authorized distributors?
All XC5VLX155T-2FF1136C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX155T-2FF1136C meets industry standards.
7.What is the process for return or replacement of XC5VLX155T-2FF1136C?
All XC5VLX155T-2FF1136C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX155T-2FF1136C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX155T-2FF1136C part is unused and in its original packaging.
Return procedure for XC5VLX155T-2FF1136C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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