AMD XC5VLX155T-2FFG1136C

Overview

XC5VLX155T-2FFG1136C from AMD (formerly Xilinx) is a high-performance Virtex-5 FPGA featuring 155,328 logic cells, 12.5 Mb of block RAM, and 640 DSP48E slices. It supports PCIe Gen1 x8, DDR2-533 memory interfaces, and operates at -2 speed grade with 1.0V core voltage. Used in high-bandwidth digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC5VLX155T-2FFG1136C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (640 user I/Os), transceiver capability (no built-in transceivers), thermal design margin for FFG1136 package, and compatibility with Xilinx ISE 14.7 toolchain.

Technical Context

The XC5VLX155T-2FFG1136C implements a column-based architecture with configurable logic blocks (CLBs), dedicated DSP slices, and clock management tiles (CMTs) containing DCMs and PLLs. It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 1 Gb/s per pin.

This device belongs to the Virtex-5 LX family optimized for logic density and deterministic timing closure. It lacks integrated multi-gigabit transceivers (MGTs), distinguishing it from the SX and FX variants, and targets applications requiring high I/O count and predictable static timing rather than serial protocol acceleration.

Key Specifications

Pinout & Package

XC5VLX155T-2FFG1136C is housed in a 1136-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with thermal lid, 1.0 mm ball pitch, and 35 mm × 35 mm footprint. The package supports thermal dissipation up to 12 W under typical operating conditions and includes dedicated VCCINT, VCCAUX, and VCCO supply banks per I/O column.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic-density and I/O-count applications.

Compared with XC5VLX155T-2FFG1136C, the XC5VLX330T-2FFG1760C offers scalable logic headroom within the same Virtex-5 ecosystem and toolflow, while the XCKU040-2FBVA676E delivers architectural modernization at the cost of revalidation effort and loss of DDR2-native interface support.

Availability

XC5VLX155T-2FFG1136C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and industrial machine vision controllers requiring stable component supply across extended production lifecycles.

Supply support for XC5VLX155T-2FFG1136C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Virtex-5 family was designed for high-performance logic-intensive applications demanding deterministic timing, high I/O bandwidth, and large on-chip memory - particularly in defense, aerospace, and medical imaging equipment.

FAQ

What is the maximum supported memory interface speed for XC5VLX155T-2FFG1136C?

The XC5VLX155T-2FFG1136C supports DDR2-533 (266 MHz clock, 533 Mbps data rate) using dedicated memory controller logic and I/O banks configured for SSTL-18. It does not support DDR3 or LPDDR interfaces natively. Memory interface performance is validated per Xilinx UG190 and requires matched trace lengths and proper termination for reliable operation at rated speed.

Does XC5VLX155T-2FFG1136C include built-in multi-gigabit transceivers?

No, the XC5VLX155T-2FFG1136C does not include multi-gigabit transceivers (MGTs). It belongs to the Virtex-5 LX series, which is logic-optimized and excludes high-speed serial transceivers. For transceiver capability, designers must select Virtex-5 SX or FX variants. XC5VLX155T-2FFG1136C relies on parallel I/O and SelectIO standards for high-speed communication.

Which software tools support XC5VLX155T-2FFG1136C design and implementation?

XC5VLX155T-2FFG1136C is fully supported by Xilinx ISE Design Suite 14.7, the final official release for Virtex-5 devices. It is not supported by Vivado, as Virtex-5 was retired from that toolchain. Implementation requires ISE Project Navigator, PlanAhead for floorplanning, and ChipScope Pro for in-system debugging. Bitstream generation and timing analysis are validated only within ISE 14.7.

What is the thermal design power (TDP) range for XC5VLX155T-2FFG1136C under typical operation?

XC5VLX155T-2FFG1136C has a typical thermal design power between 8.5 W and 12 W depending on logic utilization, I/O switching activity, and clock frequency. Xilinx XPower Analyzer v14.7 calculates exact values based on placed-and-routed design files. The FFG1136 package includes a thermal lid and requires a 4-layer PCB with internal ground/power planes and ≥4 thermal vias under the die for reliable operation at full speed grade.

Is XC5VLX155T-2FFG1136C still in active production and available for new designs?

XC5VLX155T-2FFG1136C is in long-term buy status with limited availability through authorized distributors and Aetrix Electronics' legacy component program. While no longer in active wafer fabrication, it remains supported for existing designs and life-extended programs. New designs should evaluate migration paths to AMD Kintex UltraScale+ or Versal ACAP families where feasible.