AMD XC5VLX155T-3FFG1136C

Overview

XC5VLX155T-3FFG1136C from AMD (formerly Xilinx) is a high-performance Virtex-5 FPGA featuring 155,648 logic cells, 12.5 Mb of block RAM, and 640 DSP48E slices. It operates at -3 speed grade (1.33 GHz I/O, 500 MHz system clock), uses 65 nm copper process, and is packaged in a 1136-pin FCBGA with 0.8 mm pitch. It targets high-bandwidth digital signal processing in radar and wireless infrastructure.

For engineers reviewing the XC5VLX155T-3FFG1136C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, DSP slice count, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), transceiver capability (up to 6.5 Gb/s), and thermal performance in air-cooled systems.

Technical Context

The XC5VLX155T-3FFG1136C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for multiply-accumulate operations, and integrated RocketIO GTP transceivers. It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling such as LVDS and RSDS.

It includes dual-register flip-flops per slice, built-in clock management tiles (CMT) with DCM and PLL, and supports partial reconfiguration. Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG interfaces using external SPI/BPI flash or PROM.

Key Specifications

Pinout & Package

The XC5VLX155T-3FFG1136C is housed in a 1136-pin Fine-Pitch Flip-Chip BGA (FFG) package with 35×35 mm body size, 0.8 mm ball pitch, and standard thermal pad layout. Pin functions are organized into I/O banks (Bank 0–Bank 15), configuration pins (INIT_B, PROGRAM_B, CCLK, DIN), dedicated clock inputs (MRCC/DRCC), and transceiver lanes (GTPCLK, GTXRX, GTXTX).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC5VLX155T-3FFG1136C, the XC5VLX330T offers scalable density within the same Virtex-5 family but demands larger board area and cooling, while the XCKU060 delivers superior serial bandwidth and DSP efficiency at the cost of architectural discontinuity and toolchain migration effort.

Availability

XC5VLX155T-3FFG1136C is available at Aetrix Electronics and suitable for radar signal processing, wireless infrastructure baseband units, and medical imaging backend systems requiring stable component supply across extended production lifecycles.

Supply support for XC5VLX155T-3FFG1136C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Virtex-5 family was originally designed by Xilinx for high-performance, high-bandwidth applications in aerospace, defense, and wired/wireless communications where deterministic timing and mixed-signal integration are critical.

FAQ

What is the maximum supported transceiver data rate for XC5VLX155T-3FFG1136C?

The XC5VLX155T-3FFG1136C integrates RocketIO GTP transceivers rated for operation up to 6.5 Gb/s per lane. This rate is guaranteed under -3 speed grade conditions with proper reference clock jitter (<1.5 ps RMS) and board-level signal integrity compliance per Xilinx UG192. The XC5VLX155T-3FFG1136C does not support rates beyond 6.5 Gb/s, as higher speeds require GTH or GTY transceivers found in Virtex-6 or UltraScale devices.

Does XC5VLX155T-3FFG1136C support partial reconfiguration?

Yes, the XC5VLX155T-3FFG1136C supports partial reconfiguration through its FPGA fabric and configuration logic. This capability allows dynamic replacement of specific logic modules without resetting the entire device or disrupting active I/O. Implementation requires Xilinx ISE 14.7 or later, PlanAhead tools, and adherence to placement constraints defined in UG194. The XC5VLX155T-3FFG1136C's configuration architecture enables this feature without external memory or controller overhead.

What I/O standards are supported by XC5VLX155T-3FFG1136C?

The XC5VLX155T-3FFG1136C supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS, RSDS, and BLVDS across its 16 I/O banks. Each bank operates independently at voltages from 1.2 V to 3.3 V. The XC5VLX155T-3FFG1136C does not support MIPI D-PHY or sub-1 V standards. Compatibility is verified per Xilinx DS100 and UG191 documentation for signal integrity and termination requirements.

What is the purpose of the M0–M2 pins on XC5VLX155T-3FFG1136C?

The M0–M2 pins on XC5VLX155T-3FFG1136C are dedicated mode selection inputs sampled at power-up to determine the configuration method: Master SelectMAP, Slave SelectMAP, JTAG, or Slave Parallel. Their states set the boot behavior before configuration begins. These pins must be pulled to valid logic levels (VCCO or GND) with appropriate resistors; floating states may cause unpredictable configuration failure. The XC5VLX155T-3FFG1136C requires stable M0–M2 states prior to INIT_B deassertion.

Is XC5VLX155T-3FFG1136C compatible with Xilinx ISE Design Suite?

Yes, the XC5VLX155T-3FFG1136C is fully supported by Xilinx ISE Design Suite 14.7, the final official release for Virtex-5 devices. Synthesis, place-and-route, and bitstream generation are validated for this tool version. The XC5VLX155T-3FFG1136C is not supported in Vivado, as Virtex-5 is excluded from that toolchain. Users must use ISE 14.7 with appropriate service packs for timing closure and transceiver wizard integration.