My Inquiry
My Account
AMD XC5VLX220-1FF1760I
- Part No.:
- XC5VLX220-1FF1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC5VLX220-1FF1760I.pdf
- Description:
- IC FPGA 800 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,534
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VLX220-1FF1760I from AMD (formerly Xilinx) is a Virtex-5 LX family FPGA with 220,000 logic cells, 12.8 Gb/s total serial I/O bandwidth, and 1760-pin Flip-Chip Fine-Pitch BGA (FF) package. It integrates 128 DSP48E slices, 12 MB of block RAM, and supports -1 speed grade for balanced performance and power in high-end reconfigurable computing.
For engineers reviewing the XC5VLX220-1FF1760I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (720 user I/Os), transceiver line rate (3.2 Gb/s per lane), voltage requirements (1.0V core, 2.5V/3.3V I/O), and thermal design power (19.2 W typical).
Technical Context
The XC5VLX220-1FF1760I implements a hierarchical FPGA architecture with six distinct logic tile types, including configurable logic blocks (CLBs), dedicated DSP48E slices for arithmetic-intensive tasks, and integrated PCIe® Gen1 x8 endpoint capability. It supports multi-standard SerDes with programmable pre-emphasis and receiver equalization.
Its clocking system includes four DCMs and two PLLs per clock region, enabling precise clock synthesis, phase alignment, and jitter reduction across multiple domains. The device supports SelectIO™ standards up to LVDS, SSTL, HSTL, and differential signaling with on-die termination calibration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 220,000 - determines maximum combinational and sequential logic capacity for complex state machines or data path implementation |
| User I/O Count | 720 - supports high-density interface aggregation, e.g., parallel memory buses or multi-lane sensor interfaces |
| Block RAM | 12 MB - enables large on-chip buffering for video frame storage, packet buffering, or FFT coefficient tables |
| DSP Slices | 128 × DSP48E - delivers 256 GMAC/s peak multiply-accumulate throughput for real-time signal processing |
| Transceiver Speed | 3.2 Gb/s per lane - meets PCIe Gen1, Serial RapidIO, and CPRI line-rate requirements without external retimers |
| Core Voltage | 1.0 V ±3% - defines strict power delivery network design with low-noise regulation and decoupling |
| Speed Grade | -1 - specifies worst-case timing closure at 1.0 V core and 85°C junction temperature |
Pinout & Package
XC5VLX220-1FF1760I is housed in a 1760-ball Flip-Chip Fine-Pitch BGA (FF1760) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid. The package supports standard reflow profiles and requires controlled impedance PCB routing for high-speed I/O and transceivers.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be regulated to 1.0 V ±3% with ≤10 mV ripple; distributed via dedicated power planes |
| VCCAUX | Auxiliary power supply | Supplies configuration logic, JTAG, and clock management circuits at 2.5 V |
| VCCO | I/O bank power | Configurable per bank (1.2–3.3 V); sets output swing and input threshold for that bank |
| HR_IO_Lx_y | High-range I/O | Supports 3.3 V tolerant operation and multiple I/O standards including LVCMOS, SSTL, HSTL |
| GTx_TxP/N | Transceiver differential output | Requires AC-coupled 100 Ω differential trace routing with length matching ≤5 mil |
| MGTCLKxP/N | Transceiver reference clock input | Accepts differential 2.5 V or 3.3 V LVDS/LVPECL; must meet jitter < 1.5 ps RMS |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen1 x8 Endpoint | Integrated hard IP eliminates need for external bridge IC and reduces latency in host-attached acceleration |
| Multi-Standard Transceivers | Programmable pre-emphasis and receiver equalization enable reliable 3.2 Gb/s links over FR4 backplanes |
| SelectIO Technology | Per-bank I/O voltage and standard selection allows mixed-voltage board design without level shifters |
| DCM + PLL Clock Management | Four DCMs and two PLLs per region support simultaneous multi-frequency domain generation with sub-degree phase control |
| Partial Reconfiguration Support | Enables dynamic function swapping in deployed systems-e.g., switching between radar and comms waveform engines |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time SAR image formation using pipelined FFTs and beamforming on airborne platforms. IC Role / Device Role / Timing Role: Primary compute engine executing time-critical DSP kernels with deterministic latency under DO-254 constraints. Use Value: 128 DSP48E slices deliver 256 GMAC/s throughput while 12 MB block RAM buffers full-resolution echo data frames. | Use Scenario: High-throughput CT reconstruction pipeline requiring parallel back-projection and iterative algorithms. IC Role / Device Role / Timing Role: Co-processor offloading compute-intensive reconstruction from host CPU, synchronized via PCIe Gen1 x8. Use Value: Integrated PCIe endpoint enables direct DMA access to host memory; 720 I/Os route parallel ADC/DAC interfaces and timing signals. |
| Wireless Baseband Processing | Industrial Machine Vision |
Use Scenario: LTE-Advanced base station digital front-end implementing MIMO-OFDM modulation/demodulation and channel estimation. IC Role / Device Role / Timing Role: Configurable PHY layer processor handling symbol-level processing with sub-microsecond latency guarantees. Use Value: 3.2 Gb/s transceivers interface directly to RFICs; DSP slices execute adaptive filtering and pilot tracking in real time. | Use Scenario: High-speed automated optical inspection (AOI) system capturing and analyzing 100+ MP/s image streams. IC Role / Device Role / Timing Role: Real-time pixel pipeline controller managing CMOS sensor triggering, frame buffering, and defect classification logic. Use Value: 720 user I/Os support parallel 24-bit RGB interfaces from multiple sensors; block RAM stores convolution kernels and lookup tables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX330-1FF1760I | 330K logic cells, 192 DSP48E slices, higher TDP (24.1 W), same FF1760 package | Targets larger algorithm footprints requiring >220K LUTs or >128 DSP slices | Select when design exceeds XC5VLX220-1FF1760I resource utilization by >15% in both logic and DSP |
| XCVU3P-2FFVD1760I | UltraScale+ architecture, 355K logic cells, 768 DSP slices, 25.8 Gb/s transceiver bandwidth, different pinout | Supports PCIe Gen3 x16, DDR4, and higher-bandwidth protocols not available in Virtex-5 | Choose XC5VLX220-1FF1760I only for legacy compatibility, cost-sensitive upgrades, or existing PCB reuse |
Compared with XC5VLX330-1FF1760I, the XC5VLX220-1FF1760I offers lower power and cost for mid-scale compute; compared with XCVU3P-2FFVD1760I, it provides proven reliability in aerospace-grade environments but lacks Gen3+ interfaces and hardened memory controllers.
Availability
XC5VLX220-1FF1760I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and wireless baseband processing requiring stable component supply across long-life industrial and defense programs.
Supply support for XC5VLX220-1FF1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Virtex product line as part of its adaptive computing portfolio. Xilinx pioneered FPGA architecture for high-performance reconfigurable logic.
The Virtex-5 LX family was designed for applications demanding high logic density, embedded DSP, and multi-gigabit serial connectivity - especially in aerospace, defense, and wired/wireless infrastructure.
FAQ
What is the maximum operating junction temperature for XC5VLX220-1FF1760I?
The XC5VLX220-1FF1760I has a maximum operating junction temperature of 100°C, specified for Industrial temperature grade (-40°C to +100°C). Thermal design must ensure junction temperature remains within this limit under worst-case power dissipation (19.2 W typical, up to 23.5 W peak), using appropriate heatsinking and airflow per Xilinx UG193.
Does XC5VLX220-1FF1760I support partial reconfiguration?
Yes, the XC5VLX220-1FF1760I supports partial reconfiguration through Xilinx ISE Design Suite tools and associated bitstream generation flow. This capability allows dynamic module swapping without resetting the entire device, enabling runtime adaptation in radar and communications systems where XC5VLX220-1FF1760I serves as the primary reconfigurable compute platform.
What configuration modes does XC5VLX220-1FF1760I support?
The XC5VLX220-1FF1760I supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. It boots from external SPI flash or PROM via dedicated configuration pins, with fallback support for boundary-scan testing and in-system programming using the JTAG interface built into the XC5VLX220-1FF1760I silicon.
Is XC5VLX220-1FF1760I RoHS compliant?
Yes, the XC5VLX220-1FF1760I is RoHS-6 compliant (lead-free, halogen-free) and meets JEDEC J-STD-020D moisture sensitivity level 3 (MSL3) requirements. Its FF1760 package uses matte tin finish on solder balls and complies with IPC/JEDEC J-STD-033 handling guidelines for the XC5VLX220-1FF1760I.
What is the supported transceiver protocol list for XC5VLX220-1FF1760I?
The XC5VLX220-1FF1760I transceivers natively support PCIe Gen1, Serial RapidIO 1.2/2.1, CPRI, Aurora, and custom 8B/10B protocols at up to 3.2 Gb/s. Protocol support depends on GT wizard configuration and firmware; no native Ethernet MAC or SATA PHY is embedded - those require soft IP or external PHYs interfaced to the XC5VLX220-1FF1760I.
XC5VLX220-1FF1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 17280
- Number of Logic Elements/Cells:
- 221184
- Total RAM Bits:
- 7077888
- Number of I/O:
- 800
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XC5VLX220-1FF1760I FAQ
1.How can I place an order for XC5VLX220-1FF1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX220-1FF1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX220-1FF1760I reliable?
The price and inventory of XC5VLX220-1FF1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX220-1FF1760I is usually 5 days.
3.What payment methods are accepted for XC5VLX220-1FF1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX220-1FF1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX220-1FF1760I?
XC5VLX220-1FF1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX220-1FF1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX220-1FF1760I?
For technical support, including XC5VLX220-1FF1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX220-1FF1760I requirements.
6.How does Aetrix verify that XC5VLX220-1FF1760I is sourced from the original manufacturer or authorized distributors?
All XC5VLX220-1FF1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX220-1FF1760I meets industry standards.
7.What is the process for return or replacement of XC5VLX220-1FF1760I?
All XC5VLX220-1FF1760I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX220-1FF1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX220-1FF1760I part is unused and in its original packaging.
Return procedure for XC5VLX220-1FF1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VLX220-1FF1760I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
