AMD XC5VLX220-1FFG1760C
- Part No.:
- XC5VLX220-1FFG1760C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC5VLX220-1FFG1760C.pdf
- Description:
- IC FPGA 800 I/O 1760FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VLX220-1FFG1760C from AMD (formerly Xilinx) is a high-capacity Virtex-5 FPGA featuring 220,000 logic cells, 12.8 MB of block RAM, and 640 DSP48E slices. It supports PCIe Gen1 x8, DDR2-533 memory interfaces, and operates at -1 speed grade with 1.0V core voltage. It is used in high-performance digital signal processing systems such as radar baseband processing.
For engineers reviewing the XC5VLX220-1FFG1760C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), transceiver capability (no integrated transceivers), thermal design margin for FFG1760 package, and compatibility with ISE Design Suite v14.7.
Technical Context
The XC5VLX220-1FFG1760C implements a column-based architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for arithmetic-intensive tasks, and SelectIO technology supporting LVDS, SSTL, HSTL, and differential signaling standards. It includes clock management tiles with DCMs and PLLs for jitter reduction and frequency synthesis.
It lacks built-in multi-gigabit transceivers (MGTs), distinguishing it from Virtex-5 LXT and SXT families. Configuration is performed via Master SelectMAP or JTAG, with support for dual-boot from two BPI flash devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 220,000 - determines maximum combinational/sequential logic capacity for complex state machines or protocol stacks |
| Block RAM | 12.8 MB - enables large on-chip buffering for video frame storage or packet queuing without external memory |
| DSP Slices | 640 × DSP48E - supports parallel multiply-accumulate operations up to 25×18-bit per slice, critical for FIR filtering |
| User I/O Pins | 720 - provides high interface density for parallel bus interfacing, sensor arrays, or multi-channel ADC/DAC control |
| Speed Grade | -1 - specifies maximum operating frequency under worst-case voltage/temperature conditions (1.0V, 85°C junction) |
| Core Voltage | 1.0 V ±3% - defines power delivery requirements and impacts dynamic power consumption and thermal dissipation |
Pinout & Package
XC5VLX220-1FFG1760C is housed in a 1760-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG1760) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant construction. Thermal pad on underside requires solder paste stencil design per Xilinx UG192.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master SelectMAP mode; must be driven by external source or oscillator |
| DONE | Configuration Status Output | Open-drain signal indicating completion of bitstream loading and startup sequence |
| INIT_B | Configuration Initialization | Active-low input that resets configuration logic and clears internal registers prior to new bitstream load |
| PROGRAM_B | Configuration Reset | Active-low input forcing reinitialization of configuration memory and clearing CLB contents |
| M0–M2 | Mode Selection Inputs | Set configuration mode (JTAG, Slave Serial, Master SelectMAP, etc.) at power-up; pulled high/low via resistors |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Clock Management | Four DCMs and two PLLs per device enable precise clock phase alignment, frequency synthesis, and jitter cleanup across multiple domains |
| SelectIO Technology | Supports 21 I/O standards including LVDS, SSTL-2, HSTL-I, and differential termination - eliminates need for external level shifters |
| Dedicated DSP48E Slice | Hardwired 25×18-bit multiplier with pre-adder and accumulator enables deterministic 4-cycle MAC throughput per slice |
| Block RAM Flexibility | Configurable as true dual-port RAM, single-port RAM, or shift register - allows time-multiplexed access or pipeline staging |
| Configuration Security | Bitstream encryption using AES-256 key stored in on-chip eFUSE prevents unauthorized readback or cloning |
Applications
| Radar Baseband Processing | Medical Imaging Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler signal processing with adaptive beamforming and clutter suppression. IC Role / Device Role / Timing Role: FPGA fabric implements custom FFT engines, CFAR detection, and DMA-controlled data streaming to host processor. Use Value: 640 DSP48E slices enable concurrent 1024-point FFTs at 120 MSPS; 720 I/Os interface directly to 16-channel ADC front-end and PCIe Gen1 x8 host link. | Use Scenario: High-speed CT scanner detector readout with real-time offset/gain correction and histogram binning. IC Role / Device Role / Timing Role: Configurable logic manages 64-channel parallel ADC timing, applies pixel-level calibration coefficients, and buffers corrected data. Use Value: 12.8 MB block RAM stores full-scan projection data before compression; SelectIO supports 1.2 Gbps LVDS links to detector ASICs. |
| Industrial Machine Vision Controller | High-Performance Test Equipment |
Use Scenario: Sub-millisecond image preprocessing pipeline for robotic guidance with multi-camera synchronization. IC Role / Device Role / Timing Role: FPGA executes Sobel edge detection, Bayer demosaicing, and timestamped frame stitching across four camera inputs. Use Value: 220K logic cells accommodate full pipeline with latency < 80 µs; 720 I/Os route MIPI CSI-2 lanes and encoder quadrature signals simultaneously. | Use Scenario: Modular ATE platform requiring reconfigurable digital pattern generation and high-precision timing capture. IC Role / Device Role / Timing Role: FPGA generates synchronized multi-channel digital stimulus waveforms and captures response with sub-nanosecond timestamp resolution. Use Value: DCM/PLL resources achieve < 50 ps jitter on 200 MHz pattern clocks; block RAM stores 1M+ vector sequences on-chip. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density logic and DSP acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX330-1FFG1760C | 330K logic cells, 17.3 MB block RAM, same package and speed grade | Higher gate count supports larger protocol stacks or additional IP cores without board change | Choose when design requires >220K logic cells but retains identical thermal and PCB footprint constraints |
| XC6VLX240T-1FFG1156C | Virtex-6 family, 240K logic cells, 13.2 MB block RAM, 600 DSP48A slices, FFG1156 (1156-pin) package | Includes GTX transceivers (up to 6.6 Gbps) and enhanced clocking; smaller package but lower I/O count (560) | Choose when serial connectivity or higher DSP efficiency per watt is required, accepting reduced I/O and different layout |
Compared with XC5VLX220-1FFG1760C, XC5VLX330-1FFG1760C offers scalable logic headroom within identical thermal and mechanical constraints, while XC6VLX240T-1FFG1156C introduces transceiver capability and architectural improvements at the cost of I/O count and package compatibility.
Availability
XC5VLX220-1FFG1760C is available at Aetrix Electronics and suitable for radar baseband processing, medical imaging data acquisition, and industrial machine vision controllers requiring stable component supply across extended production lifecycles.
Supply support for XC5VLX220-1FFG1760C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-5 family was designed for high-performance, logic- and DSP-intensive applications in aerospace, defense, and medical imaging where predictable timing closure and deterministic resource utilization are critical.
FAQ
What is the maximum supported DDR2 memory interface speed for XC5VLX220-1FFG1760C?
The XC5VLX220-1FFG1760C supports DDR2-533 (266 MHz clock) interfaces using its dedicated memory controller logic and SelectIO pins configured for SSTL-18. This speed is validated per Xilinx UG190 and requires proper PCB routing, termination, and timing constraints in ISE Design Suite v14.7. The XC5VLX220-1FFG1760C does not support DDR3 or LPDDR2 standards.
Does XC5VLX220-1FFG1760C include built-in multi-gigabit transceivers?
No, XC5VLX220-1FFG1760C belongs to the Virtex-5 LX family and contains no integrated multi-gigabit transceivers (MGTs). High-speed serial connectivity must be implemented externally using discrete PHYs or by upgrading to Virtex-5 LXT or SXT variants. The XC5VLX220-1FFG1760C relies on parallel I/O banks for data transfer.
What configuration modes are supported by XC5VLX220-1FFG1760C?
The XC5VLX220-1FFG1760C supports Master SelectMAP, Slave SelectMAP, JTAG, and Slave Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SelectMAP is commonly used for fast parallel programming from SPI or BPI flash, while JTAG enables boundary-scan testing and partial reconfiguration. All modes are documented in Xilinx UG192 for XC5VLX220-1FFG1760C.
Is XC5VLX220-1FFG1760C compatible with Vivado Design Suite?
No, XC5VLX220-1FFG1760C is not supported in Vivado Design Suite. It requires Xilinx ISE Design Suite v13.4 through v14.7 for synthesis, implementation, and bitstream generation. Vivado targets 7-series and newer FPGAs. Using ISE v14.7 ensures correct timing analysis, place-and-route, and configuration file generation for XC5VLX220-1FFG1760C.
What thermal management considerations apply to XC5VLX220-1FFG1760C in the FFG1760 package?
The XC5VLX220-1FFG1760C in FFG1760 package requires a thermal solution capable of dissipating up to 12 W typical power under full utilization. Xilinx UG192 specifies a 10 mm × 10 mm thermal pad on the package underside, which must be soldered to a solid copper thermal plane on the PCB. Recommended airflow is ≥300 LFM with ambient ≤40°C to maintain junction temperature below 85°C for XC5VLX220-1FFG1760C.
XC5VLX220-1FFG1760C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 17280
- Number of Logic Elements/Cells:
- 221184
- Total RAM Bits:
- 7077888
- Number of I/O:
- 800
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XC5VLX220-1FFG1760C FAQ
1.How can I place an order for XC5VLX220-1FFG1760C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX220-1FFG1760C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX220-1FFG1760C reliable?
The price and inventory of XC5VLX220-1FFG1760C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX220-1FFG1760C is usually 5 days.
3.What payment methods are accepted for XC5VLX220-1FFG1760C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX220-1FFG1760C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX220-1FFG1760C?
XC5VLX220-1FFG1760C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX220-1FFG1760C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX220-1FFG1760C?
For technical support, including XC5VLX220-1FFG1760C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX220-1FFG1760C requirements.
6.How does Aetrix verify that XC5VLX220-1FFG1760C is sourced from the original manufacturer or authorized distributors?
All XC5VLX220-1FFG1760C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX220-1FFG1760C meets industry standards.
7.What is the process for return or replacement of XC5VLX220-1FFG1760C?
All XC5VLX220-1FFG1760C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX220-1FFG1760C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX220-1FFG1760C part is unused and in its original packaging.
Return procedure for XC5VLX220-1FFG1760C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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