AMD XC5VLX220-1FFG1760I

Overview

XC5VLX220-1FFG1760I from AMD (formerly Xilinx) is a high-capacity Virtex-5 FPGA featuring 220,000 logic cells, 12.8 MB of block RAM, and 640 DSP48E slices. It supports PCIe Gen1 x8, DDR2-533 memory interfaces, and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC5VLX220-1FFG1760I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), transceiver capability (no built-in multi-gigabit transceivers), configuration interface (SelectMAP, JTAG, SPI), and thermal design implications of the FFG1760 package.

Technical Context

The XC5VLX220-1FFG1760I implements a column-based architecture with six distinct logic tile types: SLICEL, SLICEM, BRAM, DSP48E, CLOCK, and IOB. It uses 65 nm copper process technology and supports partial reconfiguration via ICAP.

Configuration is performed through Master SelectMAP, Slave SelectMAP, JTAG, or serial PROM modes. It integrates 360 clock management tiles (CMTs), each containing a DCM and PLL, enabling precise clock synthesis and phase alignment across multiple domains.

Key Specifications

Pinout & Package

XC5VLX220-1FFG1760I is housed in a 1760-pin Fine-Pitch Flip-Chip BGA (FFG1760) package with 35 mm × 35 mm body size and 0.8 mm ball pitch. Thermal and mechanical design requires adherence to Xilinx UG192 layout guidelines, including power plane segmentation and thermal via placement under the die area.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC5VLX220-1FFG1760I, XC5VLX330-1FFG1760I offers headroom for logic expansion within identical thermal and board footprint constraints, while XCVU3P-2FFVD1760I provides architectural upgrades-especially transceiver performance and memory bandwidth-at the cost of toolchain migration and higher power density.

Availability

XC5VLX220-1FFG1760I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and industrial machine vision requiring stable component supply over extended production lifecycles.

Supply support for XC5VLX220-1FFG1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Virtex-5 family was designed for high-performance, logic- and DSP-intensive applications in aerospace, defense, and medical imaging where predictable timing, large on-chip memory, and industrial temperature operation are critical.

FAQ

What is the maximum supported memory interface speed for XC5VLX220-1FFG1760I?

The XC5VLX220-1FFG1760I supports DDR2-533 (266 MHz clock) and QDR II SRAM interfaces up to 333 MHz. Its memory controller hard IP and I/O electrical characteristics are validated for these speeds under industrial temperature conditions. XC5VLX220-1FFG1760I does not support DDR3 or LPDDR interfaces natively.

Does XC5VLX220-1FFG1760I include built-in multi-gigabit transceivers?

No, XC5VLX220-1FFG1760I does not integrate multi-gigabit transceivers. It belongs to the LX (Logic-optimized) subfamily of Virtex-5, which omits high-speed serial I/O. Designs requiring >1 Gbps serial links must use external PHYs or select a Virtex-5 SX or FX variant. XC5VLX220-1FFG1760I relies on its SelectIO banks for parallel or low-speed differential signaling.

What configuration modes are supported by XC5VLX220-1FFG1760I?

XC5VLX220-1FFG1760I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial PROM (SPI x1/x2/x4) configuration modes. The mode is selected via MODE pins (M2:M0) at power-up. XC5VLX220-1FFG1760I also supports fallback configuration and daisy-chain JTAG for multi-device programming.

Is XC5VLX220-1FFG1760I RoHS compliant and lead-free?

Yes, XC5VLX220-1FFG1760I is RoHS-compliant and lead-free per EU Directive 2011/65/EU. The FFG1760 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3. XC5VLX220-1FFG1760I documentation confirms exemption 7a for lead in high-melting-temperature solder alloys is not claimed.

Can XC5VLX220-1FFG1760I perform partial reconfiguration in-system?

Yes, XC5VLX220-1FFG1760I supports in-system partial reconfiguration using the Internal Configuration Access Port (ICAP). This allows dynamic loading of logic modules without resetting the entire device or halting active functions. XC5VLX220-1FFG1760I requires proper floorplanning and bitstream partitioning in Vivado 2019.1 or earlier ISE Design Suite versions.