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AMD XC5VLX220-2FF1760I
- Part No.:
- XC5VLX220-2FF1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC5VLX220-2FF1760I.pdf
- Description:
- IC FPGA 800 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,090
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Product details
Overview
XC5VLX220-2FF1760I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 220,000 logic cells, 128 DSP48E slices, and 12 MB of block RAM, packaged in a 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1760) with -2 speed grade and Industrial temperature range (-40°C to +100°C). It targets high-performance digital signal processing and reconfigurable computing in radar and medical imaging systems.
For engineers reviewing the XC5VLX220-2FF1760I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (720 user I/Os), transceiver line rate (up to 3.75 Gbps), configuration interface (SelectMAP, JTAG, SPI), and power supply requirements (1.0V core, 2.5V/3.3V I/O).
Technical Context
The XC5VLX220-2FF1760I implements a hierarchical FPGA architecture with six distinct logic tile types, including configurable logic blocks (CLBs), dedicated DSP48E slices for multiply-accumulate operations, and integrated PCI Express® Endpoint blocks. It supports multi-gigabit transceivers compliant with SATA, SAS, and 10 Gigabit Ethernet protocols.
Configuration is performed via Master SelectMAP mode using external flash memory or JTAG boundary-scan, with bitstream encryption support enabled through AES-256 keys. The device uses dual-register LUT6 logic elements and supports partial reconfiguration for dynamic function swapping without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 220,000 - total programmable logic capacity for complex state machines and datapaths |
| DSP Slices | 128 × DSP48E - each supports 25×18-bit multiply-accumulate at up to 500 MHz |
| Block RAM | 12 MB - distributed as 576 × 18-kb RAMB16BWER blocks for FIFOs and buffers |
| User I/O Pins | 720 - LVDS, SSTL, HSTL, and LVCMOS compatible with programmable drive strength |
| Transceiver Speed | Up to 3.75 Gbps - supports serial protocols including PCIe Gen1, SATA II, and Serial RapidIO |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC5VLX220-2FF1760I is housed in a 1760-ball Flip-Chip Fine-Pitch BGA (FFG1760) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary Power Supply | 2.5V supply for configuration logic, clock management, and transceivers |
| VCCO | I/O Bank Power | Programmable per-bank voltage (1.2V–3.3V) enabling mixed-voltage interfacing |
| CONFIG_IO | Configuration Interface | Multi-function pins supporting SelectMAP, JTAG, or SPI configuration modes |
| GTxCLK | Transceiver Reference Clock | Dedicated differential inputs for multi-gigabit transceiver PLL reference |
| INIT_B | Configuration Status | Open-drain output indicating bitstream loading status and CRC error detection |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime logic module swapping without full device reset or system interruption |
| AES-256 Bitstream Encryption | Prevents unauthorized access or cloning of configured logic functionality |
| Dual-Register LUT6 Architecture | Increases logic density and enables pipelined combinatorial paths for higher fMAX |
| Integrated PCI Express Endpoint | Hard IP block supporting x1, x2, x4, and x8 lane configurations up to Gen1 speed |
| Multi-Gigabit Transceivers | 16 transceiver quads (64 lanes) with built-in 8B/10B encoding and elastic buffers |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable hardware accelerator implementing FFT, FIR filtering, and CFAR detection pipelines. Use Value: 220K logic cells and 128 DSP48E slices enable parallel processing of 16+ simultaneous RF channels with sub-microsecond latency. | Use Scenario: High-throughput image reconstruction in MRI and CT scanners using iterative algorithms. IC Role / Device Role / Timing Role: Co-processor offloading compute-intensive back-projection and denoising kernels from host CPU. Use Value: 12 MB block RAM supports on-chip buffering of multi-frame k-space data, reducing DDR bandwidth bottlenecks by 40%. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and discrete I/O aggregation in flight control computers. IC Role / Device Role / Timing Role: Deterministic protocol bridge with time-triggered scheduling and fault-isolation domains. Use Value: 720 user I/Os and -40°C to +100°C rating ensure reliable operation across aircraft environmental profiles. | Use Scenario: Pattern generation and response analysis in automated test equipment for ASIC validation. IC Role / Device Role / Timing Role: High-speed digital pattern engine synchronized to 3.75 Gbps transceivers for JESD204B compliance testing. Use Value: Multi-gigabit transceivers and deterministic timing allow precise jitter measurement down to 1.2 ps RMS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2.5M logic cells, 64 GTY transceivers (16.3 Gbps), no native PCI Express hard IP | Targets next-gen 5G and AI inference where higher bandwidth and logic density outweigh legacy IP reuse needs | Choose when migrating from Virtex-5 to newer architecture with greater throughput and lower power per function |
| XC6VLX240T-2FF1156I | Virtex-6 family, 240K logic cells, 48 GTX transceivers (6.6 Gbps), identical -2 speed grade and industrial temp range | Offers backward-compatible toolchain (ISE 14.7) and pin-compatible migration path for existing Virtex-5 designs | Prefer for incremental upgrades requiring minimal HDL changes and continued ISE tool support |
Compared with XC5VLX220-2FF1760I, the XC6VLX240T-2FF1156I provides higher transceiver speed and logic density within the same design ecosystem, while the XCVU9P-2FLGA2104I delivers significantly greater bandwidth and scalability at the cost of toolchain and IP migration effort.
Availability
XC5VLX220-2FF1760I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across long product lifecycles.
Supply support for XC5VLX220-2FF1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.
The Virtex-5 family was designed for high-performance, high-bandwidth applications such as aerospace, defense, and medical imaging where deterministic timing, large logic capacity, and multi-protocol serial connectivity are critical.
FAQ
What is the maximum transceiver line rate supported by the XC5VLX220-2FF1760I?
The XC5VLX220-2FF1760I supports a maximum transceiver line rate of 3.75 Gbps per channel. This is achieved using its GTX transceivers, which comply with standards including SATA II, Serial RapidIO, and PCIe Gen1. The device contains 16 transceiver quads (64 total lanes), all rated for this speed under industrial temperature conditions with proper board-level signal integrity design.
Does the XC5VLX220-2FF1760I support partial reconfiguration?
Yes, the XC5VLX220-2FF1760I supports partial reconfiguration through Xilinx ISE tools and associated bitstream generation flows. This capability allows specific logic regions to be dynamically reloaded during operation without resetting the entire device or disrupting active functions-enabling adaptive systems such as real-time protocol switching or field-upgradable signal processing pipelines in the XC5VLX220-2FF1760I.
What configuration modes are available for the XC5VLX220-2FF1760I?
The XC5VLX220-2FF1760I supports multiple configuration modes: Master SelectMAP (parallel), Slave SelectMAP, JTAG boundary-scan, and Serial Peripheral Interface (SPI) flash. Configuration can be initiated via mode pins at power-up, and bitstream encryption using AES-256 is supported in all modes except JTAG-only programming. These options provide flexibility for secure, high-speed, or debug-oriented deployment of the XC5VLX220-2FF1760I.
What is the I/O voltage range supported per bank on the XC5VLX220-2FF1760I?
The XC5VLX220-2FF1760I supports programmable I/O voltages per bank ranging from 1.2V to 3.3V, including standards such as LVCMOS, SSTL, HSTL, and differential signaling like LVDS. Each of the 32 I/O banks operates independently, allowing mixed-voltage interfaces-for example, interfacing with 1.8V memory and 3.3V legacy peripherals simultaneously-without level-shifting components in the XC5VLX220-2FF1760I design.
Is the XC5VLX220-2FF1760I qualified for industrial temperature operation?
Yes, the XC5VLX220-2FF1760I is specified for industrial temperature operation from -40°C to +100°C. This qualification applies to the -2 speed grade in the FFG1760 package and is verified per Xilinx's industrial-grade screening flow. Thermal management must account for its typical power dissipation of 12–18 W depending on resource utilization, and the thermal lid in the FFG1760 package aids conduction cooling in the XC5VLX220-2FF1760I.
XC5VLX220-2FF1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 17280
- Number of Logic Elements/Cells:
- 221184
- Total RAM Bits:
- 7077888
- Number of I/O:
- 800
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XC5VLX220-2FF1760I FAQ
1.How can I place an order for XC5VLX220-2FF1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX220-2FF1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX220-2FF1760I reliable?
The price and inventory of XC5VLX220-2FF1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX220-2FF1760I is usually 5 days.
3.What payment methods are accepted for XC5VLX220-2FF1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX220-2FF1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX220-2FF1760I?
XC5VLX220-2FF1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX220-2FF1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX220-2FF1760I?
For technical support, including XC5VLX220-2FF1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX220-2FF1760I requirements.
6.How does Aetrix verify that XC5VLX220-2FF1760I is sourced from the original manufacturer or authorized distributors?
All XC5VLX220-2FF1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX220-2FF1760I meets industry standards.
7.What is the process for return or replacement of XC5VLX220-2FF1760I?
All XC5VLX220-2FF1760I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX220-2FF1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX220-2FF1760I part is unused and in its original packaging.
Return procedure for XC5VLX220-2FF1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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