AMD XC5VLX30-1FF676I

Overview

XC5VLX30-1FF676I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM with 1,152 kbits capacity. It implements high-speed signal processing in radar baseband subsystems and supports PCIe Gen1 endpoint functionality in industrial vision controllers.

For engineers reviewing the XC5VLX30-1FF676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver compliance with PCIe Base Spec 1.1, and availability of dedicated DSP48E slices for real-time filtering.

Technical Context

The XC5VLX30-1FF676I uses a 65 nm copper process and employs a column-based architecture with configurable logic blocks (CLBs), dedicated DSP48E slices, and integrated PCI Express endpoints. It supports multi-gigabit transceivers with built-in encoding/decoding and clock data recovery.

This device includes SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and RSDS. Its clocking system comprises DCMs and PLLs capable of frequency synthesis and phase alignment across multiple domains.

Key Specifications

Pinout & Package

XC5VLX30-1FF676I is housed in a 676-pin Fine-Pitch Flip-Chip BGA (FF676) package with 1.0 mm ball pitch and thermal lid. The package supports thermal dissipation up to 5.5 W under typical operation and provides 448 user I/O pins distributed across 16 banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XC5VLX50-1FF676I and XCVU9P-1FF900I, the XC5VLX30-1FF676I offers optimal balance of logic density, transceiver performance, and thermal envelope for cost-sensitive radar and vision edge nodes where PCIe Gen1 and 2.5 Gbps serial I/O meet requirements.

Availability

XC5VLX30-1FF676I is available at Aetrix Electronics and suitable for radar signal processing, industrial vision controllers, and medical imaging subsystems requiring stable component supply over extended production lifecycles.

Supply support for XC5VLX30-1FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Virtex-5 product support through its Adaptive SoC and FPGA business unit.

The Virtex-5 family was designed for high-performance logic, signal processing, and serial connectivity in aerospace, defense, and industrial systems where reliability and long-term availability are critical.

FAQ

What is the maximum supported I/O standard voltage for XC5VLX30-1FF676I?

The XC5VLX30-1FF676I supports I/O voltages from 1.2 V to 3.3 V per bank via VCCO settings. Each of its 16 I/O banks can be independently configured, enabling mixed-voltage interfaces such as 1.8 V DDR2 memory and 3.3 V legacy peripherals on the same device. This flexibility eliminates external level shifters in heterogeneous system designs.

Does XC5VLX30-1FF676I include hard IP for PCI Express?

Yes, XC5VLX30-1FF676I integrates dedicated PCIe Gen1 endpoint hard IP compliant with PCIe Base Specification 1.1. It handles physical layer serialization, data link layer ACK/NAK, and transaction layer request completion without consuming fabric resources, reducing timing closure effort and improving deterministic latency for host communication.

How many DSP48E slices does XC5VLX30-1FF676I contain?

XC5VLX30-1FF676I contains 64 DSP48E slices. Each slice delivers a 25×18 signed multiplication with a 48-bit accumulator, supporting single-cycle multiply-accumulate operations essential for real-time FIR filtering, correlation, and matrix arithmetic in radar and imaging pipelines.

What is the thermal design power (TDP) range for XC5VLX30-1FF676I?

XC5VLX30-1FF676I has a typical thermal design power of 4.2 W and a maximum of 5.5 W under full utilization with worst-case voltage and temperature conditions. Its FF676 package includes a thermal lid and is qualified for operation from –40°C to +100°C junction temperature, supporting conduction-cooled industrial deployments.

Can XC5VLX30-1FF676I be configured via JTAG after power-up?

Yes, XC5VLX30-1FF676I supports IEEE 1149.1 JTAG boundary-scan configuration post-power-up. It also supports master/slave SPI, BPI, and SelectMAP modes. JTAG enables in-system programming, debugging, and verification without requiring external configuration PROMs during development and field updates.