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AMD XC5VLX30-1FFG676CES
- Part No.:
- XC5VLX30-1FFG676CES
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC5VLX30-1FFG676CES.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,793
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Product details
Overview
XC5VLX30-1FFG676CES from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 1,404 kbits. It implements high-speed signal processing in radar baseband units requiring deterministic latency and multi-channel I/O synchronization.
For engineers reviewing the XC5VLX30-1FFG676CES datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance with PCIe Gen1, distributed RAM depth per CLB, and configuration interface voltage tolerance for industrial temperature operation.
Technical Context
The XC5VLX30-1FFG676CES uses a 65 nm copper process with dual-register LUTs and integrated DSP48E slices supporting 18×25-bit multiply-accumulate at 550 MHz. Its clocking architecture includes four DCMs and two PLLs per clock region, enabling independent domain management for mixed-signal subsystems.
Configuration occurs via Master SelectMAP mode using 32-bit parallel interface at 100 MHz or JTAG boundary-scan. The device supports partial reconfiguration through ICAP and features SEU mitigation via CRC-based frame checking and built-in scrubbing controller.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 30,816 – determines maximum combinational/sequential logic capacity for protocol stack implementation |
| Block RAM | 1,404 kbits – supports dual-port FIFOs up to 18 kwords × 36 bits for data buffering |
| Transceivers | 4 × 2.5 Gbps – enables x4 PCIe Gen1 endpoint or Serial RapidIO link without external retimers |
| DCMs/PLLs | 4 DCMs + 2 PLLs – provides independent clock synthesis for ADC sampling, SERDES, and processor interface domains |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL – allows direct interfacing to DDR2 memory and 100 Ω differential traces |
| Operating Temp | -40°C to +100°C – qualified for extended industrial environments including motor drive control cabinets |
Pinout & Package
XC5VLX30-1FFG676CES is housed in a 676-pin Fine-Pitch Flip-Chip BGA (FFG) package with 1.0 mm ball pitch and 27 × 27 mm body size. Thermal pad on underside requires solder paste stencil aperture matching IPC-7351B standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during Master SelectMAP startup; must be stable before INIT_B deassertion |
| DIN[31:0] | Parallel Configuration Data | 32-bit wide data bus accepting configuration frames at up to 100 MHz for sub-100 ms load time |
| PROG_B | Program Initiate | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| INIT_B | Configuration Status | Open-drain output indicating configuration memory readiness; pulled high externally during valid bitstream load |
| GTX_CLK0_M2P | Transceiver Reference Clock | Differential input for primary GTY transceiver bank; requires AC-coupled 100 Ω termination to support 125–2500 MHz range |
Key Features
| Feature | Design Value |
|---|---|
| DSP48E Slices | 64 slices each delivering 18×25-bit MAC in single cycle at 550 MHz for real-time FFT kernels |
| Embedded Memory | 18-kbit Block RAM with true dual-port capability enables simultaneous read/write for ping-pong buffer architectures |
| Multi-Gigabit Transceivers | 4 lanes compliant with PCIe Gen1 and Serial ATA Gen2 standards without external PHY layer components |
| Partial Reconfiguration | ICAP interface allows dynamic module swapping in operational systems without full FPGA reset or service interruption |
| SEU Mitigation | CRC frame verification and hardware scrubbing engine reduce uncorrectable configuration errors by >99.9% in radiation-prone environments |
Applications
| Radar Baseband Processing | Industrial Motion Control |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in X-band phased array radar systems. IC Role / Device Role / Timing Role: FPGA fabric implements matched filter chains and digital down-conversion pipelines synchronized to 122.88 MHz sampling clock. Use Value: 2.5 Gbps transceivers interface directly to ADC/DAC converters, eliminating external serializer/deserializer chips and reducing board area by 32%. | Use Scenario: Multi-axis servo drive coordination with synchronized PWM generation and current loop feedback in CNC machine tools. IC Role / Device Role / Timing Role: Configurable logic executes field-oriented control (FOC) algorithms while embedded RAM buffers encoder position data across 8 axes. Use Value: Dual-register LUTs achieve <15 ns logic propagation delay, enabling 20 kHz PWM carrier frequency with sub-microsecond dead-time control precision. |
| Medical Imaging Backend | Avionics Data Concentration |
Use Scenario: CT scanner projection data aggregation and preprocessing prior to GPU-based reconstruction. IC Role / Device Role / Timing Role: High-speed I/O banks collect parallel LVDS streams from 64 detector modules with deterministic skew alignment. Use Value: 1,404 kbits of Block RAM enables real-time 16-frame ring buffer for motion artifact correction without DRAM latency penalties. | Use Scenario: ARINC 429 and MIL-STD-1553B bus bridging in flight control computers with deterministic packet scheduling. IC Role / Device Role / Timing Role: Dedicated logic resources implement time-triggered communication scheduler with <500 ns jitter on 10 MHz timebase. Use Value: Four DCMs provide independent clock domains for each bus interface, ensuring isolation between safety-critical and non-critical data paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture with 28 Gbps transceivers and hardened 100G Ethernet MAC; higher power and cost | Required for 100G optical transport but overqualified for PCIe Gen1 radar interfaces | Select only when migrating to 100G backhaul or needing hardened IP blocks not present in Virtex-5 |
| XC7K325T-2FFG901I | 7-series Kintex with 12.5 Gbps transceivers, lower static power, and improved DSP slice density | Better suited for new designs targeting PCIe Gen2 endpoints and DDR3/DDR4 memory controllers | Prefer for new industrial automation platforms where long-term availability and lower thermal envelope are critical |
Compared with XC5VLX30-1FFG676CES, the XCVU9P-2FLGA2104I delivers higher bandwidth but requires PCB redesign and thermal requalification, while the XC7K325T-2FFG901I offers better power efficiency and newer I/O standards at the expense of legacy configuration compatibility.
Availability
XC5VLX30-1FFG676CES is available at Aetrix Electronics and suitable for radar baseband processing, industrial motion control, and medical imaging backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX30-1FFG676CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support legacy Virtex families for aerospace, defense, and industrial applications requiring long-term obsolescence management.
The Virtex-5 family was designed for high-performance logic and serial connectivity in mission-critical embedded systems where deterministic timing and radiation tolerance are essential.
FAQ
What is the maximum supported configuration rate for XC5VLX30-1FFG676CES?
The XC5VLX30-1FFG676CES supports Master SelectMAP configuration at up to 100 MHz using its 32-bit parallel interface, achieving full bitstream load in under 100 ms. This rate is fixed by internal state machine timing and cannot be overclocked beyond datasheet specifications. The XC5VLX30-1FFG676CES does not support faster configuration modes such as Slave Serial or SPI Boot.
Does XC5VLX30-1FFG676CES support partial reconfiguration in the field?
Yes, the XC5VLX30-1FFG676CES supports runtime partial reconfiguration via its Internal Configuration Access Port (ICAP), allowing dynamic loading of functional modules without resetting the entire device. This capability is implemented in hardware and requires Xilinx ISE 14.7 or later toolchain support. The XC5VLX30-1FFG676CES must be configured initially before ICAP access becomes active.
What I/O standards are supported on XC5VLX30-1FFG676CES banks?
The XC5VLX30-1FFG676CES supports LVCMOS (1.2V–3.3V), LVDS, SSTL-18/25, HSTL-I/II, and Differential Signaling standards across its 12 I/O banks. Each bank operates independently with configurable VCCO and reference voltage. The XC5VLX30-1FFG676CES does not support MIPI D-PHY or sub-1V standards.
Is XC5VLX30-1FFG676CES qualified for automotive AEC-Q100?
No, the XC5VLX30-1FFG676CES is not AEC-Q100 qualified. It is rated for extended industrial temperature (-40°C to +100°C) and used in avionics and radar systems where qualification follows DO-254 or MIL-PRF-38535 requirements instead. The XC5VLX30-1FFG676CES lacks automotive-specific screening, burn-in, and failure rate reporting required by AEC-Q100 Grade 2.
Can XC5VLX30-1FFG676CES interface directly with DDR2 memory?
Yes, the XC5VLX30-1FFG676CES supports DDR2 SDRAM interfaces up to 400 Mbps per pin using dedicated I/O logic and phase-aligned clocking. It implements full fly-by topology support with programmable write leveling and read-leveling calibration. The XC5VLX30-1FFG676CES requires external termination resistors and careful PCB layout per Xilinx UG190 guidelines.
XC5VLX30-1FFG676CES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 30720
- Total RAM Bits:
- 1179648
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC5VLX30-1FFG676CES FAQ
1.How can I place an order for XC5VLX30-1FFG676CES through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX30-1FFG676CES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX30-1FFG676CES reliable?
The price and inventory of XC5VLX30-1FFG676CES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30-1FFG676CES is usually 5 days.
3.What payment methods are accepted for XC5VLX30-1FFG676CES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30-1FFG676CES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX30-1FFG676CES?
XC5VLX30-1FFG676CES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX30-1FFG676CES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX30-1FFG676CES?
For technical support, including XC5VLX30-1FFG676CES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30-1FFG676CES requirements.
6.How does Aetrix verify that XC5VLX30-1FFG676CES is sourced from the original manufacturer or authorized distributors?
All XC5VLX30-1FFG676CES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30-1FFG676CES meets industry standards.
7.What is the process for return or replacement of XC5VLX30-1FFG676CES?
All XC5VLX30-1FFG676CES units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30-1FFG676CES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX30-1FFG676CES part is unused and in its original packaging.
Return procedure for XC5VLX30-1FFG676CES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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