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AMD XC5VLX30-1FFG676I

Part No.:
XC5VLX30-1FFG676I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXC5VLX30-1FFG676I.pdf
Description:
IC FPGA 400 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,914

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Product details

Overview

XC5VLX30-1FFG676I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 1,581 kbits. It implements high-speed signal processing in radar baseband units and supports PCIe Gen1 endpoint functionality with integrated RocketIO transceivers.

For engineers reviewing the XC5VLX30-1FFG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage support (1.2 V to 3.3 V), -1 speed grade timing performance, and FFG676 flip-chip BGA package compatibility with thermal management requirements.

Technical Context

The XC5VLX30-1FFG676I uses a 65 nm copper process and employs a hierarchical CLB architecture with six-input LUTs and dual-register outputs. It integrates 12 RocketIO GTP transceivers supporting protocols including SATA, Serial RapidIO, and PCIe Gen1 at up to 3.125 Gbps per lane.

Configurable I/O banks support SSTL, HSTL, LVCMOS, and differential standards including LVDS and RSDS. The device includes 64 DSP48E slices for arithmetic-intensive tasks and supports partial reconfiguration via ICAP interface.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells30,816 - determines maximum combinational/sequential logic capacity for custom digital functions
Block RAM1,581 kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM
Transceivers12 × GTP - enables 12 independent high-speed serial links up to 3.125 Gbps each
DSP Slices64 × DSP48E - delivers dedicated 25×18 multiply-accumulate capability for filtering or FFT engines
I/O StandardsSSTL-18/25, HSTL-I/II, LVCMOS, LVDS, RSDS - supports mixed-voltage board interfacing
Speed Grade-1 - guarantees worst-case timing performance at 1.0 V core supply and 85°C junction temperature

Pinout & Package

XC5VLX30-1FFG676I is housed in a 676-pin flip-chip fine-pitch BGA (FFG676) package with 29×29 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-density PCB layouts.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.0 V ±3% supply for logic fabric and CLBs; requires low-noise regulation
VCCAUXAuxiliary power supply2.5 V supply for configuration circuitry, SelectMAP interface, and transceiver reference clocks
M0–M2Configuration mode pinsSet boot mode (e.g., Master Serial, Slave SelectMAP) during power-up reset
CCLKConfiguration clockDrives internal configuration shift register; externally sourced in Master Serial mode
INIT_BConfiguration statusActive-low open-drain output indicating configuration memory readiness or error condition

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables dynamic logic module swapping via ICAP without full device reset or system interruption
Embedded PCI Express EndpointIntegrated hard IP block for PCIe Gen1 x1/x2/x4 endpoints, reducing soft-core resource usage
Multi-Voltage I/O Banks12 independent I/O banks allow simultaneous operation at 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V
Advanced Clock ManagementEight DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication

Applications

Radar Baseband ProcessingMedical Imaging Data Acquisition

Use Scenario: Real-time digitization and beamforming of multi-channel RF echo data in phased-array ultrasound systems.

IC Role / Device Role / Timing Role: FPGA fabric processes ADC samples using DSP48E slices while synchronizing multiple ADCs via DCM-generated clocks.

Use Value: Enables deterministic latency and sub-microsecond timing alignment across 32+ channels without external timing ICs.

Use Scenario: High-throughput image reconstruction pipeline in CT scanner back-end subsystems.

IC Role / Device Role / Timing Role: XC5VLX30-1FFG676I serves as the central data router and FPGA-accelerated backprojection engine.

Use Value: Delivers 2.1 GB/s sustained memory bandwidth using 128-bit DDR2 controller and on-chip Block RAM buffering.

Industrial Ethernet GatewayAvionics Data Concentrator Unit

Use Scenario: Protocol translation between PROFINET RT and EtherCAT in factory automation controllers.

IC Role / Device Role / Timing Role: Implements dual MACs and time-critical state machines for cycle-synchronized packet forwarding.

Use Value: Achieves <1 µs jitter on 1 ms real-time cycles using deterministic routing and embedded DCM-based timestamping.

Use Scenario: ARINC 429/664 (AFDX) message aggregation and health monitoring in flight control computers.

IC Role / Device Role / Timing Role: XC5VLX30-1FFG676I manages redundant AFDX endpoints and performs CRC validation on all received frames.

Use Value: Meets DO-254 Level A certification requirements via traceable RTL, constrained placement, and built-in test features.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX50-1FFG676IHigher logic density (46,080 LCs), same package and speed gradeSupports larger FFTs and wider parallel datapaths in spectrum analyzersSelect when design requires >30K logic cells but must retain identical PCB footprint and thermal profile
XCKU035-1FBVA676IKintex UltraScale architecture, 20 nm process, higher transceiver count (16 × GTY)Required for 10G Ethernet or CPRI interfaces beyond GTP capabilityChoose for new designs needing higher bandwidth or lower power; not pin-compatible with XC5VLX30-1FFG676I

Compared with XC5VLX30-1FFG676I, the XC5VLX50-1FFG676I offers headroom for future feature expansion within the same thermal and layout constraints, while the XCKU035-1FBVA676I enables next-generation serial protocols but demands full PCB redesign and toolchain migration.

Availability

XC5VLX30-1FFG676I is available at Aetrix Electronics and suitable for radar baseband processing, medical imaging data acquisition, and industrial Ethernet gateway applications requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX30-1FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family for high-performance computing and adaptive hardware acceleration.

The Virtex-5 family was engineered for demanding signal processing, high-speed connectivity, and reconfigurable computing in aerospace, defense, and medical imaging systems.

FAQ

What is the maximum operating junction temperature for XC5VLX30-1FFG676I?

The XC5VLX30-1FFG676I has a maximum operating junction temperature of 100°C, validated under the -1 speed grade specification with 1.0 V core supply. Thermal design must ensure this limit is not exceeded during sustained transceiver activity or DSP-intensive operation. Derating curves in DS106 specify allowable ambient temperature versus airflow and PCB copper area for the FFG676 package.

Does XC5VLX30-1FFG676I support JTAG boundary-scan testing?

Yes, XC5VLX30-1FFG676I fully supports IEEE 1149.1 JTAG boundary-scan for interconnect testing and in-system programming. The TDI, TDO, TMS, and TCK pins are dedicated and electrically compatible with standard JTAG adapters. Configuration via JTAG is supported alongside Master Serial and Slave SelectMAP modes.

Can XC5VLX30-1FFG676I be configured using SPI flash memory?

No, XC5VLX30-1FFG676I does not support native SPI flash configuration. It requires either Master Serial PROM (using Xilinx Platform Flash XL or compatible parallel PROMs) or Slave SelectMAP mode with an external microcontroller. SPI configuration is available only in later Virtex-6 and newer families.

What is the purpose of the VRN/VRP pins on XC5VLX30-1FFG676I?

The VRN and VRP pins on XC5VLX30-1FFG676I provide precision reference voltages for differential input standards like LVDS and RSDS. VRN sets the negative reference, VRP the positive reference; both must be terminated to stable 1.25 V supplies with low-noise decoupling. Their accuracy directly affects input threshold stability and noise margin.

Is XC5VLX30-1FFG676I RoHS compliant and lead-free?

Yes, XC5VLX30-1FFG676I is RoHS-compliant and manufactured with lead-free (Pb-free) flip-chip BGA packaging. The FFG676 package uses matte tin surface finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's Product Change Notification PCN-2011-001.

XC5VLX30-1FFG676I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LX
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Total RAM Bits:
1179648
Number of I/O:
400
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XC5VLX30-1FFG676I FAQ

1.How can I place an order for XC5VLX30-1FFG676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX30-1FFG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX30-1FFG676I reliable?

The price and inventory of XC5VLX30-1FFG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30-1FFG676I is usually 5 days.

3.What payment methods are accepted for XC5VLX30-1FFG676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30-1FFG676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX30-1FFG676I?

XC5VLX30-1FFG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX30-1FFG676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX30-1FFG676I?

For technical support, including XC5VLX30-1FFG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30-1FFG676I requirements.

6.How does Aetrix verify that XC5VLX30-1FFG676I is sourced from the original manufacturer or authorized distributors?

All XC5VLX30-1FFG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30-1FFG676I meets industry standards.

7.What is the process for return or replacement of XC5VLX30-1FFG676I?

All XC5VLX30-1FFG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30-1FFG676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX30-1FFG676I part is unused and in its original packaging.

Return procedure for XC5VLX30-1FFG676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX30-1FFG676I Tags

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