AMD XC5VLX30-2FF324I
- Part No.:
- XC5VLX30-2FF324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-BBGA, FCBGA
- Datasheet:
-
XC5VLX30-2FF324I.pdf
- Description:
- IC FPGA 220 I/O 324FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VLX30-2FF324I from AMD (formerly Xilinx) is a Virtex-5 FPGA with 30,816 logic cells, 2.5 Gbps serial transceivers, and 256 KB block RAM. It features 324-pin Fine-Pitch Flip-Chip BGA (FF324) packaging and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). Used in high-speed protocol bridging and reconfigurable signal processing systems.
For engineers reviewing the XC5VLX30-2FF324I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver data rate, logic density, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and thermal performance in compact PCB layouts.
Technical Context
The XC5VLX30-2FF324I implements a hierarchical FPGA architecture with six distinct logic tile types, including SLICEM and SLICEL configurable logic blocks. It integrates 12 RocketIO GTP transceivers supporting protocols including PCI Express Gen1 and Serial RapidIO.
Configurable I/O banks support independent voltage operation per bank, enabling mixed-voltage interface design. The device uses 65 nm copper process technology and includes dedicated DSP48E slices for arithmetic-intensive tasks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 30,816 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 256 KB - supports on-chip data buffering, FIFOs, and lookup tables without external memory |
| Transceivers | 12 × GTP - enables 2.5 Gbps serial links for PCIe x1 or SRIO endpoints |
| I/O Pins | 240 user I/O - provides flexible interface count with bank-wise voltage isolation |
| Speed Grade | -2 - guarantees timing closure at worst-case industrial temperature and voltage conditions |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial deployment |
| Process Node | 65 nm - balances power efficiency and transistor density for mid-range FPGA performance |
Pinout & Package
Package: 324-pin Fine-Pitch Flip-Chip BGA (FF324), 19×19 mm body, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% input powering internal logic and CLBs |
| VCCAUX | Auxiliary supply | 2.5 V ±5% input for configuration circuitry and transceivers |
| VCCO_0 | I/O bank supply | Programmable 1.2–3.3 V output driver voltage per bank |
| CONFIG_IO | Configuration I/O | Dedicated pins for JTAG, SelectMAP, or Master SPI configuration modes |
| GTPTXN/GTPTXP | Transceiver differential pair | Current-mode logic outputs supporting 2.5 Gbps serial data transmission |
| CLK_IN | Global clock input | Low-skew input feeding global clock networks and PLL/MMCM resources |
Key Features
| Feature | Design Value |
|---|---|
| DSP48E Slices | 64 dedicated arithmetic units supporting 25×18 multiply-accumulate with pipeline registers |
| PCIe Endpoint Logic | Hard IP blocks for PCIe Gen1 x1 endpoint functionality, reducing soft-core resource usage |
| SelectIO Technology | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards (LVDS, RSDS) per I/O bank |
| Multi-Standard Transceivers | GTP transceivers configurable for SATA, CPRI, or custom 8B/10B protocols up to 2.5 Gbps |
| Partial Reconfiguration | Enables dynamic module swapping without full device reset or system interruption |
Applications
| Radar Signal Processing | Industrial Ethernet Gateway |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler filtering in phased-array radar subsystems. IC Role / Device Role / Timing Role: Configurable digital signal processor implementing adaptive FIR filters and FFT engines. Use Value: 240 I/O and 12 GTP transceivers enable parallel ADC/DAC interfacing and high-throughput data streaming to host processors. | Use Scenario: Protocol translation between PROFINET, EtherNet/IP, and Modbus TCP in factory automation gateways. IC Role / Device Role / Timing Role: Reconfigurable MAC-layer bridge with dual EMAC cores and time-sensitive networking support. Use Value: SelectIO flexibility allows simultaneous 2.5 V and 3.3 V PHY interfacing; -2 speed grade ensures deterministic latency under load. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: High-fidelity ultrasound data acquisition and preprocessing before GPU-based reconstruction. IC Role / Device Role / Timing Role: High-speed serializer/deserializer handling 16-channel LVDS echo data at 80 MSPS per channel. Use Value: 256 KB block RAM buffers raw frame data; GTP transceivers transmit compressed frames over PCIe to host memory. | Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and AFDX traffic into unified avionics backplane interfaces. IC Role / Device Role / Timing Role: Deterministic time-triggered switch fabric with hardware timestamping and error injection testing capability. Use Value: Industrial temperature rating and -2 speed grade ensure reliable operation in uncontrolled cabin environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX50-2FF324I | Higher logic density (47,680 LCs), same package and speed grade | Required when design exceeds 30K LC capacity or needs additional DSP48E slices | Select if future scalability or larger algorithm mapping is needed without changing PCB layout |
| XC6VLX240T-2FF1156I | Next-generation Virtex-6 architecture, 240K LCs, FF1156 package, higher transceiver count (24 GTX) | Targets designs requiring >2x logic capacity, PCIe Gen2, or multi-gigabit backplane interconnect | Choose for new designs needing higher bandwidth; not drop-in compatible due to package and pinout differences |
Compared with XC5VLX30-2FF324I, the XC5VLX50-2FF324I offers headroom within identical footprint and timing, while XC6VLX240T-2FF1156I delivers generational improvements in throughput and integration at the cost of board redesign.
Availability
XC5VLX30-2FF324I is available at Aetrix Electronics and suitable for radar signal processing, industrial Ethernet gateway, medical imaging interface, and avionics data concentrator applications requiring stable component supply across extended temperature ranges.
Supply support for XC5VLX30-2FF324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family. AMD is a global semiconductor leader focused on high-performance computing and adaptive SoC solutions.
The Virtex-5 family was designed for high-bandwidth, low-latency reconfigurable systems in aerospace, defense, and industrial infrastructure where deterministic timing and mixed-signal interface flexibility are critical.
FAQ
What is the maximum supported transceiver data rate for XC5VLX30-2FF324I?
The XC5VLX30-2FF324I integrates RocketIO GTP transceivers rated for 2.5 Gbps operation. This rate is guaranteed across the full industrial temperature range (-40°C to +100°C) and at -2 speed grade. Applications such as PCIe Gen1 x1 and Serial RapidIO use this native line rate without oversampling or gearbox logic.
Does XC5VLX30-2FF324I support partial reconfiguration?
Yes, XC5VLX30-2FF324I supports partial reconfiguration through Xilinx ISE design tools and associated bitstream generation flow. This capability allows dynamic replacement of functional modules-such as filter coefficients or protocol stacks-without resetting the entire device or halting system operation.
What I/O standards are supported by XC5VLX30-2FF324I?
XC5VLX30-2FF324I supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS and RSDS. Each of its 12 I/O banks can be independently configured for 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V VCCO, enabling mixed-voltage board-level interfacing.
Is XC5VLX30-2FF324I qualified for industrial temperature operation?
Yes, XC5VLX30-2FF324I is specified for industrial temperature range (-40°C to +100°C) and carries the 'I' suffix indicating industrial qualification. Thermal performance is validated per Xilinx DS106 and DS107 specifications, including junction temperature derating and thermal resistance measurements.
What configuration modes does XC5VLX30-2FF324I support?
XC5VLX30-2FF324I supports JTAG, Master SPI, Slave SelectMAP, and Serial NOR flash configuration modes. Dedicated CONFIG_IO pins route to internal configuration logic, and mode selection is controlled via MODE pins (M0–M2) during power-up initialization.
XC5VLX30-2FF324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 324-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 30720
- Total RAM Bits:
- 1179648
- Number of I/O:
- 220
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-FCBGA (19x19)
XC5VLX30-2FF324I FAQ
1.How can I place an order for XC5VLX30-2FF324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX30-2FF324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX30-2FF324I reliable?
The price and inventory of XC5VLX30-2FF324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30-2FF324I is usually 5 days.
3.What payment methods are accepted for XC5VLX30-2FF324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30-2FF324I transactions.
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4.How is shipping managed for XC5VLX30-2FF324I?
XC5VLX30-2FF324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX30-2FF324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX30-2FF324I?
For technical support, including XC5VLX30-2FF324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30-2FF324I requirements.
6.How does Aetrix verify that XC5VLX30-2FF324I is sourced from the original manufacturer or authorized distributors?
All XC5VLX30-2FF324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30-2FF324I meets industry standards.
7.What is the process for return or replacement of XC5VLX30-2FF324I?
All XC5VLX30-2FF324I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30-2FF324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX30-2FF324I part is unused and in its original packaging.
Return procedure for XC5VLX30-2FF324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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