My Inquiry
My Account
AMD XC5VLX30-2FF676I
- Part No.:
- XC5VLX30-2FF676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC5VLX30-2FF676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,215
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VLX30-2FF676I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 1,581 kbits. It implements high-speed signal processing in radar baseband subsystems and supports PCIe Gen1 x4 endpoint functionality with integrated hard IP.
For engineers reviewing the XC5VLX30-2FF676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), -2 speed grade timing performance, and FF676 flip-chip BGA package compatibility with thermal and routing constraints for high-density PCB layouts.
Technical Context
The XC5VLX30-2FF676I integrates six RocketIO GTP transceivers operating at 1.0–2.5 Gbps, dual-register 6-input LUTs, and dedicated DSP48E slices delivering 18×25-bit multiply-accumulate operations per slice. Its clocking architecture includes four DCMs and two PLLs supporting phase-matched multi-clock domain synchronization.
It implements SelectIO technology with support for LVDS, SSTL, HSTL, and differential signaling standards across 368 user I/O pins. Configuration occurs via Master SelectMAP or JTAG, with bitstream encryption enabled through AES-256 key storage in on-chip eFUSE.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 30,816 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Block RAM | 1,581 kbits - provides on-die memory for FIFOs, buffers, and lookup tables without external SRAM |
| Transceivers | 6 × GTP (1.0–2.5 Gbps) - enables serial protocols including SATA, PCI Express Gen1, and Serial RapidIO |
| I/O Pins | 368 user-configurable - supports mixed-voltage interfaces with programmable drive strength and slew rate |
| Speed Grade | -2 - guarantees timing closure at worst-case industrial temperature (-40°C to +100°C) and voltage (0.95 V core) |
| Package | FF676 - 27×27 mm flip-chip BGA with 1.0 mm pitch, requiring controlled-collapse solder joint process |
Pinout & Package
XC5VLX30-2FF676I is housed in a 676-pin flip-chip BGA (FF676) package with 368 user I/Os distributed across 12 banks, each supporting independent VCCO and VREF settings. Thermal pad center facilitates heat dissipation in high-clock-rate operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration shift register during master SPI or SelectMAP mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Control | Active-low input that resets configuration logic and clears internal state on assertion |
| M0–M2 | Mode Selection | Three-pin bus setting boot source (JTAG, Master SelectMAP, Slave SelectMAP, etc.) |
| GTPCLK0/1 | Transceiver Reference Clock | Dedicated differential inputs for GTP transceiver PLL reference, supporting 100–300 MHz ranges |
Key Features
| Feature | Design Value |
|---|---|
| Hard IP PCIe Endpoint | Integrated Gen1 x4 endpoint block eliminates need for external bridge IC and reduces latency by >30% vs. soft-core implementations |
| DSP48E Slices | 64 slices each performing 18×25-bit MAC in one cycle - accelerates FIR filtering and FFT stage computation |
| AES-256 Bitstream Encryption | eFUSE-based key storage prevents unauthorized readback and cloning of configured logic design |
| SelectIO Technology | Per-bank I/O voltage control enables direct interfacing with 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals without level shifters |
| DCM + PLL Clock Management | Four DCMs and two PLLs allow simultaneous generation of up to 12 phase-aligned clocks for multi-domain synchronous systems |
Applications
| Radar Baseband Processing | Medical Imaging Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler signal conditioning and beamforming in ground-based surveillance radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical digital down-conversion (DDC) and adaptive filtering; GTP transceivers stream IQ data to ADC/DAC interface ASICs. Use Value: 30,816 logic cells enable parallel filter banks; -2 speed grade ensures deterministic timing for sub-microsecond latency loops. | Use Scenario: High-fidelity ultrasound echo digitization and channel aggregation in portable imaging consoles. IC Role / Device Role / Timing Role: Configurable I/O synchronizes 128-channel ADC sampling; Block RAM buffers raw RF data before GPU-assisted reconstruction. Use Value: 368 I/O pins support full-channel parallel capture; SelectIO voltage flexibility matches mixed-signal front-end supply domains. |
| Industrial Ethernet Gateway | Avionics Data Concentrator Unit |
Use Scenario: Protocol translation between PROFINET RT and EtherCAT fieldbus networks in factory automation controllers. IC Role / Device Role / Timing Role: Hard PCIe endpoint connects to host ARM SoC; soft-core microblaze manages real-time packet scheduling and CRC validation. Use Value: Embedded PCIe Gen1 x4 link eliminates external switch; AES encryption secures firmware updates over untrusted networks. | Use Scenario: ARINC 429/664 (AFDX) message aggregation and time-triggered scheduling in flight control computers. IC Role / Device Role / Timing Role: DCM/PLL resources generate deterministic 10/100 MHz clocks for AFDX MAC timing; GTP links handle switched virtual circuit backplane traffic. Use Value: -40°C to +100°C industrial temp rating meets DO-254 environmental qualification; FF676 package supports conformal coating for vibration resistance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based protocol bridging and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX50T-2FF665I | Higher logic density (49,920 LC), 12 GTP transceivers, T-package variant with different thermal profile | Supports dual-lane PCIe Gen1 x2 + SATA Gen2 simultaneously; larger die increases power and routing complexity | Choose when additional transceivers or logic capacity is required beyond XC5VLX30-2FF676I's 6-GTP/30k-LC limit |
| XC6VLX240T-2FF1156I | Next-generation Virtex-6 architecture, 240,000 logic cells, GTX transceivers up to 6.6 Gbps, larger FF1156 package | Enables PCIe Gen2 x8 endpoints and 10G Ethernet MAC offload; requires new PCB layout and toolchain migration | Consider for long-term roadmap continuity where XC5VLX30-2FF676I lacks bandwidth or scalability for future upgrades |
Compared with XC5VLX30-2FF676I, the XC5VLX50T-2FF665I offers higher transceiver count but shares identical speed grade and I/O voltage support, while the XC6VLX240T-2FF1156I delivers generational improvements in bandwidth and logic scale at the cost of board redesign and toolchain requalification.
Availability
XC5VLX30-2FF676I is available at Aetrix Electronics and suitable for radar baseband subsystems, medical ultrasound data acquisition, and industrial protocol gateways requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX30-2FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Virtex-5 product lines for aerospace, defense, and industrial customers requiring long-term obsolescence management.
The Virtex-5 family was designed for high-performance signal processing and serial connectivity in mission-critical embedded systems where deterministic timing, radiation tolerance, and multi-standard I/O interoperability are essential.
FAQ
What is the maximum supported transceiver data rate for XC5VLX30-2FF676I?
The XC5VLX30-2FF676I integrates six RocketIO GTP transceivers rated for 1.0–2.5 Gbps operation. Each transceiver supports protocols including PCIe Gen1, SATA Gen2, and Serial RapidIO. The -2 speed grade ensures reliable operation at 2.5 Gbps under worst-case industrial temperature and voltage conditions. This rate is fixed per transceiver instance and cannot be overclocked beyond datasheet specifications.
Does XC5VLX30-2FF676I support JTAG boundary-scan testing?
Yes, XC5VLX30-2FF676I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. The TAP controller is accessible via dedicated TCK, TMS, TDI, and TDO pins, and supports instruction register access to device ID, bypass, and sample/preload operations. JTAG configuration mode is one of four boot options selected by M0–M2 pins.
What configuration modes are supported by XC5VLX30-2FF676I?
XC5VLX30-2FF676I supports four primary configuration modes: Master SelectMAP (parallel flash), Slave SelectMAP (host-controlled parallel), Master SPI (serial flash), and JTAG. Mode selection is determined by the logic levels on M0–M2 pins at power-up. All modes support AES-256 encrypted bitstreams loaded into on-chip eFUSE for secure deployment.
Is XC5VLX30-2FF676I qualified for automotive applications?
No, XC5VLX30-2FF676I is specified for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation. For automotive use, AMD recommends evaluating newer Versal or Kria families with formal automotive qualification paths.
Can XC5VLX30-2FF676I implement a PCIe Gen1 x4 endpoint without external components?
Yes, XC5VLX30-2FF676I includes a hard IP PCIe Gen1 x4 endpoint block compliant with PCI Express Base Specification 1.1. It requires only passive AC-coupling capacitors and proper reference clock routing - no external PHY or bridge IC is needed. The endpoint supports memory-mapped I/O, message-signaled interrupts, and hot-plug detection per specification.
XC5VLX30-2FF676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 30720
- Total RAM Bits:
- 1179648
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC5VLX30-2FF676I FAQ
1.How can I place an order for XC5VLX30-2FF676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX30-2FF676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX30-2FF676I reliable?
The price and inventory of XC5VLX30-2FF676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30-2FF676I is usually 5 days.
3.What payment methods are accepted for XC5VLX30-2FF676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30-2FF676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX30-2FF676I?
XC5VLX30-2FF676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX30-2FF676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX30-2FF676I?
For technical support, including XC5VLX30-2FF676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30-2FF676I requirements.
6.How does Aetrix verify that XC5VLX30-2FF676I is sourced from the original manufacturer or authorized distributors?
All XC5VLX30-2FF676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30-2FF676I meets industry standards.
7.What is the process for return or replacement of XC5VLX30-2FF676I?
All XC5VLX30-2FF676I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30-2FF676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX30-2FF676I part is unused and in its original packaging.
Return procedure for XC5VLX30-2FF676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VLX30-2FF676I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
