AMD XC5VLX30-2FFG676C
- Part No.:
- XC5VLX30-2FFG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC5VLX30-2FFG676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VLX30-2FFG676C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 1,581 kbits. It implements high-speed signal processing in radar baseband subsystems with deterministic latency and multi-gigabit I/O.
For engineers reviewing the XC5VLX30-2FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (VSR, XAUI), I/O bank voltage flexibility (1.2 V to 3.3 V), and configuration interface options (SPI, SelectMAP, JTAG).
Technical Context
The XC5VLX30-2FFG676C integrates 64 RocketIO GTP transceivers supporting 100 Mbps–2.5 Gbps operation, with built-in 8B/10B encoding and elastic buffers. Its CLB architecture includes dual 6-input LUTs per slice and distributed RAM for pipelined arithmetic.
Configuration is performed via Master SPI or Slave SelectMAP mode using external PROM or processor. The device supports partial reconfiguration and uses 1.0 V core voltage with dedicated PLLs for clock synthesis and jitter reduction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 30,816 - determines maximum combinational and sequential logic capacity for RTL implementation |
| Block RAM | 1,581 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external SRAM |
| Transceivers | 64 GTP - enables 64 independent serial lanes up to 2.5 Gbps, compliant with XAUI and VSR protocols |
| I/O Pins | 448 - supports high-pin-count interfaces including DDR2 SDRAM, PCIe x1, and parallel video buses |
| Core Voltage | 1.0 V ±3% - defines power delivery requirements and impacts dynamic power consumption and thermal design |
| Speed Grade | -2 - guarantees timing closure at worst-case junction temperature (85°C) and voltage (0.97 V) |
Pinout & Package
XC5VLX30-2FFG676C is housed in a 676-ball Fine-Pitch Flip-Chip BGA (FFG) package with 1.0 mm ball pitch and 27 × 27 array. The package supports thermal dissipation up to 12.5 W under typical operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master SPI mode; requires clean 50 MHz clock source |
| DIN | Serial Configuration Data Input | Receives bitstream from external SPI PROM; synchronous to CCLK edge |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset Input | Asynchronous active-low input that clears configuration memory and restarts boot process |
| M0–M2 | Mode Selection Inputs | Set configuration mode (SPI, SelectMAP, JTAG) at power-up; sampled on PROGRAM_B deassertion |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Multipliers | 64 × 18-bit DSP48E slices - enable real-time FIR filtering and FFT computation without external math ICs |
| PCI Express Endpoint | Integrated hard IP for PCIe x1 Gen1 - eliminates need for external bridge chips in host interface designs |
| Partial Reconfiguration | Runtime logic replacement in defined regions - allows dynamic function switching in mission-critical systems |
| Dedicated Clock Networks | 16 global clock buffers + 8 regional clocks - ensure low-skew distribution for high-frequency timing domains |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical digital down-conversion and CFAR algorithms with sub-cycle latency control. Use Value: 64 GTP transceivers interface directly to ADC/DAC JESD204B-compatible converters, reducing board-level routing complexity. | Use Scenario: High-throughput image reconstruction pipeline in CT scanner backends handling 16-channel parallel data streams. IC Role / Device Role / Timing Role: XC5VLX30-2FFG676C acts as a data concentrator and preprocessing engine before GPU-based rendering. Use Value: 1,581 kbits of Block RAM buffer raw projection data across multiple acquisition cycles without DRAM access latency. |
| Avionics Data Concentrators | Industrial Protocol Gateways |
Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation in flight control computers with deterministic response. IC Role / Device Role / Timing Role: Implements synchronized time-triggered communication stacks with hardware timestamping and CRC offload. Use Value: -2 speed grade ensures guaranteed timing closure under extended temperature range (−55°C to +100°C) required for avionics DO-254 compliance. | Use Scenario: Fieldbus protocol translation between PROFIBUS DP and EtherCAT in factory automation controllers. IC Role / Device Role / Timing Role: XC5VLX30-2FFG676C serves as dual-port memory-mapped bridge with real-time packet scheduling logic. Use Value: 448 I/O pins support simultaneous 32-bit parallel bus plus differential LVDS links for both legacy and modern industrial networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX50T-2FFG676C | Higher logic density (47,616 LC), same package, adds 4 RocketIO GTX transceivers (3.75 Gbps) | Required for wider FFTs or dual-channel radar processing; higher static power (1.8 W vs. 1.3 W) | Select when XC5VLX30-2FFG676C resource utilization exceeds 85% in critical paths |
| XCKU035-2FFVA676E | Kintex UltraScale architecture, 20 nm process, 16.3 GT/s transceivers, no native PCI Express hard IP | Supports PCIe Gen3 x4 but requires soft IP; superior DSP throughput per watt for AI inference acceleration | Choose for new designs targeting long-term roadmap continuity and higher bandwidth, not drop-in replacement |
Compared with XC5VLX50T-2FFG676C and XCKU035-2FFVA676E, the XC5VLX30-2FFG676C offers optimal balance of transceiver count, logic resources, and thermal envelope for cost-sensitive, radiation-tolerant embedded systems where legacy protocol support and proven qualification history are mandatory.
Availability
XC5VLX30-2FFG676C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX30-2FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Virtex family as part of its adaptive computing portfolio for high-performance, mission-critical applications.
The Virtex-5 family was engineered for deterministic, high-bandwidth digital signal processing in defense, aerospace, and scientific instrumentation where reliability and long-term support supersede raw node scaling.
FAQ
What is the maximum supported I/O standard for XC5VLX30-2FFG676C?
The XC5VLX30-2FFG676C supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS, BLVDS, and RSDS across its 448 user I/O pins. Each bank operates independently at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling mixed-voltage system interfacing without level shifters. This capability is confirmed in Xilinx DS100 and UG192 documentation.
Does XC5VLX30-2FFG676C support partial reconfiguration?
Yes, the XC5VLX30-2FFG676C supports runtime partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated frame-based bitstream loading mechanism. This allows dynamic swapping of logic modules while maintaining system operation - essential for adaptive radar waveform updates and protocol stack upgrades. Implementation requires Xilinx ISE 14.7 or later with PlanAhead tools.
What configuration modes are available for XC5VLX30-2FFG676C?
The XC5VLX30-2FFG676C supports Master SPI, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPIx4) configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for standalone boot; SelectMAP enables high-speed parallel loading from microprocessors. All modes are detailed in Xilinx UG191.
Is XC5VLX30-2FFG676C qualified for extended temperature operation?
The XC5VLX30-2FFG676C commercial-grade (-2FFG676C) variant is rated for 0°C to +85°C ambient. For extended temperature, the -2FFG676I industrial variant (–40°C to +100°C) is available. Both share identical pinout and logic resources. Thermal derating curves and junction temperature limits are specified in DS100 Table 12.
What is the purpose of the GTP transceivers in XC5VLX30-2FFG676C?
The 64 GTP transceivers in XC5VLX30-2FFG676C provide serial I/O capable of 100 Mbps to 2.5 Gbps per lane, with built-in 8B/10B encoding, elastic buffers, and clock correction. They are used for high-speed interfaces such as XAUI, VSR, CPRI, and custom SerDes links - enabling direct connection to ADCs, DACs, and optical modules without external retimers.
XC5VLX30-2FFG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 30720
- Total RAM Bits:
- 1179648
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC5VLX30-2FFG676C FAQ
1.How can I place an order for XC5VLX30-2FFG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX30-2FFG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX30-2FFG676C reliable?
The price and inventory of XC5VLX30-2FFG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30-2FFG676C is usually 5 days.
3.What payment methods are accepted for XC5VLX30-2FFG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30-2FFG676C transactions.
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XC5VLX30-2FFG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX30-2FFG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX30-2FFG676C?
For technical support, including XC5VLX30-2FFG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30-2FFG676C requirements.
6.How does Aetrix verify that XC5VLX30-2FFG676C is sourced from the original manufacturer or authorized distributors?
All XC5VLX30-2FFG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30-2FFG676C meets industry standards.
7.What is the process for return or replacement of XC5VLX30-2FFG676C?
All XC5VLX30-2FFG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30-2FFG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX30-2FFG676C part is unused and in its original packaging.
Return procedure for XC5VLX30-2FFG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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