AMD XC5VLX30-2FFG676I

Overview

XC5VLX30-2FFG676I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 1,440 kbits. It implements high-speed signal processing in radar baseband subsystems and supports PCIe Gen1 x4 endpoint functionality with integrated RocketIO transceivers.

For engineers reviewing the XC5VLX30-2FFG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), -2 speed grade timing performance, FFG676 flip-chip BGA package compatibility, and availability of dedicated DSP48E slices for arithmetic-intensive tasks.

Technical Context

The XC5VLX30-2FFG676I uses a 65 nm copper process and employs a hierarchical CLB architecture with six-input LUTs and dual-register flip-flops per slice. It integrates 64 RocketIO GTP transceivers operating up to 3.75 Gbps and supports multi-gigabit protocols including SATA, Serial RapidIO, and CPRI.

Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption supported through AES-256. The device includes 12 clock management tiles (CMT), each containing a DCM and PLL for precise clock synthesis and phase alignment across multiple domains.

Key Specifications

Pinout & Package

XC5VLX30-2FFG676I is housed in a 676-pin flip-chip fine-pitch BGA (FFG676) package with 0.8 mm pitch, 27 × 27 mm body size, and thermal pad for enhanced power dissipation in high-clock-rate operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XC5VLX30-2FFG676I, the XCVU9P offers scalable bandwidth but requires PCB redesign and toolchain migration, while the XC7K325T delivers greater logic capacity and modern tool support at the expense of legacy protocol compatibility and secure configuration.

Availability

XC5VLX30-2FFG676I is available at Aetrix Electronics and suitable for radar subsystems, medical imaging equipment, and avionics data concentrators requiring stable component supply over extended production lifecycles.

Supply support for XC5VLX30-2FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues to support legacy Virtex families for aerospace, defense, and industrial applications.

The Virtex-5 family was engineered for high-performance logic and serial connectivity in mission-critical embedded systems demanding deterministic timing and long-term obsolescence management.

FAQ

What is the maximum operating temperature for XC5VLX30-2FFG676I?

The XC5VLX30-2FFG676I is rated for industrial temperature range (–40°C to +100°C case temperature). This specification applies to the FFG676 package under specified airflow and PCB thermal design conditions. Thermal derating is required above 85°C ambient when operating at full transceiver utilization. The XC5VLX30-2FFG676I datasheet defines junction-to-case thermal resistance as 3.2°C/W for this package variant.

Does XC5VLX30-2FFG676I support partial reconfiguration?

Yes, the XC5VLX30-2FFG676I supports dynamic partial reconfiguration through its ICAP (Internal Configuration Access Port) and frame-based bitstream loading. This capability allows runtime modification of designated logic regions without disrupting active functions elsewhere in the FPGA fabric. Implementation requires Xilinx ISE 14.7 or later and adherence to strict placement constraints defined in UG191.

What configuration modes are supported by XC5VLX30-2FFG676I?

The XC5VLX30-2FFG676I supports Master SelectMAP, Slave SelectMAP, JTAG, and Master Serial PROM modes via M0–M2 pin settings. Configuration can be initiated from external SPI flash, parallel NOR flash, or host processor over dedicated I/O pins. The XC5VLX30-2FFG676I does not support passive serial or boundary-scan-only configuration without additional boot logic.

Is XC5VLX30-2FFG676I RoHS compliant?

Yes, the XC5VLX30-2FFG676I is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The FFG676 package uses matte tin finish on solder balls and complies with IPC/JEDEC J-STD-033 handling guidelines.

Can XC5VLX30-2FFG676I interface directly with DDR2 SDRAM?

Yes, the XC5VLX30-2FFG676I supports DDR2 SDRAM interfaces up to 400 MHz data rate using dedicated I/O banks configured for SSTL_18 I/O standard. It includes hardware-calibrated delay elements and DQS capture logic for reliable read/write timing. The XC5VLX30-2FFG676I requires external termination resistors and careful PCB layout matching to meet JEDEC DDR2 timing specifications.