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AMD XC5VLX30-3FF324C

Part No.:
XC5VLX30-3FF324C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
324-BBGA, FCBGA
Datasheet:
AetrixXC5VLX30-3FF324C.pdf
Description:
IC FPGA 220 I/O 324FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,729

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Product details

Overview

XC5VLX30-3FF324C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM with 1,152 kbits capacity. It implements high-speed signal processing in telecom line cards and supports PCIe Gen1 endpoint functionality in industrial control systems.

For engineers reviewing the XC5VLX30-3FF324C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage support (1.2 V to 3.3 V), -3 speed grade timing performance, and FF324 flip-chip BGA package compatibility with thermal and routing constraints.

Technical Context

The XC5VLX30-3FF324C uses a 65 nm copper process and integrates 64 DSP48E slices for arithmetic-intensive tasks, alongside 24 RocketIO GTP transceivers supporting protocols including SATA and Serial RapidIO. Its configuration interface includes SelectMAP and JTAG modes with dual-boot capability.

It supports differential I/O standards including LVDS, RSDS, and BLVDS across 488 user I/O pins distributed across 12 banks, each configurable for independent VCCO and VREF settings. Internal clock management uses DCMs and PLLs with jitter specifications of ±100 ps over temperature and voltage.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells30,816 - determines maximum combinational/sequential logic density for RTL implementation
Block RAM1,152 kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM
Speed Grade-3 - guarantees worst-case timing performance at highest operating frequency for critical paths
Transceivers24 × GTP - enables 2.5 Gbps serial links for backplane or chip-to-chip interconnect
I/O Pins488 user I/O - supports high-pin-count parallel interfaces like DDR2 SDRAM or custom parallel buses
Configuration ModeSelectMAP & JTAG - allows in-system programming and field updates via microcontroller or boundary-scan

Pinout & Package

XC5VLX30-3FF324C is housed in a 324-pin flip-chip fine-pitch BGA (FF324) package with 1.0 mm ball pitch, designed for controlled impedance routing and thermal dissipation in high-density PCBs.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockDrives synchronous loading of bitstream during master serial or SelectMAP mode
DINConfiguration Data InputSerial data input for master serial configuration; tied to FPGA internal shift register
PROGRAM_BConfiguration ResetActive-low asynchronous reset that clears configuration memory and initiates reconfiguration
INIT_BConfiguration StatusOpen-drain output indicating configuration completion or error during startup
TCK/TMS/TDI/TDOJTAG Boundary-ScanIEEE 1149.1-compliant test and debug interface for programming and verification

Key Features

FeatureDesign Value
DSP48E Slices64 dedicated arithmetic units enabling pipelined multiply-accumulate operations at 500+ MHz
Embedded Memory18-kbit Block RAM primitives configurable as 18K×1, 9K×2, or 36K×1 for flexible memory mapping
Multi-Voltage I/O Banks12 independent banks support mixed-voltage operation (1.2 V to 3.3 V) for interfacing with legacy and modern peripherals
DCM & PLL Clock ManagementFour DCMs and two PLLs provide phase alignment, frequency synthesis, and jitter reduction for multi-clock domain designs
GTP Transceiver Support24 transceivers with built-in 8B/10B encoding, elastic buffers, and PRBS pattern generation for link validation

Applications

Telecom Line CardIndustrial Motion Controller

Use Scenario: High-density packet processing and protocol translation in modular optical transport equipment.

IC Role / Device Role / Timing Role: FPGA fabric implements SERDES aggregation, MAC layer offload, and real-time traffic shaping logic.

Use Value: Enables 24-channel GTP transceiver utilization with deterministic latency under 200 ns for OAM&P packet handling.

Use Scenario: Closed-loop servo coordination across multiple axes using synchronized PWM and encoder feedback.

IC Role / Device Role / Timing Role: Configurable logic executes position loop calculations while DCMs generate precise 100 MHz system clocks and 10 MHz encoder sampling clocks.

Use Value: Delivers sub-microsecond jitter on critical timing signals required for <±1 LSB encoder resolution at 100 kRPM motor speeds.

PCIe Gen1 EndpointMedical Imaging Front-End

Use Scenario: Embedded vision system host interface connecting FPGA-accelerated image preprocessing to x86 host CPU.

IC Role / Device Role / Timing Role: PCIe endpoint core handles TLP generation, completion handling, and BAR address decoding with DMA engine integration.

Use Value: Supports sustained 2 Gbps payload throughput using 4-lane PCIe Gen1 with full-duplex streaming and low-latency interrupt assertion.

Use Scenario: Real-time ultrasound beamforming with parallel channel digitization and FIR filtering before data compression.

IC Role / Device Role / Timing Role: FPGA implements time-aligned 128-channel ADC sampling control, digital down-conversion, and dynamic range compression logic.

Use Value: Leverages 64 DSP48E slices to sustain 1.2 GOPS of fixed-point filtering at 40 MSPS per channel with zero pipeline stalls.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX50T-3FF665CHigher logic density (47,680 LC), 40 GTP transceivers, larger FF665 packageSupports wider PCIe Gen1 x8 or dual 10G Ethernet interfacesChoose when additional logic resources or transceiver count exceeds XC5VLX30-3FF324C capacity
XC6VLX240T-3FF1156C28 nm process, 240,000 logic cells, GTX transceivers up to 6.6 Gbps, larger FF1156 packageEnables migration to higher bandwidth protocols including PCIe Gen2 and 10GBase-RChoose for long-term design scalability where process node and bandwidth headroom are critical

Compared with XC5VLX30-3FF324C, the XC5VLX50T-3FF665C offers immediate resource headroom within the same Virtex-5 family and process node, while the XC6VLX240T-3FF1156C provides architectural evolution to 28 nm with doubled transceiver speed and 8× logic capacity-requiring PCB redesign but enabling next-generation protocol support.

Availability

XC5VLX30-3FF324C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX30-3FF324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA portfolio for high-performance reconfigurable computing.

The Virtex-5 family was engineered for applications demanding high logic density, multi-gigabit serial connectivity, and deterministic timing-targeting wired infrastructure, defense signal processing, and high-end test equipment.

FAQ

What is the maximum operating frequency of the XC5VLX30-3FF324C?

The XC5VLX30-3FF324C has a -3 speed grade, meaning its guaranteed maximum operating frequency for internal logic is 512 MHz for flip-flops and 400 MHz for distributed RAM. This rating applies under worst-case voltage and temperature conditions as defined in the Virtex-5 DC and Switching Characteristics datasheet.

Does the XC5VLX30-3FF324C support JTAG configuration?

Yes, the XC5VLX30-3FF324C supports IEEE 1149.1 JTAG configuration through dedicated TCK, TMS, TDI, and TDO pins. It enables boundary-scan testing, in-system programming, and partial reconfiguration debugging without requiring external configuration memory.

What I/O standards are supported by the XC5VLX30-3FF324C?

The XC5VLX30-3FF324C supports LVCMOS, LVTTL, SSTL, HSTL, LVDS, RSDS, and BLVDS across its 12 I/O banks. Each bank operates independently with selectable VCCO (1.2 V to 3.3 V) and optional VREF, enabling mixed-voltage board designs.

How much embedded memory does the XC5VLX30-3FF324C contain?

The XC5VLX30-3FF324C contains 1,152 kbits of total Block RAM, implemented as 64 blocks of 18-kbit RAM. Each block can be configured as single-port RAM, dual-port RAM, or shift register, supporting true dual-port access with independent read/write clocks.

Is the XC5VLX30-3FF324C RoHS compliant?

Yes, the XC5VLX30-3FF324C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FF324 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) handling guidelines.

XC5VLX30-3FF324C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LX
Package/Case:
324-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Total RAM Bits:
1179648
Number of I/O:
220
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
324-FCBGA (19x19)

XC5VLX30-3FF324C FAQ

1.How can I place an order for XC5VLX30-3FF324C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX30-3FF324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX30-3FF324C reliable?

The price and inventory of XC5VLX30-3FF324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30-3FF324C is usually 5 days.

3.What payment methods are accepted for XC5VLX30-3FF324C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30-3FF324C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX30-3FF324C?

XC5VLX30-3FF324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX30-3FF324C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX30-3FF324C?

For technical support, including XC5VLX30-3FF324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30-3FF324C requirements.

6.How does Aetrix verify that XC5VLX30-3FF324C is sourced from the original manufacturer or authorized distributors?

All XC5VLX30-3FF324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30-3FF324C meets industry standards.

7.What is the process for return or replacement of XC5VLX30-3FF324C?

All XC5VLX30-3FF324C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30-3FF324C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX30-3FF324C part is unused and in its original packaging.

Return procedure for XC5VLX30-3FF324C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX30-3FF324C Tags

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