AMD XC5VLX30-3FF324C
- Part No.:
- XC5VLX30-3FF324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-BBGA, FCBGA
- Datasheet:
-
XC5VLX30-3FF324C.pdf
- Description:
- IC FPGA 220 I/O 324FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,729
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VLX30-3FF324C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM with 1,152 kbits capacity. It implements high-speed signal processing in telecom line cards and supports PCIe Gen1 endpoint functionality in industrial control systems.
For engineers reviewing the XC5VLX30-3FF324C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage support (1.2 V to 3.3 V), -3 speed grade timing performance, and FF324 flip-chip BGA package compatibility with thermal and routing constraints.
Technical Context
The XC5VLX30-3FF324C uses a 65 nm copper process and integrates 64 DSP48E slices for arithmetic-intensive tasks, alongside 24 RocketIO GTP transceivers supporting protocols including SATA and Serial RapidIO. Its configuration interface includes SelectMAP and JTAG modes with dual-boot capability.
It supports differential I/O standards including LVDS, RSDS, and BLVDS across 488 user I/O pins distributed across 12 banks, each configurable for independent VCCO and VREF settings. Internal clock management uses DCMs and PLLs with jitter specifications of ±100 ps over temperature and voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 30,816 - determines maximum combinational/sequential logic density for RTL implementation |
| Block RAM | 1,152 kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM |
| Speed Grade | -3 - guarantees worst-case timing performance at highest operating frequency for critical paths |
| Transceivers | 24 × GTP - enables 2.5 Gbps serial links for backplane or chip-to-chip interconnect |
| I/O Pins | 488 user I/O - supports high-pin-count parallel interfaces like DDR2 SDRAM or custom parallel buses |
| Configuration Mode | SelectMAP & JTAG - allows in-system programming and field updates via microcontroller or boundary-scan |
Pinout & Package
XC5VLX30-3FF324C is housed in a 324-pin flip-chip fine-pitch BGA (FF324) package with 1.0 mm ball pitch, designed for controlled impedance routing and thermal dissipation in high-density PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives synchronous loading of bitstream during master serial or SelectMAP mode |
| DIN | Configuration Data Input | Serial data input for master serial configuration; tied to FPGA internal shift register |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| INIT_B | Configuration Status | Open-drain output indicating configuration completion or error during startup |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan | IEEE 1149.1-compliant test and debug interface for programming and verification |
Key Features
| Feature | Design Value |
|---|---|
| DSP48E Slices | 64 dedicated arithmetic units enabling pipelined multiply-accumulate operations at 500+ MHz |
| Embedded Memory | 18-kbit Block RAM primitives configurable as 18K×1, 9K×2, or 36K×1 for flexible memory mapping |
| Multi-Voltage I/O Banks | 12 independent banks support mixed-voltage operation (1.2 V to 3.3 V) for interfacing with legacy and modern peripherals |
| DCM & PLL Clock Management | Four DCMs and two PLLs provide phase alignment, frequency synthesis, and jitter reduction for multi-clock domain designs |
| GTP Transceiver Support | 24 transceivers with built-in 8B/10B encoding, elastic buffers, and PRBS pattern generation for link validation |
Applications
| Telecom Line Card | Industrial Motion Controller |
|---|---|
Use Scenario: High-density packet processing and protocol translation in modular optical transport equipment. IC Role / Device Role / Timing Role: FPGA fabric implements SERDES aggregation, MAC layer offload, and real-time traffic shaping logic. Use Value: Enables 24-channel GTP transceiver utilization with deterministic latency under 200 ns for OAM&P packet handling. | Use Scenario: Closed-loop servo coordination across multiple axes using synchronized PWM and encoder feedback. IC Role / Device Role / Timing Role: Configurable logic executes position loop calculations while DCMs generate precise 100 MHz system clocks and 10 MHz encoder sampling clocks. Use Value: Delivers sub-microsecond jitter on critical timing signals required for <±1 LSB encoder resolution at 100 kRPM motor speeds. |
| PCIe Gen1 Endpoint | Medical Imaging Front-End |
Use Scenario: Embedded vision system host interface connecting FPGA-accelerated image preprocessing to x86 host CPU. IC Role / Device Role / Timing Role: PCIe endpoint core handles TLP generation, completion handling, and BAR address decoding with DMA engine integration. Use Value: Supports sustained 2 Gbps payload throughput using 4-lane PCIe Gen1 with full-duplex streaming and low-latency interrupt assertion. | Use Scenario: Real-time ultrasound beamforming with parallel channel digitization and FIR filtering before data compression. IC Role / Device Role / Timing Role: FPGA implements time-aligned 128-channel ADC sampling control, digital down-conversion, and dynamic range compression logic. Use Value: Leverages 64 DSP48E slices to sustain 1.2 GOPS of fixed-point filtering at 40 MSPS per channel with zero pipeline stalls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX50T-3FF665C | Higher logic density (47,680 LC), 40 GTP transceivers, larger FF665 package | Supports wider PCIe Gen1 x8 or dual 10G Ethernet interfaces | Choose when additional logic resources or transceiver count exceeds XC5VLX30-3FF324C capacity |
| XC6VLX240T-3FF1156C | 28 nm process, 240,000 logic cells, GTX transceivers up to 6.6 Gbps, larger FF1156 package | Enables migration to higher bandwidth protocols including PCIe Gen2 and 10GBase-R | Choose for long-term design scalability where process node and bandwidth headroom are critical |
Compared with XC5VLX30-3FF324C, the XC5VLX50T-3FF665C offers immediate resource headroom within the same Virtex-5 family and process node, while the XC6VLX240T-3FF1156C provides architectural evolution to 28 nm with doubled transceiver speed and 8× logic capacity-requiring PCB redesign but enabling next-generation protocol support.
Availability
XC5VLX30-3FF324C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX30-3FF324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA portfolio for high-performance reconfigurable computing.
The Virtex-5 family was engineered for applications demanding high logic density, multi-gigabit serial connectivity, and deterministic timing-targeting wired infrastructure, defense signal processing, and high-end test equipment.
FAQ
What is the maximum operating frequency of the XC5VLX30-3FF324C?
The XC5VLX30-3FF324C has a -3 speed grade, meaning its guaranteed maximum operating frequency for internal logic is 512 MHz for flip-flops and 400 MHz for distributed RAM. This rating applies under worst-case voltage and temperature conditions as defined in the Virtex-5 DC and Switching Characteristics datasheet.
Does the XC5VLX30-3FF324C support JTAG configuration?
Yes, the XC5VLX30-3FF324C supports IEEE 1149.1 JTAG configuration through dedicated TCK, TMS, TDI, and TDO pins. It enables boundary-scan testing, in-system programming, and partial reconfiguration debugging without requiring external configuration memory.
What I/O standards are supported by the XC5VLX30-3FF324C?
The XC5VLX30-3FF324C supports LVCMOS, LVTTL, SSTL, HSTL, LVDS, RSDS, and BLVDS across its 12 I/O banks. Each bank operates independently with selectable VCCO (1.2 V to 3.3 V) and optional VREF, enabling mixed-voltage board designs.
How much embedded memory does the XC5VLX30-3FF324C contain?
The XC5VLX30-3FF324C contains 1,152 kbits of total Block RAM, implemented as 64 blocks of 18-kbit RAM. Each block can be configured as single-port RAM, dual-port RAM, or shift register, supporting true dual-port access with independent read/write clocks.
Is the XC5VLX30-3FF324C RoHS compliant?
Yes, the XC5VLX30-3FF324C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FF324 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) handling guidelines.
XC5VLX30-3FF324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 324-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 30720
- Total RAM Bits:
- 1179648
- Number of I/O:
- 220
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-FCBGA (19x19)
XC5VLX30-3FF324C FAQ
1.How can I place an order for XC5VLX30-3FF324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX30-3FF324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX30-3FF324C reliable?
The price and inventory of XC5VLX30-3FF324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30-3FF324C is usually 5 days.
3.What payment methods are accepted for XC5VLX30-3FF324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30-3FF324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX30-3FF324C?
XC5VLX30-3FF324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX30-3FF324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX30-3FF324C?
For technical support, including XC5VLX30-3FF324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30-3FF324C requirements.
6.How does Aetrix verify that XC5VLX30-3FF324C is sourced from the original manufacturer or authorized distributors?
All XC5VLX30-3FF324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30-3FF324C meets industry standards.
7.What is the process for return or replacement of XC5VLX30-3FF324C?
All XC5VLX30-3FF324C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30-3FF324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX30-3FF324C part is unused and in its original packaging.
Return procedure for XC5VLX30-3FF324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VLX30-3FF324C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

