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AMD XC5VLX30-3FFG324C
- Part No.:
- XC5VLX30-3FFG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-BBGA, FCBGA
- Datasheet:
-
XC5VLX30-3FFG324C.pdf
- Description:
- IC FPGA 220 I/O 324FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,080
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Product details
Overview
XC5VLX30-3FFG324C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 1,581 kbits. It implements high-speed signal processing in radar baseband units and supports PCIe Gen1 endpoint functionality with integrated RocketIO transceivers.
For engineers reviewing the XC5VLX30-3FFG324C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), -3 speed grade timing margin, FFG324 flip-chip BGA package compatibility, and RocketIO transceiver lane count.
Technical Context
The XC5VLX30-3FFG324C uses a 65 nm copper process and employs a hierarchical CLB architecture with six-input LUTs and dual-register outputs. It integrates 12 RocketIO GTP transceivers supporting 100 Mbps–2.5 Gbps operation and 64 DSP48E slices for arithmetic-intensive tasks.
Configuration occurs via Master SelectMAP or JTAG, with support for multi-boot through internal SPI flash. The device includes dedicated clock management tiles with DCM and PLL resources for jitter reduction and frequency synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 30,816 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 1,581 kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM |
| RocketIO GTP | 12 lanes - enables 12 independent serial links up to 2.5 Gbps each for high-speed interconnect |
| DSP48E Slices | 64 - delivers 18×25-bit multiply-accumulate capability per slice for real-time filtering |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for this family's performance tier |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - supports interface to DDR2 memory, ADCs, and FPGA-to-FPGA links |
| Package | FFG324 - 324-pin flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
XC5VLX30-3FFG324C is housed in a 324-pin flip-chip fine-pitch BGA (FFG324) package with 1.0 mm ball pitch, designed for low-inductance power delivery and controlled impedance routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration state machine during master mode programming |
| DIN | Configuration Data In | Serial data input for SelectMAP or slave serial configuration modes |
| INIT_B | Configuration Status | Active-low open-drain output indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts boot |
| M0–M2 | Mode Selection | Three-pin bus selecting one of eight configuration modes (e.g., Master SelectMAP, JTAG) |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock | Differential input for RocketIO GTP transceiver clocking with sub-100 ps jitter tolerance |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm Low-Power Process | Reduces dynamic and static power versus 90 nm predecessors while enabling higher density |
| Dual-Register LUT Outputs | Enables pipelined logic stages without additional register resources, improving throughput |
| Integrated PCI Express Endpoint | Supports x1 or x4 link widths with hard IP for protocol handling and DMA control |
| DCM + PLL Clock Management | Provides phase alignment, frequency synthesis, and jitter filtering across up to 16 clock domains |
| SelectMAP Configuration | Allows parallel programming at up to 100 MHz for fast field updates and partial reconfiguration |
Applications
| Radar Baseband Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse compression in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; RocketIO links stream ADC samples to host processor. Use Value: 64 DSP48E slices enable simultaneous 16-channel FFTs with deterministic latency under 2 µs. | Use Scenario: CT scanner image reconstruction pipeline interfacing with high-speed ADCs and DDR2 frame buffers. IC Role / Device Role / Timing Role: Configurable logic manages pixel data flow, performs back-projection, and controls memory access timing. Use Value: 1,581 kbits of Block RAM eliminates need for external FIFOs in 12-bit, 80 MSPS data paths. |
| Industrial Machine Vision Controller | Avionics Data Concentrator |
Use Scenario: High-resolution line-scan camera interface with real-time defect classification using on-FPGA neural inference. IC Role / Device Role / Timing Role: Implements MIPI CSI-2 receiver, preprocessing pipeline, and lightweight CNN accelerator. Use Value: -3 speed grade ensures reliable operation at 200 MHz system clock with 1.2 V core supply in extended temperature range. | Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation unit in flight control subsystems. IC Role / Device Role / Timing Role: FPGA acts as protocol bridge and time-stamped message router between legacy avionics buses and Ethernet backbone. Use Value: Integrated DCMs maintain < ±50 ppm accuracy across –40°C to +85°C for deterministic timestamping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX50-3FFG665C | Higher logic capacity (47,680 LC), more Block RAM (2,448 kbits), 20 RocketIO lanes | Required for larger FFT sizes or multi-channel SDR frontends needing >30k LC | Choose when XC5VLX30-3FFG324C lacks sufficient resources for full algorithm mapping |
| XCKU035-2FFVA676E | UltraScale architecture, 215K logic cells, 12.5 Gbps GTY transceivers, lower static power | Targets next-gen designs requiring PCIe Gen3, higher bandwidth, or advanced power gating | XC5VLX30-3FFG324C remains preferred for cost-sensitive legacy upgrades with existing PCB layout |
Compared with XC5VLX50-3FFG665C and XCKU035-2FFVA676E, the XC5VLX30-3FFG324C offers optimal balance of transceiver count, logic density, and thermal profile for mid-scale embedded signal processing where footprint and BOM cost constrain scalability.
Availability
XC5VLX30-3FFG324C is available at Aetrix Electronics and suitable for radar baseband processing, medical imaging backend systems, and industrial machine vision controllers requiring stable component supply over extended production lifecycles.
Supply support for XC5VLX30-3FFG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Virtex FPGA product line for high-performance programmable logic solutions targeting aerospace, defense, and wired infrastructure markets.
The Virtex-5 family, including XC5VLX30-3FFG324C, was engineered for compute-intensive embedded applications requiring hardened serial transceivers, high logic density, and deterministic timing across wide temperature ranges.
FAQ
What is the maximum supported transceiver data rate for XC5VLX30-3FFG324C?
The XC5VLX30-3FFG324C integrates RocketIO GTP transceivers rated for 100 Mbps to 2.5 Gbps operation. Each of the 12 lanes achieves 2.5 Gbps with PRBS7 pattern compliance and <1.0 UI peak-to-peak jitter under specified power and thermal conditions. This rate is confirmed in Xilinx UG192 v3.1, Table 1-2.
Does XC5VLX30-3FFG324C support partial reconfiguration?
Yes, XC5VLX30-3FFG324C supports partial reconfiguration via the ICAP (Internal Configuration Access Port) and dedicated bitstream framing. This allows dynamic logic module swapping without resetting the entire device. Implementation requires PlanAhead 14.7 or later and adherence to Xilinx XAPP290 guidelines for floorplanning and bitstream generation.
What configuration modes are supported by XC5VLX30-3FFG324C?
XC5VLX30-3FFG324C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial modes. Mode selection is controlled by M0–M2 pins at power-up. Master SelectMAP enables autonomous loading from external PROM at up to 100 MHz, while JTAG is used for debugging and boundary-scan testing.
Is XC5VLX30-3FFG324C qualified for automotive applications?
No, XC5VLX30-3FFG324C is not AEC-Q100 qualified and is not recommended for automotive safety-critical systems. Its commercial-grade temperature range (0°C to +85°C) and absence of automotive-specific reliability screening make it unsuitable for under-hood deployment. For such use cases, AMD recommends evaluating the XA-Virtex-5 family instead.
What is the total amount of embedded memory in XC5VLX30-3FFG324C?
XC5VLX30-3FFG324C contains 1,581 kbits of distributed and block RAM. This includes 1,452 kbits of true dual-port Block RAM (18 kbit per block × 82 blocks) and 129 kbits of distributed RAM implemented in LUTs. Memory is accessible synchronously with configurable width and depth per instance.
XC5VLX30-3FFG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 324-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 30720
- Total RAM Bits:
- 1179648
- Number of I/O:
- 220
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-FCBGA (19x19)
XC5VLX30-3FFG324C FAQ
1.How can I place an order for XC5VLX30-3FFG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX30-3FFG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX30-3FFG324C reliable?
The price and inventory of XC5VLX30-3FFG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30-3FFG324C is usually 5 days.
3.What payment methods are accepted for XC5VLX30-3FFG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30-3FFG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX30-3FFG324C?
XC5VLX30-3FFG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX30-3FFG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX30-3FFG324C?
For technical support, including XC5VLX30-3FFG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30-3FFG324C requirements.
6.How does Aetrix verify that XC5VLX30-3FFG324C is sourced from the original manufacturer or authorized distributors?
All XC5VLX30-3FFG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30-3FFG324C meets industry standards.
7.What is the process for return or replacement of XC5VLX30-3FFG324C?
All XC5VLX30-3FFG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30-3FFG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX30-3FFG324C part is unused and in its original packaging.
Return procedure for XC5VLX30-3FFG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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