AMD XC5VLX30-3FFG676C
- Part No.:
- XC5VLX30-3FFG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC5VLX30-3FFG676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VLX30-3FFG676C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 1,581 kbits. It implements high-speed signal processing in radar baseband subsystems with deterministic latency and multi-gigabit I/O.
For engineers reviewing the XC5VLX30-3FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include speed grade (-3), FFG676 package compatibility, transceiver lane count (4), and DSP48E slice availability (64).
Technical Context
The XC5VLX30-3FFG676C integrates 64 DSP48E slices for fixed-point arithmetic and filtering, and supports SelectIO standards including LVDS, SSTL, and HSTL across 360 user I/O pins. Its clocking architecture includes four DCMs and two PLLs for jitter reduction and phase alignment.
This device uses 65 nm copper process technology and operates at core voltage of 1.0 V ±3%. It supports partial reconfiguration and offers built-in JTAG boundary-scan compliance per IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 30,816 - provides gate count equivalent to ~100K ASIC gates for complex control and datapath logic |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions |
| Transceivers | 4 × 2.5 Gbps - enables PCIe Gen1 x4 or Serial RapidIO links without external retimers |
| Block RAM | 1,581 kbits - supports dual-port FIFOs up to 256 deep × 36 wide for streaming data buffering |
| DSP Slices | 64 DSP48E - delivers 18 × 25-bit multiply-accumulate per slice at 500 MHz for real-time FIR filtering |
| I/O Pins | 360 user I/O - compatible with 1.2–3.3 V signaling standards including LVDS and SSTL-2 |
Pinout & Package
XC5VLX30-3FFG676C is housed in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Thermal characteristics support industrial temperature range operation (–40°C to +100°C junction).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% input required; decoupling critical for transceiver jitter performance |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, DCMs, and SelectIO banks |
| VRP/VRN | Reference voltage terminals | Enable internal termination calibration for differential I/O standards like LVDS |
| M0–M2 | Configuration mode pins | Determine boot source (SPI, BPI, or JTAG) at power-up |
| CLK_IN | Primary clock input | Accepts single-ended or differential clocks up to 800 MHz for DCM/PLL input |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping during runtime-critical for adaptive radar waveform updates without system reset |
| Embedded PCI Express Endpoint | Integrated hard IP block supporting Gen1 x1/x2/x4 configurations with <100 ns transaction latency |
| Multi-Voltage I/O Banks | 12 independent banks allow mixed-voltage interfaces (1.2 V to 3.3 V) on same device-reduces level-shifter count |
| System Monitor | On-die analog-to-digital converter monitors die temperature and supply voltages with ±5°C accuracy |
| JTAG Boundary Scan | IEEE 1149.1-compliant test access port enables production board-level diagnostics and interconnect verification |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT and CFAR algorithms; transceivers interface with ADC/DAC over JESD204B-like parallel LVDS links. Use Value: Deterministic 5 ns routing delay and 64 DSP48E slices enable sub-microsecond latency for target detection loops. | Use Scenario: High-throughput image reconstruction pipeline in portable ultrasound machines using raw RF data streams. IC Role / Device Role / Timing Role: XC5VLX30-3FFG676C acts as digital backend controller-orchestrating DMA transfers, applying scan conversion, and compressing DICOM output. Use Value: 360 I/O pins support concurrent connections to 16-channel ADCs, DDR2 memory, and USB 2.0 PHY with no external glue logic. |
| Industrial Ethernet Gateway | Avionics Data Concentrator |
Use Scenario: Protocol translation between PROFINET RT and EtherCAT in factory automation controllers. IC Role / Device Role / Timing Role: Implements dual MACs with hardware timestamping and deterministic traffic shaping using embedded tri-mode Ethernet MACs. Use Value: -3 speed grade ensures sub-1 µs cycle time compliance under worst-case temperature and voltage variation. | Use Scenario: ARINC 429/664 (AFDX) data aggregation unit in regional aircraft flight control subsystems. IC Role / Device Role / Timing Role: XC5VLX30-3FFG676C serves as deterministic switch fabric-buffering, prioritizing, and forwarding time-triggered AFDX frames. Use Value: Built-in System Monitor provides real-time junction temperature reporting required for DO-254 safety certification evidence. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture; 258K LUTs; 16.3 Gbps GTY transceivers; 0.85 V core | Supports PCIe Gen4 and 100G Ethernet; higher power density and thermal envelope | Choose for new designs requiring >5 Gbps serial bandwidth or DDR4 memory interface |
| XC6VLX240T-3FFG1156C | Virtex-6 family; 240K logic cells; 6.6 Gbps GTX transceivers; larger FFG1156 package | Higher logic capacity but lower transceiver speed; mature qualification for extended temp industrial use | Prefer when migrating legacy Virtex-5 designs needing more fabric resources without upgrading transceiver rate |
Compared with XC5VLX30-3FFG676C, the XCVU9P-2FLGA2104I delivers 8× more logic and 6.5× faster transceivers but requires revised power delivery and thermal design; the XC6VLX240T-3FFG1156C offers proven reliability and pin-compatible migration path within the same PCB footprint family.
Availability
XC5VLX30-3FFG676C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and industrial Ethernet gateway applications requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX30-3FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA portfolio for high-performance computing and adaptive hardware acceleration.
The Virtex-5 family was engineered for compute-intensive, high-bandwidth applications in defense, aerospace, and medical imaging-emphasizing deterministic timing, multi-standard I/O, and embedded processing capability.
FAQ
What is the maximum operating frequency of the XC5VLX30-3FFG676C?
The XC5VLX30-3FFG676C is rated for a -3 speed grade, guaranteeing timing closure up to 500 MHz system clock frequency under worst-case industrial temperature and voltage conditions. This rating applies to internal logic paths and is verified via static timing analysis using Xilinx ISE tools with the -3 timing model.
Does the XC5VLX30-3FFG676C support partial reconfiguration?
Yes, the XC5VLX30-3FFG676C supports partial reconfiguration through its FPGA fabric and configuration logic. This capability allows dynamic swapping of logic modules during runtime without resetting the entire device-enabling adaptive radar waveform updates and protocol stack switching in communication gateways.
What I/O standards are supported by the XC5VLX30-3FFG676C?
The XC5VLX30-3FFG676C supports 15 SelectIO standards including LVDS, SSTL-2, SSTL-3, HSTL-I, HSTL-II, and PCI-X. Each of its 12 I/O banks operates independently at voltages from 1.2 V to 3.3 V, enabling mixed-voltage interface designs without external level shifters.
Is the XC5VLX30-3FFG676C qualified for automotive or aerospace applications?
The XC5VLX30-3FFG676C is specified for industrial temperature range (–40°C to +100°C junction) and has been deployed in DO-254-certifiable avionics subsystems. While not AEC-Q100 qualified, its radiation-tolerant design and System Monitor features support aerospace and defense applications requiring high reliability.
What configuration modes does the XC5VLX30-3FFG676C support?
The XC5VLX30-3FFG676C supports master SPI, slave serial, slave parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up, allowing flexible integration with flash memory, microcontrollers, or boundary-scan test infrastructure.
XC5VLX30-3FFG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 30720
- Total RAM Bits:
- 1179648
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC5VLX30-3FFG676C FAQ
1.How can I place an order for XC5VLX30-3FFG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX30-3FFG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX30-3FFG676C reliable?
The price and inventory of XC5VLX30-3FFG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30-3FFG676C is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30-3FFG676C transactions.
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Once your XC5VLX30-3FFG676C order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for XC5VLX30-3FFG676C?
For technical support, including XC5VLX30-3FFG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30-3FFG676C requirements.
6.How does Aetrix verify that XC5VLX30-3FFG676C is sourced from the original manufacturer or authorized distributors?
All XC5VLX30-3FFG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30-3FFG676C meets industry standards.
7.What is the process for return or replacement of XC5VLX30-3FFG676C?
All XC5VLX30-3FFG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30-3FFG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX30-3FFG676C part is unused and in its original packaging.
Return procedure for XC5VLX30-3FFG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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