AMD XC5VLX30T-1FFG323C
- Part No.:
- XC5VLX30T-1FFG323C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 323-BBGA, FCBGA
- Datasheet:
-
XC5VLX30T-1FFG323C.pdf
- Description:
- IC FPGA 172 I/O 323FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,533
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VLX30T-1FFG323C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 1,581 kbits. It implements high-speed signal processing in radar baseband units and supports PCIe Gen1 endpoint functionality with integrated RocketIO transceivers.
For engineers reviewing the XC5VLX30T-1FFG323C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O standard support (LVDS, SSTL, HSTL), embedded multiplier usage, and thermal performance in compact RF front-end enclosures.
Technical Context
The XC5VLX30T-1FFG323C belongs to the Virtex-5 LXT family and integrates 12 RocketIO GTP transceivers operating up to 3.75 Gbps, with dedicated PCI Express v1.1 hard IP blocks. Its architecture includes 64 DSP48E slices for filtering and FFT acceleration, and SelectIO technology supporting 24 I/O standards including LVDS DCI and SSTL-2.
It uses 65 nm copper process technology, features dual-register flip-flops per CLB, and supports partial reconfiguration. Configuration occurs via Master SelectMAP or Serial PROM mode using the internal configuration controller.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 30,816 - determines maximum combinational/sequential logic capacity for protocol stack implementation |
| Block RAM | 1,581 kbits - enables local buffering of video frames or packet buffers without external memory |
| RocketIO GTP Transceivers | 12 lanes, 2.5–3.75 Gbps - supports multi-lane JESD204B or CPRI links in wireless infrastructure |
| DSP48E Slices | 64 - delivers 192 GMAC/s at 300 MHz for real-time beamforming matrix operations |
| I/O Standards | 24 types including LVDS, SSTL-2, HSTL-I - ensures compatibility with ADC/DAC interfaces and memory controllers |
| Configuration Mode | Master SelectMAP, Serial PROM - enables field-upgradable bitstreams via SPI flash or parallel bus |
Pinout & Package
XC5VLX30T-1FFG323C is housed in a 323-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 1.0 mm pitch, designed for high-density PCB routing and thermal dissipation in conduction-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Pins | Select boot source (SPI, BPI, or SelectMAP) during power-on reset |
| CCLK | Configuration Clock | Drives internal configuration shift register; externally sourced or internally generated |
| DIN | Serial Data Input | Accepts configuration bitstream from SPI flash or microcontroller |
| INIT_B | Configuration Status | Active-low open-drain signal indicating configuration error or completion |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and restarts loading sequence |
| GTxP/N | Transceiver Differential Pair | High-speed serial I/O supporting 2.5–3.75 Gbps with on-die termination and equalization |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express Endpoint | Hard IP block compliant with PCIe v1.1, eliminating soft-core resource overhead and timing closure risk |
| Partial Reconfiguration Support | Enables dynamic function swapping (e.g., modulation scheme change) without full system reset |
| Dual-Register Flip-Flops | Improves timing margin in high-frequency control paths by enabling pipelined register stages per LUT |
| DCI (Digitally Controlled Impedance) | Automatically matches I/O output impedance to trace characteristic impedance, reducing signal integrity tuning effort |
| 65 nm Low-Power Process | Reduces static power by ~35% vs. 90 nm Virtex-4, critical for fanless embedded deployments |
Applications
| Radar Baseband Processing | Medical Ultrasound Beamformer |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne SAR systems with strict SWaP-C constraints. IC Role / Device Role / Timing Role: FPGA fabric executes matched filtering, CFAR detection, and SAR image formation pipelines. Use Value: 64 DSP48E slices enable 128-tap FIR filtering at 125 MHz while maintaining sub-100 µs latency. | Use Scenario: Dynamic beam steering and harmonic imaging in portable ultrasound carts. IC Role / Device Role / Timing Role: Configurable digital backend synchronizes 128-channel echo sampling and applies time-gain compensation. Use Value: LVDS I/O and 2.5 Gbps transceivers interface directly with 12-bit, 65 MSPS ADCs and high-resolution display controllers. |
| Wireless Remote Radio Head | Industrial Machine Vision Controller |
Use Scenario: CPRI-based fronthaul in LTE macro base stations with 4×2 MIMO support. IC Role / Device Role / Timing Role: Handles IQ data framing, scrambling, and 8b/10b encoding for optical transport over SFP+. Use Value: 12 RocketIO GTP lanes provide four independent 2.4576 Gbps CPRI links with deterministic jitter < 0.3 UI. | Use Scenario: High-speed inspection of PCB assemblies using line-scan cameras and real-time defect classification. IC Role / Device Role / Timing Role: Coordinates camera trigger, pixel streaming, and FPGA-accelerated CNN inference kernels. Use Value: 30,816 logic cells host dual 100 MHz Ethernet MACs plus custom vision pipeline logic with zero external frame buffer. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX50T-1FFG323C | Higher logic density (49,920 LC), same package and transceiver count | Required when >30K LC needed for multi-standard radio or larger vision buffers | Choose for scalability headroom without changing PCB layout or cooling design |
| XCKU035-2FFVA676E | Kintex UltraScale architecture, 20 nm process, 16.3 Gbps transceivers, no native PCIe v1.1 hard IP | Suitable for next-gen 5G NR or AI edge inference where bandwidth >3 Gbps is mandatory | Choose for higher serial bandwidth and lower power per GOP, but requires new HDL integration and timing closure |
Compared with XC5VLX50T-1FFG323C and XCKU035-2FFVA676E, the XC5VLX30T-1FFG323C offers optimal balance of transceiver count, logic resources, and legacy PCIe compliance for cost-sensitive radar and medical imaging platforms requiring field-proven reliability.
Availability
XC5VLX30T-1FFG323C is available at Aetrix Electronics and suitable for radar baseband processing, medical ultrasound beamforming, and wireless remote radio head applications requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX30T-1FFG323C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-5 family was engineered for high-performance signal processing in aerospace, defense, and wired/wireless infrastructure, emphasizing transceiver integration, DSP throughput, and configuration security.
FAQ
What is the maximum supported transceiver data rate for XC5VLX30T-1FFG323C?
The XC5VLX30T-1FFG323C supports RocketIO GTP transceivers rated up to 3.75 Gbps per lane. This rate is validated under specified voltage and temperature conditions per the Virtex-5 datasheet DS106. The XC5VLX30T-1FFG323C achieves reliable operation at 2.5 Gbps for CPRI and JESD204B without external equalization.
Does XC5VLX30T-1FFG323C include native PCI Express endpoint capability?
Yes, the XC5VLX30T-1FFG323C integrates a hardened PCI Express v1.1 endpoint block. This eliminates the need for soft-core implementations and guarantees timing closure for x1 and x4 link configurations. The XC5VLX30T-1FFG323C does not support PCIe v2.0 or higher natively.
What configuration modes are supported by XC5VLX30T-1FFG323C?
The XC5VLX30T-1FFG323C supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. Configuration is initiated via M0–M2 pins at power-up. The XC5VLX30T-1FFG323C can load bitstreams from SPI flash, BPI flash, or external processors through parallel or serial interfaces.
Is partial reconfiguration supported on XC5VLX30T-1FFG323C?
Yes, the XC5VLX30T-1FFG323C supports partial reconfiguration using the ICAP (Internal Configuration Access Port). This allows dynamic module swapping within the FPGA fabric while keeping other regions operational. The XC5VLX30T-1FFG323C requires specific floorplanning and bitstream generation workflows enabled by Xilinx ISE 14.7 tools.
What I/O standards are compatible with XC5VLX30T-1FFG323C bank voltages?
The XC5VLX30T-1FFG323C supports 24 I/O standards across banks powered at 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V. These include LVDS, SSTL-2, HSTL-I, and differential signaling with internal termination. Each bank's voltage must match the selected I/O standard's specification to ensure signal integrity in the XC5VLX30T-1FFG323C.
XC5VLX30T-1FFG323C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LXT
- Package/Case:
- 323-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 30720
- Total RAM Bits:
- 1327104
- Number of I/O:
- 172
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 323-FCBGA (19x19)
XC5VLX30T-1FFG323C FAQ
1.How can I place an order for XC5VLX30T-1FFG323C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX30T-1FFG323C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX30T-1FFG323C reliable?
The price and inventory of XC5VLX30T-1FFG323C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30T-1FFG323C is usually 5 days.
3.What payment methods are accepted for XC5VLX30T-1FFG323C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30T-1FFG323C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX30T-1FFG323C?
XC5VLX30T-1FFG323C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX30T-1FFG323C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX30T-1FFG323C?
For technical support, including XC5VLX30T-1FFG323C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30T-1FFG323C requirements.
6.How does Aetrix verify that XC5VLX30T-1FFG323C is sourced from the original manufacturer or authorized distributors?
All XC5VLX30T-1FFG323C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30T-1FFG323C meets industry standards.
7.What is the process for return or replacement of XC5VLX30T-1FFG323C?
All XC5VLX30T-1FFG323C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30T-1FFG323C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX30T-1FFG323C part is unused and in its original packaging.
Return procedure for XC5VLX30T-1FFG323C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VLX30T-1FFG323C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
