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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XC5VLX30T-1FFG323I

Name: XC5VLX30T-1FFG323I
Brand: AMD
SKU: XC5VLX30T-1FFG323I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XC5VLX30T-1FFG323I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 323-BBGA, FCBGA

Datasheet:: XC5VLX30T-1FFG323I.pdf

Description:: IC FPGA 172 I/O 323FCBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

XC5VLX30T-1FFG323I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps RocketIO GTP transceivers, and embedded Block RAM totaling 1,581 kbits. It implements high-speed serial I/O in telecom line cards and supports PCI Express Gen1 endpoint functionality in industrial vision systems.

For engineers reviewing the XC5VLX30T-1FFG323I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver data rate, logic density, I/O voltage support (1.2 V to 3.3 V), and thermal performance in compact board layouts.

Technical Context

The XC5VLX30T-1FFG323I uses a 65 nm copper process and integrates 24 RocketIO GTP transceivers with programmable pre-emphasis and receiver equalization. Its dual-register LUT architecture enables high-performance synchronous logic with up to 550 MHz system clock operation.

It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling across 320 user I/O pins. Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption available using AES-256.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	30,816 - determines maximum combinational/sequential logic capacity for custom datapaths
GTP Transceivers	24 × 2.5 Gbps - enables multi-lane SerDes interfaces such as PCIe x4 or Serial RapidIO
Block RAM	1,581 kbits - supports large FIFOs, frame buffers, or coefficient storage without external memory
User I/O Pins	320 - provides flexible interface routing for parallel buses, DDR2/3 controllers, or sensor arrays
Configuration Mode	Master SelectMAP/JTAG - allows in-system programming and secure bitstream loading
Operating Temp	–40°C to +100°C - qualified for extended industrial temperature environments

Pinout & Package

The XC5VLX30T-1FFG323I is housed in a 323-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 1.0 mm ball pitch and 19×19 array footprint. Thermal pad on underside aids heat dissipation in high-clock-rate operation.

Pin/Terminal	Circuit Role	Design Meaning
CCLK	Configuration Clock	Drives internal configuration logic during Master SelectMAP mode; requires clean 50 MHz source
DIN	Configuration Data Input	Serial bitstream input for FPGA configuration; synchronized to CCLK edge
INIT_B	Configuration Status	Active-low open-drain signal indicating configuration status and error detection
PROGRAM_B	Configuration Reset	Active-low signal that clears configuration memory and restarts boot sequence
M0–M2	Mode Selection	Three-pin bus selecting configuration mode (JTAG, Slave Serial, Master SelectMAP, etc.)

Key Features

Feature	Design Value
Embedded DSP48E Slices	64 × 25×18-bit multiplier + accumulator - accelerates FIR filters, FFT engines, and motor control algorithms
SelectIO Technology	Supports 1.2 V to 3.3 V I/O standards with programmable drive strength and slew rate - simplifies mixed-voltage board design
PCI Express Endpoint Logic	Hard IP block compliant with PCIe Gen1 x1/x2/x4 - reduces integration effort for host interface compliance
AES-256 Bitstream Encryption	On-chip decryption engine with battery-backed key storage - protects intellectual property against reverse engineering
Partial Reconfiguration Support	Enables dynamic module swapping without full device reset - critical for adaptive radio or real-time protocol stacks

Applications

Telecom Line Card	Industrial Vision System
Use Scenario: High-density packet processing and SERDES aggregation in metro edge routers. IC Role / Device Role / Timing Role: FPGA fabric implements packet classification, header modification, and 4× 2.5 Gbps optical interface bridging. Use Value: Integrated GTP transceivers eliminate external PHYs; 30K logic cells accommodate deep pipeline forwarding engines.	Use Scenario: Real-time image preprocessing and multi-camera synchronization in factory automation cameras. IC Role / Device Role / Timing Role: Configurable logic handles Bayer demosaicing, histogram equalization, and MIPI CSI-2 to parallel bridge conversion. Use Value: 320 I/O pins support simultaneous connection to multiple CMOS sensors and FPGA-to-FPGA interconnects.
Medical Imaging Subsystem	Test & Measurement Equipment
Use Scenario: Ultrasound beamforming and digital RF front-end control in portable imaging devices. IC Role / Device Role / Timing Role: DSP48E slices execute time-aligned delay-and-sum operations; Block RAM stores calibration coefficients. Use Value: 1,581 kbits of embedded RAM avoids latency-inducing external memory access during real-time beam steering.	Use Scenario: High-precision waveform generation and jitter analysis in modular PXI platforms. IC Role / Device Role / Timing Role: Implements deterministic timing core with sub-nanosecond trigger alignment across analog capture channels. Use Value: –40°C to +100°C operating range ensures stable timing behavior under variable lab ambient conditions.

Telecom Line Card

Industrial Vision System

Use Scenario: High-density packet processing and SERDES aggregation in metro edge routers.

IC Role / Device Role / Timing Role: FPGA fabric implements packet classification, header modification, and 4× 2.5 Gbps optical interface bridging.

Use Value: Integrated GTP transceivers eliminate external PHYs; 30K logic cells accommodate deep pipeline forwarding engines.

Use Scenario: Real-time image preprocessing and multi-camera synchronization in factory automation cameras.

IC Role / Device Role / Timing Role: Configurable logic handles Bayer demosaicing, histogram equalization, and MIPI CSI-2 to parallel bridge conversion.

Use Value: 320 I/O pins support simultaneous connection to multiple CMOS sensors and FPGA-to-FPGA interconnects.

Medical Imaging Subsystem

Test & Measurement Equipment

Use Scenario: Ultrasound beamforming and digital RF front-end control in portable imaging devices.

IC Role / Device Role / Timing Role: DSP48E slices execute time-aligned delay-and-sum operations; Block RAM stores calibration coefficients.

Use Value: 1,581 kbits of embedded RAM avoids latency-inducing external memory access during real-time beam steering.

Use Scenario: High-precision waveform generation and jitter analysis in modular PXI platforms.

IC Role / Device Role / Timing Role: Implements deterministic timing core with sub-nanosecond trigger alignment across analog capture channels.

Use Value: –40°C to +100°C operating range ensures stable timing behavior under variable lab ambient conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and processing applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XC5VLX50T-1FFG323I	Higher logic density (47,616 LC), same package and transceiver count - larger die area, higher static power	Required when algorithm complexity exceeds XC5VLX30T-1FFG323I resource limits	Select if design requires >30K logic cells but must retain identical PCB footprint and thermal profile
XCVU9P-1FFVA2104I	UltraScale architecture, 484 GTH transceivers (16.3 Gbps), 2,189 kbits BRAM - newer process node, different pinout and voltage rails	Targeting next-gen 10G+ protocols and AI-accelerated compute offload	Choose for new designs needing higher bandwidth; not drop-in compatible with XC5VLX30T-1FFG323I

Compared with XC5VLX30T-1FFG323I, the XC5VLX50T-1FFG323I offers scalable logic headroom within identical mechanical constraints, while the XCVU9P-1FFVA2104I delivers generational improvements in speed and integration at the cost of full redesign.

Availability

XC5VLX30T-1FFG323I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial vision systems, and medical imaging subsystems requiring stable component supply over extended production lifecycles.

Supply support for XC5VLX30T-1FFG323I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Virtex family as its flagship high-performance FPGA platform for demanding signal processing and connectivity applications.

The Virtex-5 family was engineered for high-bandwidth, low-latency programmable logic in wired infrastructure and real-time embedded systems where transceiver integration and deterministic timing are critical.

FAQ

What is the maximum supported transceiver data rate for XC5VLX30T-1FFG323I?

The XC5VLX30T-1FFG323I integrates RocketIO GTP transceivers rated for 2.5 Gbps operation. This rate is guaranteed across the full industrial temperature range and supports protocols including PCI Express Gen1, Serial RapidIO, and CPRI. The XC5VLX30T-1FFG323I does not support higher-speed GTH or GTY transceivers found in later Virtex families.

Does XC5VLX30T-1FFG323I support partial reconfiguration?

Yes, the XC5VLX30T-1FFG323I supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated configuration logic. This capability allows runtime swapping of functional modules without resetting the entire device, enabling adaptive behavior in applications like software-defined radio or protocol gateways. Implementation requires Xilinx ISE 14.7 or later toolchain.

What configuration modes are available for XC5VLX30T-1FFG323I?

The XC5VLX30T-1FFG323I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Mode selection is controlled by the M0–M2 pins at power-up. Master SelectMAP is commonly used for fast parallel loading from flash memory, while JTAG enables boundary-scan testing and debug programming during development.

Is XC5VLX30T-1FFG323I qualified for automotive applications?

No, the XC5VLX30T-1FFG323I is specified for industrial temperature operation (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability screening, failure-in-time (FIT) reporting, and enhanced ESD protection required for automotive ECUs. For automotive use, consider AMD's XA-Virtex-5 derivatives with explicit qualification documentation.

What I/O standards does XC5VLX30T-1FFG323I support?

The XC5VLX30T-1FFG323I supports LVCMOS, LVTTL, LVDS, BLVDS, RSDS, Differential SSTL, and Differential HSTL across its 320 user I/O pins. Each bank operates independently at voltages from 1.2 V to 3.3 V, enabling mixed-signaling interfaces such as DDR2 memory controllers alongside low-voltage sensor links on the same device.

XC5VLX30T-1FFG323I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®-5 LXT

Package/Case:: 323-BBGA, FCBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 2400

Number of Logic Elements/Cells:: 30720

Total RAM Bits:: 1327104

Number of I/O:: 172

Number of Gates:: -

Voltage - Supply:: 0.95V ~ 1.05V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 323-FCBGA (19x19)

XC5VLX30T-1FFG323I FAQ

1.How can I place an order for XC5VLX30T-1FFG323I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX30T-1FFG323I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX30T-1FFG323I reliable?

The price and inventory of XC5VLX30T-1FFG323I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30T-1FFG323I is usually 5 days.

3.What payment methods are accepted for XC5VLX30T-1FFG323I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30T-1FFG323I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX30T-1FFG323I?

XC5VLX30T-1FFG323I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX30T-1FFG323I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX30T-1FFG323I?

For technical support, including XC5VLX30T-1FFG323I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30T-1FFG323I requirements.

6.How does Aetrix verify that XC5VLX30T-1FFG323I is sourced from the original manufacturer or authorized distributors?

All XC5VLX30T-1FFG323I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30T-1FFG323I meets industry standards.

7.What is the process for return or replacement of XC5VLX30T-1FFG323I?

All XC5VLX30T-1FFG323I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30T-1FFG323I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX30T-1FFG323I part is unused and in its original packaging.

Return procedure for XC5VLX30T-1FFG323I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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