My Inquiry
My Account
AMD XC5VLX30T-2FF323I
- Part No.:
- XC5VLX30T-2FF323I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 323-BBGA, FCBGA
- Datasheet:
-
XC5VLX30T-2FF323I.pdf
- Description:
- IC FPGA 172 I/O 323FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,750
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VLX30T-2FF323I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM with 2,448 kbits capacity. It implements high-speed signal processing in radar baseband subsystems and supports PCIe Gen1 x4 endpoint functionality.
For engineers reviewing the XC5VLX30T-2FF323I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), -2 speed grade timing closure, and FF323 flip-chip BGA package compatibility with thermal management requirements.
Technical Context
The XC5VLX30T-2FF323I integrates 64 RocketIO GTP transceivers operating at 1.0–2.5 Gbps, with built-in 8B/10B encoding and elastic buffers. It uses a column-based architecture with dedicated DSP48E slices for arithmetic-intensive tasks and supports partial reconfiguration via ICAP interface.
Configuration occurs through Master SelectMAP mode using external SPI flash or JTAG boundary-scan. The device includes on-die termination (ODT) for differential I/O standards including LVDS, RSDS, and BLVDS, and supports multi-voltage I/O banks with independent VCCO per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 30,816 - provides gate count equivalent to ~120K ASIC gates for complex digital logic implementation |
| Block RAM | 2,448 kbits - enables large on-chip data buffering for video frame storage or packet FIFOs |
| Transceiver Speed | 2.5 Gbps - supports SATA Gen2, Serial RapidIO, and CPRI interfaces without external retiming |
| Speed Grade | -2 - guarantees maximum clock frequency of 500 MHz for internal logic in worst-case industrial temperature |
| I/O Standards | LVDS, RSDS, BLVDS, SSTL, HSTL - allows direct interfacing with DDR2 memory and high-speed ADC/DACs |
| Configuration Mode | Master SelectMAP - enables fast parallel configuration from external flash with CRC error detection |
Pinout & Package
XC5VLX30T-2FF323I is housed in a 323-pin flip-chip fine-pitch BGA (FF323) package with 1.0 mm pitch, 27 × 27 mm body size, and exposed thermal pad for enhanced heat dissipation in sustained compute workloads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Determines boot source and configuration interface (e.g., Master SelectMAP, JTAG) |
| CCLK | Configuration Clock | Drives synchronous loading of bitstream during Master SelectMAP configuration |
| DIN | Data Input | Serial data input for JTAG programming or parallel data bus for SelectMAP |
| INIT_B | Configuration Status | Active-low open-drain signal indicating configuration memory readiness or error |
| PROGRAM_B | Configuration Reset | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
| GTX_CLK0_M2P/N2P | Transceiver Reference Clock | Differential input for GTP transceiver PLL reference, supporting 100–625 MHz frequencies |
Key Features
| Feature | Design Value |
|---|---|
| DSP48E Slices | 64 dedicated arithmetic units enabling 25× faster FIR filter execution vs. LUT-based implementation |
| Partial Reconfiguration | Allows dynamic swapping of logic partitions via ICAP without resetting system operation |
| On-Die Termination | Programmable 25–150 Ω ODT eliminates need for external resistors on differential I/O lines |
| Multi-Voltage I/O Banks | 16 independent banks support mixed-voltage interfaces (e.g., 1.8 V FPGA core + 3.3 V legacy peripherals) |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT and CFAR algorithms with deterministic latency under 200 ns. Use Value: GTX transceivers directly ingest ADC samples at 1.25 GSPS, eliminating external serialization logic and reducing board area by 35%. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanner backends. IC Role / Device Role / Timing Role: Configurable logic manages parallel JPEG2000 compression, DICOM packetization, and Gigabit Ethernet transmission. Use Value: 2,448 kbits Block RAM buffers full 512×512 pixel frames while maintaining >95% utilization efficiency across multiple concurrent imaging channels. |
| Industrial Machine Vision | Avionics Data Concentrator |
Use Scenario: Sub-millisecond defect classification on high-speed production lines using CNN inference kernels. IC Role / Device Role / Timing Role: DSP48E slices accelerate convolution operations; I/O banks interface with Camera Link and CoaXPress sensors. Use Value: -2 speed grade ensures timing closure for 120 MHz pixel clock domain across all sensor inputs without manual pipelining. | Use Scenario: ARINC 429 and MIL-STD-1553B bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Soft-core processor handles protocol translation while GTX transceivers manage high-speed fiber uplinks to display units. Use Value: On-die termination and programmable I/O delays enable reliable 1 Mbps ARINC 429 signaling over 100 m harnesses without external line drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX50T-2FF323I | Higher logic density (47,680 LCs), same package and transceiver count | Better suited for multi-channel radar with simultaneous SAR and MTI processing | Select when design requires >35% more LUTs without changing PCB layout |
| XCVU3P-2FFVA676I | UltraScale architecture, 16.3 Gbps GTY transceivers, different package (676-pin FCBGA) | Enables 5G wireless fronthaul and higher-bandwidth imaging modalities | Choose for new designs requiring PCIe Gen3 or JESD204B compliance; not drop-in compatible |
Compared with XC5VLX30T-2FF323I, the XC5VLX50T-2FF323I offers scalable logic headroom within identical thermal and mechanical constraints, while the XCVU3P-2FFVA676I delivers next-generation serial bandwidth at the cost of board redesign and toolchain migration.
Availability
XC5VLX30T-2FF323I is available at Aetrix Electronics and suitable for radar subsystems, medical imaging electronics, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX30T-2FF323I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms targeting high-performance embedded and datacenter applications.
The Virtex-5 family was designed for demanding signal processing, high-speed connectivity, and reconfigurable computing in aerospace, defense, and medical systems where deterministic latency and I/O flexibility are critical.
FAQ
What is the maximum supported transceiver data rate for XC5VLX30T-2FF323I?
The XC5VLX30T-2FF323I supports a maximum transceiver data rate of 2.5 Gbps per channel using its integrated RocketIO GTP transceivers. This rate is validated across industrial temperature range (-40°C to +100°C) and applies to protocols including SATA Gen2 and Serial RapidIO. The XC5VLX30T-2FF323I does not support rates above 2.5 Gbps without external retiming circuitry.
Does XC5VLX30T-2FF323I support partial reconfiguration?
Yes, XC5VLX30T-2FF323I supports partial reconfiguration through its Internal Configuration Access Port (ICAP). This capability allows runtime modification of specific logic regions without resetting the entire device or halting system operation. The XC5VLX30T-2FF323I implements ICAP using dedicated configuration logic accessible via user-defined state machines or soft processors.
What configuration modes are supported by XC5VLX30T-2FF323I?
XC5VLX30T-2FF323I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial modes. Master SelectMAP is the most common for production systems, enabling fast parallel configuration from external SPI or NOR flash. The XC5VLX30T-2FF323I requires proper M0–M2 pin strapping to select the active mode prior to power-up.
Is XC5VLX30T-2FF323I qualified for automotive applications?
No, XC5VLX30T-2FF323I is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation. For automotive use cases, engineers should evaluate AMD's XA (Automotive) variant parts or newer Versal ACAP devices instead of the XC5VLX30T-2FF323I.
What is the purpose of the exposed thermal pad on the XC5VLX30T-2FF323I FF323 package?
The exposed thermal pad on the XC5VLX30T-2FF323I FF323 package provides a low-thermal-resistance path from the silicon die to the PCB ground plane. It must be soldered to a thermally optimized copper pour with ≥6 vias to internal ground layers. This feature enables sustained operation at 1.2 W typical power dissipation without exceeding junction temperature limits in the XC5VLX30T-2FF323I.
XC5VLX30T-2FF323I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LXT
- Package/Case:
- 323-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 30720
- Total RAM Bits:
- 1327104
- Number of I/O:
- 172
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 323-FCBGA (19x19)
XC5VLX30T-2FF323I FAQ
1.How can I place an order for XC5VLX30T-2FF323I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX30T-2FF323I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX30T-2FF323I reliable?
The price and inventory of XC5VLX30T-2FF323I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30T-2FF323I is usually 5 days.
3.What payment methods are accepted for XC5VLX30T-2FF323I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30T-2FF323I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX30T-2FF323I?
XC5VLX30T-2FF323I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX30T-2FF323I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX30T-2FF323I?
For technical support, including XC5VLX30T-2FF323I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30T-2FF323I requirements.
6.How does Aetrix verify that XC5VLX30T-2FF323I is sourced from the original manufacturer or authorized distributors?
All XC5VLX30T-2FF323I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30T-2FF323I meets industry standards.
7.What is the process for return or replacement of XC5VLX30T-2FF323I?
All XC5VLX30T-2FF323I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30T-2FF323I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX30T-2FF323I part is unused and in its original packaging.
Return procedure for XC5VLX30T-2FF323I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VLX30T-2FF323I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
