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AMD XC5VLX30T-3FFG665C

Part No.:
XC5VLX30T-3FFG665C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
665-BBGA, FCBGA
Datasheet:
AetrixXC5VLX30T-3FFG665C.pdf
Description:
IC FPGA 360 I/O 665FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,571

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Product details

Overview

XC5VLX30T-3FFG665C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 30,816 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM with 2,448 kbits capacity. It implements high-speed serial I/O in PCIe Gen1 endpoint designs and supports DDR2 memory interfaces up to 533 MHz.

For engineers reviewing the XC5VLX30T-3FFG665C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver compliance (PCIe Gen1), I/O voltage flexibility (1.2V/1.5V/1.8V/2.5V/3.3V), and -3 speed grade timing performance at junction temperatures up to 85°C.

Technical Context

The XC5VLX30T-3FFG665C integrates 12 RocketIO GTP transceivers supporting 1.0–2.5 Gbps line rates, with built-in 8B/10B encoding and elastic buffers. Its SelectIO technology enables source-synchronous interfaces including DDR2 SDRAM and QDR-II SRAM with programmable drive strength and input delay control.

Virtex-5 architecture uses six-input LUTs, dedicated carry logic, and hierarchical clock routing with 16 global clock networks. The device includes 64 DSP48E slices for arithmetic-intensive tasks and supports partial reconfiguration via ICAP interface.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells30,816 - total configurable logic resources for combinatorial and sequential logic implementation
Block RAM2,448 kbits - distributed across 192 x 18-kbit dual-port RAM blocks for on-chip data buffering
GTP Transceivers12 × 1.0–2.5 Gbps - supports PCIe Gen1, SATA, and Serial RapidIO physical layer protocols
I/O StandardsLVCMOS, LVTTL, SSTL, HSTL, Differential LVDS - enables direct interfacing with DDR2, QDR-II, and legacy parallel buses
Speed Grade-3 - guarantees timing closure for worst-case conditions at 85°C junction temperature
PackageFFG665 - 665-pin Fine-Pitch Flip-Chip BGA, 27×27 mm, 1.0 mm pitch, RoHS-compliant
Operating Temp0°C to +85°C - commercial temperature range suitable for industrial control and communications equipment

Pinout & Package

XC5VLX30T-3FFG665C is housed in a 665-pin Fine-Pitch Flip-Chip BGA (FFG665) package with 27×27 mm body size, 1.0 mm ball pitch, and RoHS-compliant finish. Thermal and mechanical characteristics align with JEDEC MO-251 specification.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation
VCCAUXAuxiliary power supply2.5V supply for configuration logic, clock management, and transceiver reference circuits
VCCO_0I/O bank powerConfigurable 1.2V/1.5V/1.8V/2.5V/3.3V supply per I/O bank; sets voltage standard for associated pins
MRMaster resetActive-low asynchronous reset that clears configuration registers and halts operation until deasserted
CCLKConfiguration clockOutput-only clock during master serial configuration; frequency ≤50 MHz
INIT_BConfiguration statusOpen-drain output indicating configuration memory readiness or error condition

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables dynamic module swapping without full device reconfiguration, reducing system downtime in runtime-adaptive systems
DSP48E Slices64 dedicated arithmetic units with 25×18 multipliers, 48-bit accumulators, and pipeline registers for signal processing workloads
SelectIO TechnologyProgrammable I/O with adjustable slew rate, drive strength, and input delay for precise timing alignment in source-synchronous interfaces
RocketIO GTP Transceivers12 integrated transceivers with built-in 8B/10B encoder/decoder, comma detection, and elastic buffer for jitter tolerance
Hierarchical Clock Network16 global clock buffers plus regional and I/O clocks enable low-skew distribution and domain-specific clock gating

Applications

PCIe Gen1 Endpoint SystemsHigh-Speed Data Acquisition

Use Scenario: Embedded vision capture card with real-time image preprocessing and host CPU offload via PCIe x1 link.

IC Role / Device Role / Timing Role: FPGA acts as PCIe endpoint controller and pixel-processing pipeline, managing DMA transfers and frame buffering.

Use Value: XC5VLX30T-3FFG665C provides deterministic latency for PCIe TLP handling and sufficient logic density for 1080p YUV422 pixel filtering.

Use Scenario: Modular test instrument with synchronized multi-channel ADC sampling at 100 MSPS and real-time FFT computation.

IC Role / Device Role / Timing Role: FPGA serves as timing controller, data aggregator, and FFT accelerator using DSP48E slices.

Use Value: XC5VLX30T-3FFG665C delivers 12 Gbps aggregate transceiver bandwidth and 64 DSP slices for 1K-point streaming FFTs.

DDR2 Memory Controller InterfaceSerial RapidIO Interconnect Node

Use Scenario: Baseband processing unit in wireless infrastructure requiring burst-mode DDR2 access for channel estimation buffers.

IC Role / Device Role / Timing Role: FPGA implements a high-efficiency DDR2 controller with write leveling and read calibration logic.

Use Value: XC5VLX30T-3FFG665C supports 533 MHz DDR2 data rates with calibrated I/O delays and on-die termination control.

Use Scenario: Packet-switched interconnect between DSP blades in radar signal processing chassis.

IC Role / Device Role / Timing Role: FPGA functions as Serial RapidIO endpoint with 4x lane configuration and message passing engine.

Use Value: XC5VLX30T-3FFG665C provides 12 Gbps full-duplex throughput per 4x link and hardware CRC generation for packet integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX50T-3FFG665CHigher logic density (49,920 LCs), more Block RAM (3,888 kbits), same package and transceiver countSupports larger algorithm partitions and deeper FIFOs; suited for multi-channel or higher-resolution processingSelect when XC5VLX30T-3FFG665C resource utilization exceeds 85% in synthesis reports
XC6VLX240T-3FFG1156CNewer Virtex-6 architecture, 240K LCs, 24 GTX transceivers (up to 6.6 Gbps), larger FFG1156 packageEnables PCIe Gen2 and higher-bandwidth interconnects; requires PCB redesign due to different footprint and power deliveryChoose for new designs targeting longer lifecycle, higher serial bandwidth, or greater logic scalability

Compared with XC5VLX30T-3FFG665C, the XC5VLX50T-3FFG665C offers immediate resource headroom within identical board layout and power design, while the XC6VLX240T-3FFG1156C enables next-generation protocol support at the cost of mechanical and thermal redesign.

Availability

XC5VLX30T-3FFG665C is available at Aetrix Electronics and suitable for PCIe endpoint systems, high-speed data acquisition platforms, and DDR2-based baseband processing requiring stable component supply across extended production cycles.

Supply support for XC5VLX30T-3FFG665C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Virtex-5 family was designed for high-performance logic, serial connectivity, and DSP-intensive applications in wired communications, military/aerospace, and test equipment.

FAQ

What is the maximum supported DDR2 data rate for XC5VLX30T-3FFG665C?

The XC5VLX30T-3FFG665C supports DDR2 SDRAM interfaces up to 533 MHz data rate (266 MHz clock), verified through Xilinx UG190 and characterized across voltage and temperature corners. This capability relies on calibrated I/O delays, on-die termination, and dedicated memory controller IP cores compatible with the device's SelectIO architecture. XC5VLX30T-3FFG665C achieves stable operation using industry-standard DDR2-533 modules with appropriate PCB layout practices.

Does XC5VLX30T-3FFG665C support partial reconfiguration?

Yes, XC5VLX30T-3FFG665C supports partial reconfiguration via the Internal Configuration Access Port (ICAP) and dedicated bitstream partitioning tools in Vivado Design Suite. This allows dynamic replacement of functional modules-such as communication protocol stacks or filter coefficients-without resetting the entire FPGA. XC5VLX30T-3FFG665C requires specific floorplanning and configuration controller logic to manage bitstream loading and handshake signaling.

What transceiver protocols are natively supported by XC5VLX30T-3FFG665C?

XC5VLX30T-3FFG665C natively supports PCIe Gen1 (2.5 Gbps), SATA I/II (1.5/3.0 Gbps), and Serial RapidIO 1.x (1.25/2.5 Gbps) through its 12 RocketIO GTP transceivers. Each transceiver includes 8B/10B encoding, elastic buffers, and clock correction logic. XC5VLX30T-3FFG665C does not support PCIe Gen2 or higher line rates, nor does it implement native Ethernet MAC or Fibre Channel protocols without external PHYs.

What is the purpose of the VCCAUX supply pin on XC5VLX30T-3FFG665C?

The VCCAUX supply pin on XC5VLX30T-3FFG665C delivers 2.5V ±5% to configuration logic, clock management tiles (including DCMs and PLLs), and transceiver reference circuitry. It must be powered before or simultaneously with VCCINT during power-up sequencing. XC5VLX30T-3FFG665C specifies strict monotonic ramp requirements for VCCAUX to ensure reliable configuration and clock initialization, especially under cold-start conditions.

Can XC5VLX30T-3FFG665C operate in industrial temperature range?

No, XC5VLX30T-3FFG665C is rated only for commercial temperature range (0°C to +85°C junction). It lacks qualification for extended industrial (-40°C to +100°C) or automotive temperature grades. For operation outside 0–85°C, thermal derating, enhanced cooling, or alternative Virtex-5 variants such as XC5VLX30T-3FFG665I (industrial grade) must be used. XC5VLX30T-3FFG665C datasheet explicitly defines its thermal limits and derating curves only within the commercial range.

XC5VLX30T-3FFG665C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LXT
Package/Case:
665-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Total RAM Bits:
1327104
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
665-FCBGA (27x27)

XC5VLX30T-3FFG665C FAQ

1.How can I place an order for XC5VLX30T-3FFG665C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX30T-3FFG665C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX30T-3FFG665C reliable?

The price and inventory of XC5VLX30T-3FFG665C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX30T-3FFG665C is usually 5 days.

3.What payment methods are accepted for XC5VLX30T-3FFG665C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX30T-3FFG665C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX30T-3FFG665C?

XC5VLX30T-3FFG665C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX30T-3FFG665C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX30T-3FFG665C?

For technical support, including XC5VLX30T-3FFG665C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX30T-3FFG665C requirements.

6.How does Aetrix verify that XC5VLX30T-3FFG665C is sourced from the original manufacturer or authorized distributors?

All XC5VLX30T-3FFG665C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX30T-3FFG665C meets industry standards.

7.What is the process for return or replacement of XC5VLX30T-3FFG665C?

All XC5VLX30T-3FFG665C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX30T-3FFG665C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX30T-3FFG665C part is unused and in its original packaging.

Return procedure for XC5VLX30T-3FFG665C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX30T-3FFG665C Tags

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