AMD XC5VLX330-1FF1760I

Overview

XC5VLX330-1FF1760I from AMD (formerly Xilinx) is a high-capacity Virtex-5 FPGA featuring 330,000 logic cells, 12.5 Mb of block RAM, and 640 DSP48E slices. It operates at -1 speed grade (1.0 ns CLB delay), uses a 1760-pin Flip-Chip Fine-Pitch BGA (FF1760) package, and targets high-performance digital signal processing and reconfigurable computing systems in radar and wired communications infrastructure.

For engineers reviewing the XC5VLX330-1FF1760I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), differential signaling support (LVDS, RSDS, BLVDS), transceiver line rate (up to 3.2 Gbps), and thermal design power (TDP ≈ 19.5 W at typical conditions).

Technical Context

The XC5VLX330-1FF1760I implements a hierarchical FPGA architecture with six distinct logic tile types-including SLICEM (with embedded memory and shift registers) and SLICEL (optimized for logic density)-and supports multi-gigabit transceivers with built-in 8B/10B encoding, comma detection, and elastic buffers. It integrates clock management tiles (CMT) containing DCMs and PLLs for jitter reduction and phase alignment across multiple clock domains.

Configuration occurs via Master SelectMAP or JTAG, supporting dual-boot from two external SPI flash devices. The device complies with IEEE 1149.1 (JTAG) boundary-scan and supports partial reconfiguration through ICAP interface, enabling dynamic function swapping without full system reset.

Key Specifications

Pinout & Package

XC5VLX330-1FF1760I is housed in a 1760-ball flip-chip fine-pitch BGA (FF1760) package with 720 user-configurable I/Os distributed across 16 banks. Power delivery includes dedicated VCCINT (1.0 V), VCCAUX (2.5 V), and VCCO (1.2–3.3 V selectable per bank) supplies, plus multiple VREF and GND balls for signal integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC5VLX330-1FF1760I, the XCVU3P-2FFVD1760I offers greater logic capacity and power efficiency but lacks hardened PCIe, while the XC7VX485T-2FFG1761I provides higher-speed transceivers and DDR4 support at the cost of increased PCB complexity and thermal load.

Availability

XC5VLX330-1FF1760I is available at Aetrix Electronics and suitable for radar signal processing, high-speed wired communications, and medical imaging backend systems requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX330-1FF1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Virtex-5 family was designed for high-performance reconfigurable logic in infrastructure equipment demanding deterministic timing, high I/O bandwidth, and multi-standard protocol support.

FAQ

What is the maximum supported I/O standard voltage for XC5VLX330-1FF1760I?

XC5VLX330-1FF1760I supports I/O standards from 1.2 V to 3.3 V per bank, with VCCO independently configurable per I/O bank. It natively supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS, RSDS, and BLVDS. Each bank requires its own VCCO supply rail matching the selected I/O standard's voltage requirement.

Does XC5VLX330-1FF1760I include built-in PCI Express functionality?

Yes, XC5VLX330-1FF1760I integrates hard-wired PCI Express endpoint blocks compliant with PCIe Gen1 (2.5 Gbps per lane). It supports x1, x2, and x4 configurations with integrated DMA engines and TLP parsing logic, eliminating the need for external PCIe PHY or soft-core implementations in endpoint applications.

What thermal management considerations apply to XC5VLX330-1FF1760I?

XC5VLX330-1FF1760I has a thermal design power (TDP) of approximately 19.5 W under typical operating conditions. It requires a 4-layer or higher PCB with dedicated thermal vias under the FF1760 package, a copper slug heatsink, and airflow ≥200 LFM. Junction temperature must remain ≤100°C for industrial-grade (-40°C to +100°C) operation.

Can XC5VLX330-1FF1760I be configured via JTAG in-system?

Yes, XC5VLX330-1FF1760I supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. JTAG configuration allows bitstream loading, SRAM initialization, and real-time debug probe access using Xilinx ChipScope or Vivado Hardware Manager without requiring external configuration memory.

Is partial reconfiguration supported on XC5VLX330-1FF1760I?

Yes, XC5VLX330-1FF1760I supports partial reconfiguration through its Internal Configuration Access Port (ICAP). This enables dynamic replacement of specific logic regions while the rest of the design remains operational-critical for applications like adaptive radar waveform switching or protocol hot-swapping in telecom infrastructure.