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AMD XC5VLX330-1FFG1760C
- Part No.:
- XC5VLX330-1FFG1760C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC5VLX330-1FFG1760C.pdf
- Description:
- IC FPGA 1200 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,225
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Product details
Overview
XC5VLX330-1FFG1760C from AMD (formerly Xilinx) is a high-capacity Virtex-5 FPGA featuring 330,000 logic cells, 12.5 Mb of block RAM, and 640 DSP48E slices. It operates at -1 speed grade (1.0 ns CLB delay), uses a 1760-pin Flip-Chip BGA package with 640 user I/Os, and targets high-performance digital signal processing in radar and baseband wireless infrastructure.
For engineers reviewing the XC5VLX330-1FFG1760C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, DSP slice count, speed grade timing closure, and thermal performance in air-cooled 3U VPX systems.
Technical Context
The XC5VLX330-1FFG1760C implements a column-based architecture with dedicated routing for clock, reset, and control signals. It integrates SelectIO technology supporting LVDS, SSTL-2, HSTL-I, and differential signaling up to 1.25 Gbps per I/O pair.
Its configuration interface supports Master SelectMAP, Slave SelectMAP, and JTAG modes with dual-boot capability. Built-in DCI (Digitally Controlled Impedance) enables on-die termination matching for source-synchronous interfaces without external resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 330,000 - provides gate count equivalent to ~1.3M ASIC gates for complex RTL implementation |
| Block RAM | 12.5 Mb - supports large FIFOs, frame buffers, or coefficient storage in multi-channel DSP systems |
| DSP48E Slices | 640 - enables parallel multiply-accumulate operations for real-time filtering or beamforming |
| User I/O Pins | 640 - accommodates wide data buses and high-pin-count parallel interfaces like DDR2/3 memory controllers |
| Speed Grade | -1 - guarantees 1.0 ns CLB propagation delay; suitable for 300 MHz system clocks with moderate routing congestion |
| Package | FFG1760 - 1760-pin flip-chip BGA, 42.5 × 42.5 mm, 1.0 mm pitch, RoHS-compliant |
| Configuration Mode | Master/Slave SelectMAP + JTAG - allows field-upgradable bitstreams via PCIe or microcontroller host |
Pinout & Package
XC5VLX330-1FFG1760C is housed in a 1760-pin Flip-Chip BGA (FFG1760) package with 640 user-configurable I/Os distributed across 16 banks. Power delivery includes dedicated VCCINT, VCCAUX, and VCCO pins per bank, with thermal vias under the die for enhanced heat dissipation in conduction-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during bitstream loading; must be stable before INIT_B deassertion |
| DIN | Serial Configuration Data Input | Accepts configuration bitstream in Master SelectMAP mode; synchronous to CCLK |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset Input | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
| PROG_B | Same as PROGRAM_B | Legacy pin alias; electrically identical to PROGRAM_B per UG192 v3.1 |
| M0–M2 | Mode Selection Inputs | Set configuration mode (JTAG, Master/Slave SelectMAP, Serial PROM) at power-on reset |
Key Features
| Feature | Design Value |
|---|---|
| DCI (Digitally Controlled Impedance) | On-die series/parallel termination eliminates need for external 50 Ω resistors on source-synchronous buses |
| SelectIO Technology | Supports 18 I/O standards including LVDS_25, SSTL2_I, HSTL_I, and differential swing down to 250 mV |
| DSP48E Slice Architecture | Integrated 25×18 multiplier, 48-bit accumulator, and pipeline registers enable single-cycle MAC operations |
| PCI Express Endpoint Logic | Hard IP blocks support x1, x2, x4, and x8 Gen1 links with integrated PHY and transaction layer |
| Multi-Boot Capability | Two independent bitstream images stored in external SPI flash; selected via GPIO or watchdog timeout |
Applications
| Radar Signal Processing | Wireless Baseband Unit |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems operating at L- and S-band. IC Role / Device Role / Timing Role: Primary compute engine executing CFAR detection, beamforming, and STAP algorithms with deterministic latency. Use Value: 640 DSP48E slices enable concurrent 32-channel adaptive filtering; 12.5 Mb block RAM stores radar cross-section lookup tables and calibration coefficients. | Use Scenario: Multi-carrier, multi-standard (LTE, 5G NR) baseband processing in macrocell remote radio heads. IC Role / Device Role / Timing Role: Front-haul interface controller and digital pre-distortion (DPD) accelerator co-located with RFIC. Use Value: 640 user I/Os support dual 16-bit DDR2 interfaces for CPRI fronthaul and DPD coefficient memory; LVDS I/Os interface directly to 12-bit ADC/DACs. |
| High-Speed Test Equipment | Avionics Data Concentrator |
Use Scenario: Modular PXI Express instrumentation for high-fidelity waveform generation and analysis up to 1 GHz bandwidth. IC Role / Device Role / Timing Role: Real-time pattern generator and response analyzer with sub-nanosecond timestamping and jitter correction. Use Value: -1 speed grade ensures <1 ns path delay variation across temperature; SelectIO supports 1.25 Gbps differential I/O for high-speed digital stimulus. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data aggregation in fly-by-wire flight control computers. IC Role / Device Role / Timing Role: Deterministic time-triggered switch fabric with guaranteed latency and fault-isolation domains. Use Value: Dual-boot capability enables safe firmware rollback during in-flight updates; DCI maintains signal integrity across 20+ meter harness runs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2.5x more logic cells, higher DSP density, but requires 0.85 V core voltage vs. 1.0 V for XC5VLX330 | Targets newer 5G massive MIMO and AI inference acceleration; not drop-in compatible due to different I/O banking and configuration protocol | Choose for new designs requiring >500 GMAC/s throughput and PCIe Gen4 support |
| XC6VLX365T-1FF1156C | Virtex-6 family, same logic cell count (~365K), but lower block RAM (13.5 Mb), no built-in PCIe hard IP, and 1156-pin package | Suitable for cost-sensitive upgrades where existing PCB layout limits package size and PCIe is implemented via soft logic | Choose when migrating legacy Virtex-5 designs with minimal board rework and no hard PCIe requirement |
Compared with XC5VLX330-1FFG1760C, the XCVU9P offers higher performance and integration at the cost of power delivery complexity and toolchain migration, while the XC6VLX365T provides a pin-compatible upgrade path only in non-PCIe applications with relaxed I/O bandwidth needs.
Availability
XC5VLX330-1FFG1760C is available at Aetrix Electronics and suitable for radar signal processing, wireless baseband units, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX330-1FFG1760C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms for data center, AI, and embedded markets.
The Virtex-5 family was designed for high-throughput, low-latency signal processing in defense, aerospace, and wired/wireless infrastructure equipment.
FAQ
What is the maximum supported I/O standard voltage for XC5VLX330-1FFG1760C?
The XC5VLX330-1FFG1760C supports I/O standards up to 3.3 V, including SSTL2_I, HSTL_I, and LVCMOS33. Each I/O bank has independent VCCO supply ranging from 1.2 V to 3.3 V, enabling mixed-voltage operation across banks. The device does not support 5 V-tolerant I/Os, and all inputs must remain within VCCO + 0.5 V absolute maximum rating.
Does XC5VLX330-1FFG1760C include built-in PCI Express hard IP blocks?
Yes, XC5VLX330-1FFG1760C includes dedicated hard IP blocks for PCI Express Gen1 compliant endpoints supporting x1, x2, x4, and x8 lane configurations. These blocks integrate the physical layer (PHY), data link layer, and transaction layer, reducing logic resource usage and ensuring compliance with PCI-SIG specifications without requiring soft-core implementation.
What configuration modes are supported by XC5VLX330-1FFG1760C?
XC5VLX330-1FFG1760C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial PROM configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. Dual-boot capability allows two independent bitstreams to be stored in external SPI flash and selected dynamically via GPIO or watchdog timeout, enabling fail-safe field updates.
What is the thermal design power (TDP) range for XC5VLX330-1FFG1760C under typical operation?
XC5VLX330-1FFG1760C has a typical thermal design power of 12–18 W depending on logic utilization, I/O switching activity, and clock frequency. At full utilization with 300 MHz clocks and 50% I/O toggle rate, junction temperature remains below 100°C with a 3.5 W/°C heatsink and 200 LFM airflow. Thermal vias in the FFG1760 package enhance conduction cooling in VPX and custom carrier boards.
Is XC5VLX330-1FFG1760C still in active production and supported by AMD?
XC5VLX330-1FFG1760C is in long-term availability status with AMD's Product Change Notification (PCN) program. While no new silicon wafers are being fabricated, AMD continues to support the part through authorized distributors with remaining inventory and provides access to legacy documentation, software tools (ISE 14.7), and technical advisory services for sustaining engineering.
XC5VLX330-1FFG1760C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25920
- Number of Logic Elements/Cells:
- 331776
- Total RAM Bits:
- 10616832
- Number of I/O:
- 1200
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XC5VLX330-1FFG1760C FAQ
1.How can I place an order for XC5VLX330-1FFG1760C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX330-1FFG1760C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX330-1FFG1760C reliable?
The price and inventory of XC5VLX330-1FFG1760C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX330-1FFG1760C is usually 5 days.
3.What payment methods are accepted for XC5VLX330-1FFG1760C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX330-1FFG1760C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX330-1FFG1760C?
XC5VLX330-1FFG1760C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX330-1FFG1760C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX330-1FFG1760C?
For technical support, including XC5VLX330-1FFG1760C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX330-1FFG1760C requirements.
6.How does Aetrix verify that XC5VLX330-1FFG1760C is sourced from the original manufacturer or authorized distributors?
All XC5VLX330-1FFG1760C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX330-1FFG1760C meets industry standards.
7.What is the process for return or replacement of XC5VLX330-1FFG1760C?
All XC5VLX330-1FFG1760C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX330-1FFG1760C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX330-1FFG1760C part is unused and in its original packaging.
Return procedure for XC5VLX330-1FFG1760C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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