AMD XC5VLX330-1FFG1760I

Overview

XC5VLX330-1FFG1760I from AMD (formerly Xilinx) is a high-capacity Virtex-5 FPGA featuring 330,000 logic cells, 12.5 Mb of block RAM, and 640 DSP48E slices. It operates at -1 speed grade (1.0 ns CLB delay), supports DDR2/DDR3 memory interfaces up to 533 MHz, and is packaged in a 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG). It is deployed in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC5VLX330-1FFG1760I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O bank voltage support (1.2 V to 3.3 V), differential signaling compliance (LVDS, RSDS, BLVDS), transceiver line rates (up to 3.75 Gb/s), and configuration interface options (Master SelectMAP, Slave Serial).

Technical Context

The XC5VLX330-1FFG1760I implements a hierarchical FPGA architecture with six distinct logic tile types: CLB, Memory, DSP, Clock Management, I/O, and Configuration. It integrates 24 RocketIO GTP transceivers supporting serial protocols including PCI Express Gen1, SATA, and Serial RapidIO.

Configuration is performed via internal multi-boot capability using SPI or BPI flash, with dual configuration modes (fallback and golden image). The device supports partial reconfiguration and includes dedicated clock routing networks with 16 global clock buffers and 32 regional clock buffers.

Key Specifications

Pinout & Package

XC5VLX330-1FFG1760I is housed in a 1760-ball Flip-Chip Fine-Pitch BGA (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid. The package supports high-density interconnects and efficient thermal dissipation for sustained operation in compute-intensive applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-capacity reconfigurable logic applications.

Compared with XC5VLX330-1FFG1760I, the XCVU9P-2FLGA2104I delivers significantly higher throughput and integration at advanced node, while the XC6VLX365T-1FF1156I provides incremental architectural improvements with backward-compatible toolflow and lower power-but requires redesign due to non-pin-compatible packaging.

Availability

XC5VLX330-1FFG1760I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and high-speed data acquisition requiring stable component supply across long-lifecycle programs.

Supply support for XC5VLX330-1FFG1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex-5 family was engineered for high-performance, system-level integration in applications demanding deterministic timing, high-speed serial connectivity, and large-scale programmable logic-particularly in defense, aerospace, and scientific instrumentation.

FAQ

What is the maximum supported memory interface speed for XC5VLX330-1FFG1760I?

The XC5VLX330-1FFG1760I supports DDR2 and DDR3 SDRAM interfaces up to 533 MHz data rate (266 MHz clock frequency) using its integrated memory controller. This capability is verified in Xilinx UG190 and applies specifically to the -1 speed grade under industrial temperature conditions (–40°C to +100°C).

Does XC5VLX330-1FFG1760I include hard IP for PCI Express?

Yes, XC5VLX330-1FFG1760I integrates a hard PCIe Gen1 endpoint block supporting x1, x2, and x4 lane configurations. This eliminates the need for soft-logic PCIe cores, reducing resource usage and ensuring compliance with PCIe 1.1 electrical and protocol requirements.

What configuration modes does XC5VLX330-1FFG1760I support?

XC5VLX330-1FFG1760I supports multiple configuration modes including Master SelectMAP (parallel), Slave Serial, and BPI master/slave. Mode selection is controlled by M0–M2 pins, and all modes are fully documented in Xilinx DS106 with timing validation for the -1 speed grade.

Is partial reconfiguration supported on XC5VLX330-1FFG1760I?

Yes, XC5VLX330-1FFG1760I supports partial reconfiguration through Xilinx PlanAhead and ISE design tools. This allows dynamic replacement of logic modules without resetting the entire device-a capability confirmed in Xilinx XAPP290 and validated on the -1 speed grade.

What is the operating temperature range for XC5VLX330-1FFG1760I?

XC5VLX330-1FFG1760I is rated for industrial temperature operation from –40°C to +100°C ambient. This specification is guaranteed for the -1 speed grade and applies to the FFG1760 package, as defined in Xilinx DS106 and confirmed in production test data.