AMD XC5VLX330-2FF1760C

Overview

XC5VLX330-2FF1760C from AMD (formerly Xilinx) is a high-capacity Virtex-5 FPGA featuring 330,000 logic cells, 128 DSP48E slices, and 16.5 Mb of block RAM. It operates at -2 speed grade (1.25 GHz internal clock), uses FF1760 flip-chip BGA package with 1760 pins, and targets high-performance digital signal processing in radar and baseband wireless infrastructure.

For engineers reviewing the XC5VLX330-2FF1760C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (720 user I/Os), differential signaling support (LVDS, RSDS, BLVDS), transceiver line rate (3.75 Gbps), and configuration interface (SelectMAP, JTAG, SPI).

Technical Context

The XC5VLX330-2FF1760C implements a hierarchical FPGA architecture with six distinct logic tile types: CLB, memory, DSP, clock management, I/O, and interconnect. It integrates 24 RocketIO GTP transceivers supporting serial protocols including PCI Express Gen1 and Serial RapidIO.

Clock management relies on dual DCMs and PLLs per clock region, enabling precise phase alignment and frequency synthesis across multiple domains. Configuration occurs via 32-bit SelectMAP interface or IEEE 1149.1 JTAG boundary-scan, with bitstream encryption supported through AES-256.

Key Specifications

Pinout & Package

XC5VLX330-2FF1760C is housed in a 1760-pin flip-chip fine-pitch BGA (FF1760) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for high-power operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU3P-2FFVD1760I and XC6VLX315T-2FF1759C, the XC5VLX330-2FF1760C delivers proven reliability in legacy radar and telecom infrastructure where long-term availability and mature toolchain support (ISE 14.7) are critical, while offering lower power than UltraScale alternatives at equivalent throughput.

Availability

XC5VLX330-2FF1760C is available at Aetrix Electronics and suitable for radar signal processing, wireless baseband units, and medical imaging acceleration requiring stable component supply over extended product lifecycles.

Supply support for XC5VLX330-2FF1760C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues to support legacy Virtex families for aerospace, defense, and industrial applications requiring long-term obsolescence management.

The Virtex-5 family was designed for high-performance logic, DSP, and serial connectivity in mission-critical infrastructure where deterministic timing and radiation-tolerant configuration are essential.

FAQ

What is the maximum operating temperature for XC5VLX330-2FF1760C?

The XC5VLX330-2FF1760C is rated for commercial temperature range (0°C to 85°C ambient). Its thermal design supports continuous operation at full utilization when paired with appropriate heatsinking and airflow per Xilinx UG193 guidelines. The FF1760 package includes thermal lid construction to enhance heat dissipation from the XC5VLX330-2FF1760C die.

Does XC5VLX330-2FF1760C support partial reconfiguration?

Yes, the XC5VLX330-2FF1760C supports dynamic partial reconfiguration via the ICAP interface and PlanAhead toolflow. This allows runtime swapping of logic modules without disrupting active functions elsewhere in the XC5VLX330-2FF1760C fabric, enabling adaptive signal processing in radar and communications systems.

What configuration modes does XC5VLX330-2FF1760C support?

The XC5VLX330-2FF1760C supports Master SelectMAP, Slave SelectMAP, JTAG, and Master SPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Bitstream security features like AES-256 encryption apply only to SelectMAP and SPI modes, not JTAG.

Is XC5VLX330-2FF1760C RoHS compliant?

Yes, the XC5VLX330-2FF1760C is RoHS-compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FF1760 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) handling standards.

What development tools are required for XC5VLX330-2FF1760C?

XC5VLX330-2FF1760C requires Xilinx ISE Design Suite 14.7 for synthesis, implementation, and bitstream generation. Simulation uses ISim or third-party tools compatible with VHDL/Verilog netlists. Programming is performed via iMPACT or ChipScope Pro for in-system debugging of the XC5VLX330-2FF1760C.