AMD XC5VLX330T-1FFG1738I
- Part No.:
- XC5VLX330T-1FFG1738I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1738-BBGA, FCBGA
- Datasheet:
-
XC5VLX330T-1FFG1738I.pdf
- Description:
- IC FPGA 960 I/O 1738FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VLX330T-1FFG1738I from AMD (formerly Xilinx) is a high-capacity Virtex-5 FPGA featuring 330,000 logic cells, 12.5 Mb of block RAM, and 640 DSP48E slices. It integrates multi-gigabit transceivers operating up to 3.75 Gbps and supports PCI Express® Gen1 endpoint functionality. It is used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC5VLX330T-1FFG1738I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (720 user I/Os), transceiver lane count (24 lanes), speed grade (-1), and thermal design power (29.2 W typical).
Technical Context
The XC5VLX330T-1FFG1738I implements a column-based architecture with dedicated routing for clock, reset, and control signals. It includes 24 RocketIO™ GTP transceivers, each supporting protocols including SATA, PCIe, and Serial RapidIO.
It uses 65 nm copper process technology, features SelectIO™ technology supporting LVDS, SSTL, HSTL, and differential signaling standards, and incorporates integrated DCMs and PLLs for clock management across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 330,000 - determines maximum combinational and sequential logic capacity for complex RTL implementation |
| Block RAM | 12.5 Mb - supports large on-chip data buffering, FIFOs, and memory-mapped peripherals |
| DSP Slices | 640 DSP48E - enables high-throughput arithmetic operations for filtering, FFT, and matrix math |
| Transceivers | 24 GTP lanes @ 3.75 Gbps - provides native serial connectivity without external PHYs |
| User I/Os | 720 - enables wide parallel interfaces, high-pin-count sensor/processor bridging, and board-level expansion |
| Speed Grade | -1 - specifies maximum guaranteed timing performance at industrial temperature range (-40°C to +100°C) |
| Package | FFG1738 - 1738-ball flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
The XC5VLX330T-1FFG1738I is housed in a 1738-ball flip-chip BGA (FFG1738) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal management in industrial and telecom applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration, JTAG, and select I/O banks; shared with transceiver auxiliary circuits |
| VCCO | I/O bank power | Programmable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface support |
| MR | Master reset | Active-low asynchronous reset controlling configuration state machine and logic initialization |
| CCLK | Configuration clock | Drives internal configuration shift register during master serial or slave parallel modes |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness and error detection |
Key Features
| Feature | Design Value |
|---|---|
| Column-based architecture | Enables predictable timing closure and scalable floorplanning for large designs |
| SelectIO™ technology | Supports 21 I/O standards including LVDS DCI, reducing external level-shifting components |
| Integrated clock management | Includes four DCMs and two PLLs per device for jitter-reduced multi-domain clock synthesis |
| RocketIO™ GTP transceivers | Provide embedded 8B/10B encoding, elastic buffers, and protocol-specific PCS layers |
| PCI Express® endpoint support | Enables direct integration into host systems without bridge chips or external controllers |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable hardware accelerator implementing adaptive filtering and FFT pipelines with deterministic latency. Use Value: 640 DSP48E slices enable >200 GMAC/s throughput; 24 GTP lanes route ADC data streams directly to memory controllers. | Use Scenario: High-speed image reconstruction in MRI and CT scanners using iterative algorithms. IC Role / Device Role / Timing Role: Reconfigurable compute engine interfacing with multi-channel ADCs and DDR2 memory subsystems. Use Value: 12.5 Mb block RAM supports on-chip storage of intermediate reconstruction matrices; 720 I/Os manage parallel sensor data ingestion. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and discrete I/O aggregation in flight control units. IC Role / Device Role / Timing Role: Protocol-agnostic interface hub with time-stamped packetization and deterministic scheduling. Use Value: SelectIO™ supports mixed-voltage I/O banks for legacy avionics bus levels; DCMs ensure sub-100 ps clock skew across safety-critical paths. | Use Scenario: Bit-error-rate testing and protocol validation for 3 Gbps serial links. IC Role / Device Role / Timing Role: Programmable pattern generator and error detector with real-time eye diagram analysis. Use Value: GTP transceivers operate at 3.75 Gbps with built-in PRBS generators and BER counters; -1 speed grade guarantees timing margin at full rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX330-1FFG1738I | Lacks GTP transceivers; no serial I/O capability | Suitable only for parallel-bus or non-serial applications requiring same logic density | Select when transceivers are unnecessary and cost reduction is prioritized |
| XC6VLX365T-1FFG1156I | Newer Virtex-6 generation; 365K LUTs, 24 GTX transceivers @ 6.6 Gbps, smaller 1156-ball package | Better bandwidth and lower power per DSP slice, but requires new PCB layout and toolchain migration | Choose for new designs needing higher serial bandwidth and improved DSP efficiency |
Compared with XC5VLX330-1FFG1738I, the XC5VLX330T-1FFG1738I adds essential transceiver capability without increasing logic count; versus XC6VLX365T-1FFG1156I, it offers proven stability and mature tool support at the cost of lower serial speed and larger footprint.
Availability
XC5VLX330T-1FFG1738I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and high-speed test equipment requiring stable component supply over extended product lifecycles.
Supply support for XC5VLX330T-1FFG1738I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-5 family was engineered for high-performance, system-level integration in aerospace, defense, and wired infrastructure applications where logic density, serial bandwidth, and deterministic timing are critical.
FAQ
What is the operating temperature range for XC5VLX330T-1FFG1738I?
The XC5VLX330T-1FFG1738I is rated for industrial temperature operation from –40°C to +100°C. This range is validated under the -1 speed grade and applies to all functional blocks including logic fabric, block RAM, DSP slices, and GTP transceivers. Thermal derating is not required within this envelope when proper PCB thermal vias and heatsinking are implemented per Xilinx UG192.
Does XC5VLX330T-1FFG1738I support PCI Express Gen1 x4 endpoint configuration?
Yes, the XC5VLX330T-1FFG1738I natively supports PCI Express Gen1 endpoint operation at x1, x2, x4, and x8 widths using its integrated RocketIO™ GTP transceivers and PCI Express LogiCORE IP. The -1 speed grade ensures timing compliance for Gen1 at 2.5 Gbps per lane, and the FFG1738 package provides sufficient I/O routing for full x4 implementation.
How many clock management tiles does XC5VLX330T-1FFG1738I include?
The XC5VLX330T-1FFG1738I contains four Digital Clock Managers (DCMs) and two Phase-Locked Loops (PLLs). These are distributed across the die to support independent clock domain management for logic, I/O, and transceiver subsystems. Each DCM supports frequency synthesis, phase shifting, and duty-cycle correction; each PLL provides wider multiplication ranges and lower jitter.
What configuration modes are supported by XC5VLX330T-1FFG1738I?
The XC5VLX330T-1FFG1738I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Configuration bitstream loading occurs via dedicated configuration pins (CCLK, DIN, INIT_B, PROGRAM_B), and the device can be configured from SPI flash, microprocessor, or boundary-scan controller. Multi-boot and fallback configurations are enabled through external address lines and mode pins.
Is XC5VLX330T-1FFG1738I RoHS compliant and lead-free?
Yes, the XC5VLX330T-1FFG1738I is RoHS compliant and manufactured with lead-free (Pb-free) flip-chip packaging. The FFG1738 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). Full compliance documentation, including substance declarations and test reports, is available from AMD's Product Change Notification archives.
XC5VLX330T-1FFG1738I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LXT
- Package/Case:
- 1738-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25920
- Number of Logic Elements/Cells:
- 331776
- Total RAM Bits:
- 11943936
- Number of I/O:
- 960
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1738-FCBGA (42.5x42.5)
XC5VLX330T-1FFG1738I FAQ
1.How can I place an order for XC5VLX330T-1FFG1738I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX330T-1FFG1738I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX330T-1FFG1738I reliable?
The price and inventory of XC5VLX330T-1FFG1738I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX330T-1FFG1738I is usually 5 days.
3.What payment methods are accepted for XC5VLX330T-1FFG1738I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX330T-1FFG1738I transactions.
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Once your XC5VLX330T-1FFG1738I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX330T-1FFG1738I?
For technical support, including XC5VLX330T-1FFG1738I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX330T-1FFG1738I requirements.
6.How does Aetrix verify that XC5VLX330T-1FFG1738I is sourced from the original manufacturer or authorized distributors?
All XC5VLX330T-1FFG1738I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX330T-1FFG1738I meets industry standards.
7.What is the process for return or replacement of XC5VLX330T-1FFG1738I?
All XC5VLX330T-1FFG1738I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX330T-1FFG1738I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX330T-1FFG1738I part is unused and in its original packaging.
Return procedure for XC5VLX330T-1FFG1738I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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