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AMD XC5VLX330T-2FFG1738C

Part No.:
XC5VLX330T-2FFG1738C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1738-BBGA, FCBGA
Datasheet:
AetrixXC5VLX330T-2FFG1738C.pdf
Description:
IC FPGA 960 I/O 1738FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,858

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Product details

Overview

XC5VLX330T-2FFG1738C from AMD (formerly Xilinx) is a high-capacity Virtex-5 FPGA featuring 330,000 logic cells, 1,200 DSP48E slices, and 16.4 Mb of block RAM. It supports multi-gigabit transceivers up to 3.75 Gbps and operates at -2 speed grade with 1.0 V core voltage. It is used in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC5VLX330T-2FFG1738C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count, I/O bank voltage flexibility, embedded memory depth, and thermal performance in compact PCB layouts.

Technical Context

The XC5VLX330T-2FFG1738C implements a column-based architecture with dedicated routing for clock, reset, and control signals. It integrates 24 RocketIO GTP transceivers, each supporting protocols including PCIe Gen1, SATA, and Serial RapidIO.

It features SelectIO technology with support for LVDS, SSTL, HSTL, and differential signaling across 16 I/O banks. Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption available using AES-256.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells330,000 - determines maximum combinational/sequential logic capacity for complex state machines or pipeline stages
DSP Slices1,200 × DSP48E - enables parallel multiply-accumulate operations for FIR filters or FFT engines
Block RAM16.4 Mb - supports large on-chip data buffering, FIFOs, or coefficient storage without external memory
Transceivers24 × RocketIO GTP - provides 24 independent serial links up to 3.75 Gbps for high-speed interconnect
I/O Banks16 - allows mixed-voltage operation (1.2 V to 3.3 V) across different interface standards on same device
Speed Grade-2 - guarantees timing closure at 1.0 V core supply with specified maximum operating frequency

Pinout & Package

XC5VLX330T-2FFG1738C is housed in a 1738-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal characteristics include 0.29 °C/W junction-to-case thermal resistance.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockDrives internal configuration logic during Master SelectMAP mode; requires clean 50 MHz source
DINData InputSerial bitstream input for configuration; synchronous to CCLK rising edge
INIT_BInitialization StatusOpen-drain output indicating configuration status; pulled high when ready
PROGRAM_BConfiguration ResetActive-low asynchronous reset that clears configuration memory and restarts loading
M0–M2Mode SelectThree-pin bus selecting configuration mode (JTAG, Slave SelectMAP, etc.) at power-up

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables dynamic module swapping without full device reset, reducing system downtime in telecom baseband processing
AES-256 Bitstream EncryptionPrevents IP theft by securing configuration data against readback or cloning attacks
Integrated PCI Express Endpoint BlockReduces external logic count by embedding hard PCIe Gen1 x1/x2/x4 endpoint functionality
Multi-Voltage I/O BanksAllows direct interfacing to legacy 3.3 V peripherals and modern 1.2 V ASICs without level shifters

Applications

Radar Signal ProcessingMedical Imaging Backend

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: Configurable hardware accelerator handling time-critical FFTs and CFAR detection.

Use Value: 1,200 DSP48E slices enable simultaneous 1024-point FFTs across multiple channels with sub-microsecond latency.

Use Scenario: High-throughput image reconstruction in MRI and CT scanner backends.

IC Role / Device Role / Timing Role: Parallel data path manager interfacing ADCs, DDR2 memory, and PCIe host interface.

Use Value: 16.4 Mb block RAM buffers raw k-space data while 24 GTP transceivers stream processed images to host PC.

Avionics Data ConcentratorHigh-Speed Test Equipment

Use Scenario: ARINC 429, MIL-STD-1553, and discrete I/O aggregation in flight control units.

IC Role / Device Role / Timing Role: Deterministic protocol bridge with guaranteed worst-case latency under DO-254 compliance.

Use Value: 16 I/O banks support concurrent 5 V and 2.5 V signaling, eliminating external voltage translators in mixed-legacy avionics designs.

Use Scenario: Pattern generation and response analysis in automated test equipment for SoC validation.

IC Role / Device Role / Timing Role: Programmable stimulus engine synchronized to 3.75 Gbps serial lanes for JESD204B compliance testing.

Use Value: RocketIO GTP transceivers operate at precise PVT corners, enabling jitter tolerance verification per JEDEC JESD204B spec.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable computing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX330-2FF1738CLacks RocketIO GTP transceivers; no high-speed serial I/O capabilitySuitable only for parallel-bus or low-speed interface applicationsSelect XC5VLX330T-2FFG1738C when transceiver integration is required to reduce board area and BOM count
XCVU3P-2FFVD1760EUltraScale architecture; higher logic density (523K LUTs), 16.3 Gbps transceivers, but larger 1760-pin FCBGA packageTargets next-generation 5G and AI-accelerated workloads requiring higher bandwidthChoose XC5VLX330T-2FFG1738C for mature, cost-optimized designs where 3.75 Gbps serial links and proven qualification meet requirements

Compared with XC5VLX330-2FF1738C, the XC5VLX330T-2FFG1738C adds transceiver capability without increasing logic cell count; versus XCVU3P-2FFVD1760E, it offers smaller footprint and lower power at reduced serial bandwidth, making it optimal for deployed aerospace and medical systems requiring long-term availability.

Availability

XC5VLX330T-2FFG1738C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and avionics data concentrator applications requiring stable component supply over extended production lifecycles.

Supply support for XC5VLX330T-2FFG1738C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Virtex-5 family was designed for high-performance, high-bandwidth applications including wired infrastructure, defense electronics, and scientific instrumentation.

FAQ

What is the maximum operating temperature for XC5VLX330T-2FFG1738C?

The XC5VLX330T-2FFG1738C is rated for commercial temperature range (0 °C to +85 °C ambient). Its thermal design supports junction temperatures up to +100 °C under typical airflow and PCB copper pour conditions. The device includes on-die temperature sensors accessible via JTAG for real-time monitoring in mission-critical deployments of XC5VLX330T-2FFG1738C.

Does XC5VLX330T-2FFG1738C support partial reconfiguration?

Yes, XC5VLX330T-2FFG1738C supports partial reconfiguration through Xilinx ISE Design Suite tools. This capability allows runtime modification of specific logic regions without resetting the entire device, enabling dynamic function switching in radar and test equipment applications using XC5VLX330T-2FFG1738C.

What configuration modes are supported by XC5VLX330T-2FFG1738C?

XC5VLX330T-2FFG1738C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial PROM configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The device also supports fallback configuration and dual-boot via external SPI flash, critical for field-upgradable XC5VLX330T-2FFG1738C deployments.

Is XC5VLX330T-2FFG1738C RoHS compliant?

Yes, XC5VLX330T-2FFG1738C is RoHS-6 compliant (lead-free, halogen-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The FFG1738 package uses matte tin finish on solder balls, verified per IPC-J-STD-609A for XC5VLX330T-2FFG1738C manufacturing and assembly.

What is the recommended power supply sequencing for XC5VLX330T-2FFG1738C?

XC5VLX330T-2FFG1738C requires strict power sequencing: VCCINT (1.0 V) must be applied before VCCAUX (2.5 V) and VCCO (1.2–3.3 V). Deviation risks configuration failure or latch-up. Power supply ramp rates should not exceed 100 ms; this sequencing is enforced in reference designs for XC5VLX330T-2FFG1738C to ensure reliable startup.

XC5VLX330T-2FFG1738C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LXT
Package/Case:
1738-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
25920
Number of Logic Elements/Cells:
331776
Total RAM Bits:
11943936
Number of I/O:
960
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1738-FCBGA (42.5x42.5)

XC5VLX330T-2FFG1738C FAQ

1.How can I place an order for XC5VLX330T-2FFG1738C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX330T-2FFG1738C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX330T-2FFG1738C reliable?

The price and inventory of XC5VLX330T-2FFG1738C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX330T-2FFG1738C is usually 5 days.

3.What payment methods are accepted for XC5VLX330T-2FFG1738C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX330T-2FFG1738C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX330T-2FFG1738C?

XC5VLX330T-2FFG1738C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX330T-2FFG1738C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX330T-2FFG1738C?

For technical support, including XC5VLX330T-2FFG1738C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX330T-2FFG1738C requirements.

6.How does Aetrix verify that XC5VLX330T-2FFG1738C is sourced from the original manufacturer or authorized distributors?

All XC5VLX330T-2FFG1738C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX330T-2FFG1738C meets industry standards.

7.What is the process for return or replacement of XC5VLX330T-2FFG1738C?

All XC5VLX330T-2FFG1738C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX330T-2FFG1738C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX330T-2FFG1738C part is unused and in its original packaging.

Return procedure for XC5VLX330T-2FFG1738C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX330T-2FFG1738C Tags

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  • XC5VLX330T-2FFG1738C Images
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