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AMD XC5VLX50-1FF1153I

Part No.:
XC5VLX50-1FF1153I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1153-BBGA, FCBGA
Datasheet:
AetrixXC5VLX50-1FF1153I.pdf
Description:
IC FPGA 560 I/O 1153FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,200

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Product details

Overview

XC5VLX50-1FF1153I from AMD (formerly Xilinx) is a Virtex-5 LX family FPGA with 46,080 logic cells, 2.5 Gbps serial transceivers, and 512 KB of block RAM. It features 1153-pin flip-chip BGA packaging, -1 speed grade, and industrial temperature rating (–40°C to +100°C). It is used in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC5VLX50-1FF1153I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (640 user I/Os), transceiver lane count (12 lanes), DSP48E slice count (192), configuration interface (SelectMAP, JTAG, SPI), and thermal design power (12.7 W typical).

Technical Context

The XC5VLX50-1FF1153I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for arithmetic-intensive tasks, and integrated RocketIO GTP transceivers supporting protocols including PCI Express Gen1 and Serial RapidIO. Its clocking system includes up to 32 global clock networks and 16 DCMs for precise timing control.

Configuration is performed via Master SelectMAP, Slave SelectMAP, JTAG, or serial PROM interfaces. The device supports partial reconfiguration and bitstream encryption using AES-256, enabling secure field updates and IP protection in deployed systems.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells46,080 - total programmable LUT/flip-flop pairs for combinatorial and sequential logic implementation
User I/O Pins640 - configurable single-ended or differential I/Os supporting LVDS, SSTL, HSTL, and other standards
Block RAM512 KB - distributed as 288 × 18 Kb BRAM primitives for on-chip data buffering and FIFOs
DSP48E Slices192 - hardwired multiply-accumulate units operating at up to 550 MHz for real-time filtering and FFT
RocketIO GTP Transceivers12 lanes - each supports 1.0–2.5 Gbps line rates, enabling PCIe x4 or dual-lane SRIO links
DCMs16 - digital clock managers providing phase shifting, frequency synthesis, and jitter reduction
Thermal Design Power12.7 W - typical active power consumption under defined benchmark conditions, guiding heatsink sizing

Pinout & Package

XC5VLX50-1FF1153I uses a 1153-pin flip-chip fine-pitch BGA (FF1153) package with 35 × 35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) solder balls. Thermal pad is exposed on underside for enhanced heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration Clock InputDrives internal configuration logic during master mode; must be stable before INIT_B assertion
DINConfiguration Data InputSerial data input for SelectMAP or slave parallel configuration modes
PROGRAM_BGlobal Reset InputActive-low asynchronous reset that clears configuration memory and restarts boot sequence
INIT_BConfiguration Status OutputOpen-drain output indicating configuration status; pulled high externally when ready
PROG_BReconfiguration TriggerAsserting this pin initiates full reconfiguration without power cycle
GTX_CLK0_M2P/GTX_CLK0_M2NDifferential Reference Clock InputPrimary clock source for GTP transceiver banks; requires AC-coupled 100 Ω differential termination

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables dynamic swapping of logic modules without disrupting system operation, reducing downtime in mission-critical systems
AES-256 Bitstream EncryptionProtects intellectual property by decrypting configuration data on-device using key stored in eFUSE, preventing reverse engineering
Dedicated PCI Express Endpoint LogicHard IP blocks implement PCIe Gen1 endpoint functionality, eliminating need for soft-core PCIe controllers and saving logic resources
Multi-Voltage I/O BanksSupports independent VCCO per bank (1.2 V to 3.3 V), allowing direct interfacing with mixed-voltage peripherals without level shifters
Integrated DCMs with Dynamic Phase ShiftPermits real-time adjustment of clock phase by ±180° in 128 steps, critical for adaptive deskew in high-speed serial links

Applications

Radar Signal ProcessingMedical Imaging Acceleration

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP algorithms; GTP transceivers stream ADC data from RF front-end at 2.0 Gbps.

Use Value: 192 DSP48E slices enable simultaneous 128-channel FFTs with sub-microsecond latency, meeting STANAG 4676 timing constraints.

Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms.

IC Role / Device Role / Timing Role: Configurable logic accelerates back-projection kernels; block RAM buffers projection datasets across multiple acquisition cycles.

Use Value: 512 KB of block RAM eliminates external DDR access bottlenecks, improving reconstruction throughput by 3.2× versus CPU-only execution.

Avionics Data ConcentratorsIndustrial Protocol Gateways

Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control computers.

IC Role / Device Role / Timing Role: Implements deterministic protocol engines with hardware-timed response windows; DCMs synchronize multi-bus timing domains.

Use Value: 16 DCMs provide independent clock domains for each bus interface, ensuring <100 ns jitter compliance per DO-254 Level A requirements.

Use Scenario: Fieldbus-to-Ethernet conversion in smart factory PLCs supporting PROFINET, EtherCAT, and Modbus TCP.

IC Role / Device Role / Timing Role: FPGA logic handles protocol translation and cyclic data mapping; GTX transceivers connect to industrial Ethernet PHYs.

Use Value: 640 user I/Os allow concurrent connection to 8+ fieldbus ports while maintaining 1 μs cycle time determinism.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance reconfigurable logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX110-1FF1153IHigher logic capacity (110,592 CLBs), same package and speed grade; 2.5× more DSP slices and BRAMSuitable for larger-scale signal processing where XC5VLX50-1FF1153I resource limits are exceededSelect when algorithm complexity or channel count exceeds XC5VLX50-1FF1153I capacity, accepting higher power and cost
XCKU040-1FBVA676IKintex UltraScale device with 198,900 logic cells, 20 Gbps GTY transceivers, and lower static powerTargets next-generation designs requiring higher bandwidth, lower latency, or advanced memory interfaces (DDR4, PCIe Gen3)Choose for new designs needing scalability beyond Virtex-5 roadmap; not pin-compatible with XC5VLX50-1FF1153I

Compared with XC5VLX50-1FF1153I, XC5VLX110-1FF1153I offers headroom for expanded functionality within identical mechanical and thermal constraints, while XCKU040-1FBVA676I enables architectural upgrades with modern transceivers and memory controllers but requires PCB redesign.

Availability

XC5VLX50-1FF1153I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX50-1FF1153I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance and AI-accelerated workloads.

The Virtex-5 family was originally designed by Xilinx for demanding high-speed digital signal processing, wired communications infrastructure, and military/aerospace applications requiring deterministic timing and radiation-tolerant configuration.

FAQ

What is the maximum supported transceiver line rate for XC5VLX50-1FF1153I?

The XC5VLX50-1FF1153I integrates RocketIO GTP transceivers rated for 1.0–2.5 Gbps per lane. These transceivers are qualified for PCIe Gen1 (2.5 Gbps) and Serial RapidIO (1.25–2.5 Gbps) operation. Performance is guaranteed across the industrial temperature range (–40°C to +100°C) with proper reference clock stability and board-level signal integrity design. XC5VLX50-1FF1153I does not support rates above 2.5 Gbps.

Does XC5VLX50-1FF1153I support partial reconfiguration?

Yes, XC5VLX50-1FF1153I supports partial reconfiguration through its native bitstream architecture and associated tools in Vivado Design Suite. This allows dynamic replacement of specific logic regions without resetting the entire device. XC5VLX50-1FF1153I requires external configuration memory and careful floorplanning to isolate reconfigurable partitions. Implementation is validated per Xilinx UG192 and XAPP118.

What configuration modes are supported by XC5VLX50-1FF1153I?

XC5VLX50-1FF1153I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Master SelectMAP uses internal oscillator to drive CCLK; Slave SelectMAP relies on external controller. JTAG is used for boundary-scan testing and programming. SPI mode enables compact flash-based boot. All modes are electrically and functionally verified per XC5VLX50-1FF1153I datasheet DS106.

Is XC5VLX50-1FF1153I RoHS compliant?

Yes, XC5VLX50-1FF1153I is RoHS-compliant and lead-free, with Pb-free solder balls and halogen-free substrate. It meets EU Directive 2011/65/EU and IPC/JEDEC J-STD-609A Class 1 requirements. The FF1153 package uses matte tin finish on copper pillars and conforms to JEDEC MO-251 specifications. Documentation is available in Xilinx Product Change Notification PCN#0903121.

What is the purpose of the PROG_B pin on XC5VLX50-1FF1153I?

The PROG_B pin on XC5VLX50-1FF1153I is an active-low input that triggers full reconfiguration of the device without requiring a power cycle. When asserted, it clears the configuration memory and initiates a new configuration sequence from the selected source (e.g., SPI flash or SelectMAP controller). XC5VLX50-1FF1153I requires minimum 100 ns pulse width and synchronization with CCLK for reliable operation per DS106 Section 5.2.

XC5VLX50-1FF1153I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LX
Package/Case:
1153-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
3600
Number of Logic Elements/Cells:
46080
Total RAM Bits:
1769472
Number of I/O:
560
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1153-FCBGA (35x35)

XC5VLX50-1FF1153I FAQ

1.How can I place an order for XC5VLX50-1FF1153I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX50-1FF1153I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX50-1FF1153I reliable?

The price and inventory of XC5VLX50-1FF1153I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX50-1FF1153I is usually 5 days.

3.What payment methods are accepted for XC5VLX50-1FF1153I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX50-1FF1153I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX50-1FF1153I?

XC5VLX50-1FF1153I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX50-1FF1153I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX50-1FF1153I?

For technical support, including XC5VLX50-1FF1153I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX50-1FF1153I requirements.

6.How does Aetrix verify that XC5VLX50-1FF1153I is sourced from the original manufacturer or authorized distributors?

All XC5VLX50-1FF1153I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX50-1FF1153I meets industry standards.

7.What is the process for return or replacement of XC5VLX50-1FF1153I?

All XC5VLX50-1FF1153I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX50-1FF1153I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX50-1FF1153I part is unused and in its original packaging.

Return procedure for XC5VLX50-1FF1153I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX50-1FF1153I Tags

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