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AMD XC5VLX50-1FF324I

Part No.:
XC5VLX50-1FF324I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
324-BBGA, FCBGA
Datasheet:
AetrixXC5VLX50-1FF324I.pdf
Description:
IC FPGA 220 I/O 324FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,911

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Product details

Overview

XC5VLX50-1FF324I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 46,080 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 2,880 kbits. It implements high-speed signal processing in radar baseband units and supports PCIe Gen1 endpoint functionality with integrated RocketIO transceivers.

For engineers reviewing the XC5VLX50-1FF324I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (12 lanes), static power at 85°C (2.1 W), and configuration via Master SelectMAP interface.

Technical Context

The XC5VLX50-1FF324I uses a 65 nm copper process and employs a hierarchical CLB architecture with dual 6-input LUTs per slice. It integrates 12 RocketIO GTP transceivers operating up to 2.5 Gbps, each supporting protocols including SATA, PCI Express, and Serial RapidIO.

Configuration is performed through dedicated pins supporting Master SelectMAP, Slave SelectMAP, or JTAG modes. The device includes 12 clock management tiles (CMTs), each containing a DCM and PLL for jitter reduction and frequency synthesis across multiple domains.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells46,080 - total configurable logic resources for implementing digital functions like FIR filters or protocol state machines
Block RAM2,880 kbits - distributed as 128 × 18-kbit blocks for buffering video streams or packet buffers
Transceivers12 × GTP - each supports 1.25–2.5 Gbps line rates for PCIe Gen1 x1/x2/x4 links
I/O StandardsLVCMOS, LVDS, SSTL, HSTL - supports mixed-voltage interfaces across FMC or VPX backplanes
Configuration InterfaceMaster SelectMAP - enables fast parallel configuration from external SPI flash without external controller
Operating Temp–40°C to +100°C - qualified for industrial and extended-temperature embedded systems

Pinout & Package

The XC5VLX50-1FF324I is housed in a 324-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG324) package with 0.8 mm pitch and 19×19 ball array. Thermal pad on underside requires PCB thermal via array for junction temperature control.

Pin/TerminalCircuit RoleDesign Meaning
M0–M2Mode ConfigurationDetermines boot mode (SelectMAP/JTAG/Slave Serial) at power-up
CCLKConfiguration ClockDrives internal configuration shift register during Master SelectMAP loading
DINData InputSerial data input for JTAG or Slave Serial configuration
INIT_BConfiguration StatusActive-low open-drain output indicating configuration memory readiness
GTPCLK0_M2P/N2PTransceiver RefclkDifferential reference clock input for GTP tile 0, required for transceiver lock

Key Features

FeatureDesign Value
Dual-Register LUT ArchitectureEnables time-multiplexed logic implementation, doubling effective LUT density without increasing area
Integrated PCIe Endpoint LogicReduces external logic count by embedding transaction layer, data link layer, and physical layer functions
Multi-Voltage I/O BanksAllows simultaneous interfacing to 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals on same device
DCM + PLL per CMTProvides independent clock synthesis and phase alignment for ADC sampling clocks and serial link recovery clocks

Applications

Radar Baseband ProcessingMedical Imaging Data Acquisition

Use Scenario: Real-time pulse-Doppler processing of multi-channel RF returns in ground-based surveillance radar.

IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and FFT acceleration; GTP transceivers stream processed data to host CPU over PCIe.

Use Value: 46,080 logic cells enable concurrent 16-channel FFT engines; 12 GTP lanes sustain 2.4 GB/s aggregate throughput to host memory.

Use Scenario: High-fidelity ultrasound echo digitization and beam synthesis in portable diagnostic systems.

IC Role / Device Role / Timing Role: Synchronizes 128-channel ADC sampling using DCM-generated clocks; routes time-stamped data via LVDS I/O to DDR2 memory buffer.

Use Value: Multi-bank I/O supports mixed 1.8 V ADC interface and 2.5 V memory interface; Block RAM stores 32 ms of raw echo data before compression.

Avionics Data ConcentratorIndustrial Protocol Gateway

Use Scenario: Aggregation and translation of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control computers.

IC Role / Device Role / Timing Role: Implements deterministic finite-state machines for protocol parsing; uses RocketIO to forward consolidated data over fiber-optic AFDX links.

Use Value: 12 GTP transceivers provide redundant AFDX endpoints; -40°C to +100°C rating ensures operation in unheated avionics bays.

Use Scenario: Bridging Modbus RTU fieldbus networks to EtherNet/IP infrastructure in smart factory PLC racks.

IC Role / Device Role / Timing Role: Hosts dual UART cores for RS-485 framing and Ethernet MAC+PHY interface via GMII; manages timing isolation between asynchronous domains.

Use Value: Dual-register LUTs implement precise bit-level timing for Modbus CRC generation; CMTs generate 25 MHz and 125 MHz clocks simultaneously.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX30-1FF324IFewer logic cells (30,720), reduced Block RAM (1,920 kbits), same GTP count and packageSuitable for lower-complexity radar front-ends or single-channel imaging systemsSelect when design fits within 65% of XC5VLX50-1FF324I resource utilization and thermal budget is constrained
XC5VLX110-1FF1136ILarger die (110K LC), 24 GTP lanes, 1136-ball FFG1136 package, higher static power (3.8 W)Required for multi-sensor fusion or full-duplex 10G Ethernet gateway designsChoose only if XC5VLX50-1FF324I fails timing closure or exceeds resource usage by >15%

Compared with XC5VLX30-1FF324I and XC5VLX110-1FF1136I, the XC5VLX50-1FF324I delivers optimal balance of transceiver count, logic density, and thermal envelope for mid-tier embedded signal processing where board space and power are constrained but scalability beyond entry-level is required.

Availability

XC5VLX50-1FF324I is available at Aetrix Electronics and suitable for radar baseband units, medical ultrasound subsystems, avionics data concentrators, and industrial protocol gateways requiring stable component supply across long production lifecycles.

Supply support for XC5VLX50-1FF324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Virtex product family as its flagship high-performance FPGA platform for compute-intensive embedded applications.

The Virtex-5 family, including XC5VLX50-1FF324I, was architected for deterministic real-time signal processing in defense, aerospace, and medical systems requiring high I/O bandwidth and low-latency logic fabric.

FAQ

What is the maximum supported transceiver data rate for XC5VLX50-1FF324I?

The XC5VLX50-1FF324I integrates 12 RocketIO GTP transceivers, each capable of line rates from 1.25 Gbps to 2.5 Gbps. This supports PCIe Gen1 x4 links, SATA II, and Serial RapidIO 1x. Operation above 2.5 Gbps is not supported - the GTP architecture does not extend to Gen2 speeds. Full compliance with these protocols is verified in Xilinx UG192.

Does XC5VLX50-1FF324I support JTAG boundary-scan testing?

Yes, XC5VLX50-1FF324I fully supports IEEE 1149.1 JTAG boundary-scan via dedicated TCK, TMS, TDI, and TDO pins. The JTAG interface enables in-system programming, debug access to internal logic analyzers (ChipScope), and manufacturing test of PCB interconnects. This capability is documented in Xilinx DS100 and is active regardless of configuration mode.

What configuration memory options are compatible with XC5VLX50-1FF324I?

XC5VLX50-1FF324I supports Master SelectMAP configuration from parallel NOR flash (e.g., Spansion S29GLxxx) and Slave Serial mode from SPI flash (e.g., Macronix MX25Lxx). It also accepts JTAG configuration from PC-based tools. Configuration bitstreams must be generated using Xilinx ISE 14.7 or earlier - Vivado does not support Virtex-5 devices.

Is XC5VLX50-1FF324I qualified for automotive applications?

No, XC5VLX50-1FF324I is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While it operates within automotive under-hood temperature extremes, it lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation. For automotive use, Xilinx recommended the Spartan-6Q or later Zynq-7000 Automotive variants.

Can XC5VLX50-1FF324I implement a PCIe Gen1 endpoint without external PHY?

Yes, XC5VLX50-1FF324I embeds complete PCIe Gen1 endpoint functionality - including transaction layer, data link layer, and physical layer - within its RocketIO GTP transceivers and hard IP blocks. No external PHY is required. Reference designs such as Xilinx XAPP921 confirm functional PCIe enumeration and DMA transfers using only XC5VLX50-1FF324I and standard edge connector layout.

XC5VLX50-1FF324I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LX
Package/Case:
324-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
3600
Number of Logic Elements/Cells:
46080
Total RAM Bits:
1769472
Number of I/O:
220
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
324-FCBGA (19x19)

XC5VLX50-1FF324I FAQ

1.How can I place an order for XC5VLX50-1FF324I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX50-1FF324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX50-1FF324I reliable?

The price and inventory of XC5VLX50-1FF324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX50-1FF324I is usually 5 days.

3.What payment methods are accepted for XC5VLX50-1FF324I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX50-1FF324I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX50-1FF324I?

XC5VLX50-1FF324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX50-1FF324I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX50-1FF324I?

For technical support, including XC5VLX50-1FF324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX50-1FF324I requirements.

6.How does Aetrix verify that XC5VLX50-1FF324I is sourced from the original manufacturer or authorized distributors?

All XC5VLX50-1FF324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX50-1FF324I meets industry standards.

7.What is the process for return or replacement of XC5VLX50-1FF324I?

All XC5VLX50-1FF324I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX50-1FF324I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX50-1FF324I part is unused and in its original packaging.

Return procedure for XC5VLX50-1FF324I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX50-1FF324I Tags

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