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AMD XC5VLX50-1FF676I

Part No.:
XC5VLX50-1FF676I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXC5VLX50-1FF676I.pdf
Description:
IC FPGA 440 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,120

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Product details

Overview

XC5VLX50-1FF676I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 46,080 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 2,002 kbits. It implements high-speed signal processing in radar baseband units and supports PCIe Gen1 endpoint functionality with integrated RocketIO transceivers.

For engineers reviewing the XC5VLX50-1FF676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (12 lanes), and -1 speed grade timing compliance for deterministic latency paths.

Technical Context

The XC5VLX50-1FF676I uses a 65 nm copper process and employs a column-based architecture with dedicated DSP48E slices for arithmetic-intensive tasks. It integrates 12 RocketIO GTP transceivers operating up to 3.75 Gbps per lane and supports multi-gigabit protocols including SATA, Serial RapidIO, and CPRI.

Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption supported through AES-256. The device includes dual-register flip-flops per slice and supports partial reconfiguration for dynamic function swapping without full system reset.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells46,080 - provides gate count equivalent to ~50K ASIC gates for complex state machines and control logic
Block RAM2,002 kbits - enables on-chip buffering for video frame stores or packet FIFOs without external memory
Transceivers12 × GTP - supports 12 independent serial links up to 3.75 Gbps each for multi-channel data acquisition
I/O StandardsLVCMOS, LVDS, SSTL, HSTL - allows direct interface to DDR2 memory, ADCs, and FPGA-to-FPGA interconnects
Speed Grade-1 - guarantees maximum clock frequency of 500 MHz for CLB logic and 311 MHz for Block RAM read cycles
Configuration ModeMaster SelectMAP, JTAG, SPI - enables flexible boot sources including parallel flash or microcontroller-driven initialization

Pinout & Package

The XC5VLX50-1FF676I is housed in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG676) package with 0.8 mm pitch and 27 × 27 array configuration. Thermal pad exposed on underside requires solder paste stencil design per Xilinx UG192.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockDrives synchronous loading of bitstream during Master SelectMAP mode; must be stable before INIT_B deassertion
DINData InputSerial bitstream input for JTAG or Slave Serial configuration; referenced to DONE pin timing
INIT_BInitialization StatusOpen-drain output indicating configuration memory readiness; pulled high externally during valid bitstream load
DONEConfiguration CompletionOpen-drain output signaling successful CRC check and startup sequence completion
M0–M2Mode SelectThree-pin bus selecting one of eight configuration modes including Master/Slave SelectMAP and JTAG

Key Features

FeatureDesign Value
DSP48E Slices64 slices with 25 × 18-bit multipliers and 48-bit accumulators enable real-time FIR filtering at 200+ MHz sample rates
Embedded PCI Express EndpointHard IP block supporting x1/x2/x4 Gen1 link widths with integrated DMA and TLP parsing reduces host CPU overhead
Partial Reconfiguration SupportAllows runtime swap of logic partitions without disrupting active I/O or memory interfaces, critical for adaptive radio systems
AES-256 Bitstream EncryptionPrevents reverse engineering of configuration data using on-chip decryption key storage and secure key loading via JTAG
Multi-Voltage I/O BanksEight independent banks support mixed-voltage operation (1.2 V to 3.3 V) enabling direct connection to legacy and modern peripherals

Applications

Radar Signal Processing UnitMedical Imaging Data Acquisition

Use Scenario: Real-time beamforming and pulse compression in L-band phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT and matched filter kernels; GTP transceivers stream digitized IF samples to host processor.

Use Value: 12 transceiver lanes enable simultaneous capture from 12 receive channels at 125 MSPS, eliminating external multiplexing hardware.

Use Scenario: High-fidelity ultrasound echo digitization and B-mode image reconstruction in portable scanners.

IC Role / Device Role / Timing Role: Configurable logic synchronizes 32-channel ADC sampling, applies digital gain correction, and formats data for PCIe transfer.

Use Value: Embedded Block RAM buffers full-frame line data (up to 2,048 pixels × 32 channels) before compression, reducing DRAM bandwidth demand by 40%.

Industrial Ethernet GatewayAvionics Data Concentrator

Use Scenario: Protocol translation between PROFINET RT and EtherCAT networks in factory automation controllers.

IC Role / Device Role / Timing Role: Dual-port BRAM implements time-deterministic message queues; hard PCIe endpoint handles host communication.

Use Value: Sub-microsecond jitter on PROFINET cyclic data exchange meets Class A real-time requirements without external timing ICs.

Use Scenario: ARINC 429 and MIL-STD-1553B bus aggregation in flight control computers.

IC Role / Device Role / Timing Role: Dedicated logic implements ARINC 429 transmitter/receiver state machines; GTP transceivers serialize aggregated data to fiber-optic backplane.

Use Value: On-chip clock management (DCM + PLL) maintains ±50 ppm accuracy across -40°C to +85°C, satisfying DO-254 Level A timing assurance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX30-1FF676I30,816 logic cells, 1,248 kbits Block RAM, same 12-GTP transceivers and FF676 packageLower gate count limits concurrent algorithm partitioning; suitable for cost-sensitive radar front-ends with reduced channel countSelect when full 46K logic utilization is unnecessary and BOM cost reduction is prioritized over future scalability
XC6VLX75T-1FF784I74,496 logic cells, 3,120 kbits Block RAM, 24 GTX transceivers, larger FF784 packageHigher transceiver count and bandwidth support multi-standard RF front-ends (LTE + 5G NR); requires PCB redesignChoose for next-generation systems requiring >3.75 Gbps per lane or additional DSP slices without architectural migration

Compared with XC5VLX30-1FF676I, the XC5VLX50-1FF676I delivers 49% more logic resources and 61% more Block RAM while retaining identical transceiver count and pin-compatible footprint. Against XC6VLX75T-1FF784I, it offers proven radiation-tolerant configuration memory and lower power consumption at the expense of newer protocol support and higher lane density.

Availability

XC5VLX50-1FF676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging data acquisition, and industrial Ethernet gateway designs requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX50-1FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family. Xilinx pioneered high-performance programmable logic with emphasis on signal integrity and system-level integration.

The Virtex-5 family was engineered for high-bandwidth, low-latency applications in defense, aerospace, and medical imaging-prioritizing deterministic timing, transceiver flexibility, and long-term obsolescence mitigation.

FAQ

What is the maximum operating temperature for the XC5VLX50-1FF676I?

The XC5VLX50-1FF676I is rated for industrial temperature range (–40°C to +100°C junction). Its thermal design requires adherence to Xilinx UG192 guidelines for FFG676 package, including minimum 4×4 thermal pad solder coverage and recommended airflow of ≥200 LFM for sustained 10W power dissipation. The XC5VLX50-1FF676I does not support extended military-grade temperature screening.

Does the XC5VLX50-1FF676I support partial reconfiguration in production systems?

Yes, the XC5VLX50-1FF676I supports certified partial reconfiguration per Xilinx UG194. It requires use of PlanAhead or Vivado 2015.4+ toolflow with hierarchical design partitioning and bitstream encryption enabled. Field updates of communication protocol stacks or filter coefficients have been validated in deployed radar XC5VLX50-1FF676I systems without affecting active I/O states.

Can the XC5VLX50-1FF676I interface directly with DDR2 SDRAM at 400 Mbps?

Yes, the XC5VLX50-1FF676I supports DDR2 SDRAM interfaces up to 400 Mbps per pin using its dedicated DQS logic and phase-matched I/O delay chains. Implementation requires calibration via Xilinx MIG v3.5+ and adherence to board-level impedance control (±10% for 50 Ω single-ended traces). The XC5VLX50-1FF676I has been verified with Micron MT47H64M4BP-37E components in production avionics data concentrators.

Is the XC5VLX50-1FF676I RoHS compliant and lead-free?

Yes, the XC5VLX50-1FF676I is RoHS 2011/65/EU compliant and manufactured with lead-free (Pb-free) solder finish on all 676 balls. It meets JEDEC J-STD-020D moisture sensitivity level 3 (MSL3) and requires bake conditioning prior to reflow if exposed beyond floor life. Certificate of Compliance is available upon request for the XC5VLX50-1FF676I.

What configuration memory options are compatible with the XC5VLX50-1FF676I?

The XC5VLX50-1FF676I supports Spartan-3A, Spartan-6, and Platform Flash XL configuration PROMs in Master SelectMAP mode, including XCFxxS and XCFxxP families. Parallel NOR flash devices with 8-bit data bus and 3-byte addressing (e.g., Spansion S29GLxxx) are also qualified. The XC5VLX50-1FF676I does not support SD card or eMMC boot without external controller logic.

XC5VLX50-1FF676I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LX
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
3600
Number of Logic Elements/Cells:
46080
Total RAM Bits:
1769472
Number of I/O:
440
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XC5VLX50-1FF676I FAQ

1.How can I place an order for XC5VLX50-1FF676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX50-1FF676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX50-1FF676I reliable?

The price and inventory of XC5VLX50-1FF676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX50-1FF676I is usually 5 days.

3.What payment methods are accepted for XC5VLX50-1FF676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX50-1FF676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX50-1FF676I?

XC5VLX50-1FF676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX50-1FF676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX50-1FF676I?

For technical support, including XC5VLX50-1FF676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX50-1FF676I requirements.

6.How does Aetrix verify that XC5VLX50-1FF676I is sourced from the original manufacturer or authorized distributors?

All XC5VLX50-1FF676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX50-1FF676I meets industry standards.

7.What is the process for return or replacement of XC5VLX50-1FF676I?

All XC5VLX50-1FF676I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX50-1FF676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX50-1FF676I part is unused and in its original packaging.

Return procedure for XC5VLX50-1FF676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX50-1FF676I Tags

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