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AMD XC5VLX50-1FFG324C
- Part No.:
- XC5VLX50-1FFG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-BBGA, FCBGA
- Datasheet:
-
XC5VLX50-1FFG324C.pdf
- Description:
- IC FPGA 220 I/O 324FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,706
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Product details
Overview
XC5VLX50-1FFG324C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 46,080 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 2,002 kbits. It implements high-speed signal processing in radar baseband subsystems and supports PCIe Gen1 x4 endpoint functionality with integrated RocketIO GTP transceivers.
For engineers reviewing the XC5VLX50-1FFG324C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), -1 speed grade timing performance, FFG324 flip-chip BGA package compatibility, and RocketIO transceiver channel count.
Technical Context
The XC5VLX50-1FFG324C integrates 24 RocketIO GTP transceivers operating up to 2.5 Gbps, each with dedicated clocking and 8B/10B encoding. It uses 6-input LUTs with dual-output capability and includes 18 × 25 multiplier blocks for DSP-intensive tasks.
Configurable I/O banks support independent voltage domains (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), and SelectIO technology enables source-synchronous interfaces including DDR2 SDRAM at 400 Mbps data rate. The device requires configuration via external SPI PROM or JTAG.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 46,080 - provides gate count equivalent to ~50K ASIC gates for complex RTL implementation |
| Block RAM | 2,002 kbits - supports large on-chip FIFOs, coefficient storage, or frame buffers without external memory |
| RocketIO GTP Transceivers | 24 channels @ 100 Mbps–2.5 Gbps - enables multi-lane serial protocols including PCIe Gen1 and Serial RapidIO |
| DSP Slices | 64 × 18 × 25 multipliers - delivers 1.2 GMAC/s peak arithmetic throughput for filtering or FFT acceleration |
| I/O Pins | 240 user I/Os - supports high-pin-count parallel interfaces and mixed-voltage board-level interconnect |
| Speed Grade | -1 - guarantees maximum clock frequency of 579 MHz for CLB logic in worst-case industrial conditions |
Pinout & Package
XC5VLX50-1FFG324C is housed in a 324-pin flip-chip fine-pitch BGA (FFG) package with 1.0 mm ball pitch, 19 × 19 array, and thermal pad. Package dimensions are 19 mm × 19 mm × 1.85 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration clock input | Drives internal configuration shift register during master serial mode; requires 50 MHz max frequency |
| DONE | Configuration status output | Open-drain signal pulled high when configuration completes successfully and I/Os become active |
| INIT_B | Configuration initialization | Active-low bidirectional signal indicating readiness to accept configuration data or signaling CRC error |
| M0–M2 | Mode select inputs | Set configuration mode (e.g., Master Serial, Slave SelectMAP) at power-up; sampled on PROG_B deassertion |
| PROG_B | Program initiation | Active-low input that resets configuration logic and clears internal SRAM before new bitstream load |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Clock Management (DCM & PLL) | Eight DCMs and two PLLs per device enable precise clock synthesis, phase alignment, and jitter reduction across multiple domains |
| SelectIO Technology | Supports 18 I/O standards including LVDS, SSTL, HSTL, and PCI-X, enabling direct interfacing with memory and legacy peripherals |
| Embedded PowerPC 440 Cores (optional) | Not present in XC5VLX50 - this LX family variant excludes hard processor cores, simplifying thermal and timing closure for pure logic designs |
| Partial Reconfiguration Support | Enables dynamic logic module swapping during operation, reducing system downtime and enabling field-upgradable functions |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical digital down-conversion and CFAR detection algorithms with deterministic latency. Use Value: 24 RocketIO transceivers interface directly with ADC/DAC FMC modules, eliminating external serializer/deserializer chips. | Use Scenario: High-throughput image reconstruction pipeline in portable ultrasound machines using raw RF data streams. IC Role / Device Role / Timing Role: XC5VLX50-1FFG324C serves as the central data path controller, managing DMA transfers between DDR2 SDRAM and custom imaging IP blocks. Use Value: 2,002 kbits of Block RAM buffer full-frame echo data while FFT engines process sub-regions concurrently. |
| Industrial Ethernet Gateway | Test Equipment Pattern Generator |
Use Scenario: Protocol translation between EtherCAT and Time-Sensitive Networking (TSN) in factory automation controllers. IC Role / Device Role / Timing Role: Implements dual MACs with hardware timestamping and schedule-aware traffic shapers using LUT-based logic. Use Value: 240 user I/Os support simultaneous connection to multiple PHYs and backplane buses without glue logic. | Use Scenario: High-speed digital stimulus generation for ATE systems validating SerDes compliance in SoCs. IC Role / Device Role / Timing Role: XC5VLX50-1FFG324C generates PRBS patterns and captures response waveforms at 2.5 Gbps using RocketIO GTPs in loopback mode. Use Value: -1 speed grade ensures setup/hold timing margins meet JEDEC JESD204B sampling requirements at 125°C junction temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX30-1FFG324C | 30,816 logic cells, 1,312 kbits Block RAM, 12 RocketIO GTPs - smaller capacity and half the transceiver count | Suitable for cost-sensitive PCIe endpoint designs with single-lane connectivity and reduced DSP resource needs | Select when design fits within 65% of XC5VLX50-1FFG324C resources and thermal envelope allows lower-power operation |
| XC5VLX110-1FFG1136C | 110,592 logic cells, 4,812 kbits Block RAM, 48 RocketIO GTPs - larger die, higher I/O count (640), and 1136-ball package | Required for multi-gigabit optical transport systems needing >24 transceiver lanes and >2× logic density | Choose only if XC5VLX50-1FFG324C fails timing closure or resource utilization exceeds 90% in critical paths |
Compared with XC5VLX30-1FFG324C and XC5VLX110-1FFG1136C, the XC5VLX50-1FFG324C delivers optimal balance of transceiver count, logic density, and thermal profile for mid-range high-speed serial interface applications without requiring PCB redesign or cooling upgrades.
Availability
XC5VLX50-1FFG324C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and industrial Ethernet gateway applications requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX50-1FFG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Virtex-5 family was designed for high-performance logic and serial connectivity in wired infrastructure, defense electronics, and scientific instrumentation where deterministic timing and multi-protocol I/O flexibility are essential.
FAQ
What is the maximum supported I/O standard voltage for XC5VLX50-1FFG324C?
The XC5VLX50-1FFG324C supports I/O bank voltages from 1.2 V to 3.3 V, with each of its 11 I/O banks configurable independently. This enables mixed-voltage board designs interfacing with DDR2 SDRAM (1.8 V), LVDS peripherals (2.5 V), and legacy 3.3 V logic without level-shifting components. The XC5VLX50-1FFG324C datasheet specifies VCCO tolerance of ±3% for all supported standards.
Does XC5VLX50-1FFG324C include embedded processor cores?
No, the XC5VLX50-1FFG324C belongs to the Virtex-5 LX family, which contains no hard processor cores. Unlike the FX or SX variants, it provides only programmable logic fabric, DSP slices, and RocketIO transceivers. System control must be implemented using soft-core processors such as MicroBlaze, or offloaded to an external microcontroller. This architecture simplifies timing analysis for the XC5VLX50-1FFG324C in real-time signal processing applications.
What configuration modes are supported by XC5VLX50-1FFG324C?
The XC5VLX50-1FFG324C supports Master Serial, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins sampled at PROG_B deassertion. Master Serial uses internal oscillator and CCLK to load bitstream from SPI PROM; JTAG enables boundary-scan testing and in-system programming. All modes are fully documented in the XC5VLX50-1FFG324C Configuration User Guide UG191.
Is XC5VLX50-1FFG324C RoHS compliant and lead-free?
Yes, the XC5VLX50-1FFG324C is manufactured in a lead-free, RoHS-compliant process. The FFG324 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). Full compliance documentation, including substance declarations and test reports, is available through AMD's Product Change Notification system for the XC5VLX50-1FFG324C.
What is the operating temperature range for XC5VLX50-1FFG324C?
The XC5VLX50-1FFG324C is rated for commercial (0°C to +85°C) and industrial (–40°C to +100°C) temperature grades. The "C" suffix in the part number denotes the commercial grade. Industrial-grade variants are designated with "I" (e.g., XC5VLX50-1FFG324I) and undergo extended burn-in and characterization. Thermal design must account for 12 W typical power dissipation under full utilization of the XC5VLX50-1FFG324C.
XC5VLX50-1FFG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 324-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3600
- Number of Logic Elements/Cells:
- 46080
- Total RAM Bits:
- 1769472
- Number of I/O:
- 220
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-FCBGA (19x19)
XC5VLX50-1FFG324C FAQ
1.How can I place an order for XC5VLX50-1FFG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX50-1FFG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX50-1FFG324C reliable?
The price and inventory of XC5VLX50-1FFG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX50-1FFG324C is usually 5 days.
3.What payment methods are accepted for XC5VLX50-1FFG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX50-1FFG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX50-1FFG324C?
XC5VLX50-1FFG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX50-1FFG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX50-1FFG324C?
For technical support, including XC5VLX50-1FFG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX50-1FFG324C requirements.
6.How does Aetrix verify that XC5VLX50-1FFG324C is sourced from the original manufacturer or authorized distributors?
All XC5VLX50-1FFG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX50-1FFG324C meets industry standards.
7.What is the process for return or replacement of XC5VLX50-1FFG324C?
All XC5VLX50-1FFG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX50-1FFG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX50-1FFG324C part is unused and in its original packaging.
Return procedure for XC5VLX50-1FFG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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