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AMD XC5VLX50-1FFG324CES
- Part No.:
- XC5VLX50-1FFG324CES
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-BBGA, FCBGA
- Datasheet:
-
XC5VLX50-1FFG324CES.pdf
- Description:
- IC FPGA 220 I/O 324FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,756
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Product details
Overview
XC5VLX50-1FFG324CES from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 46,080 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 2,002 kbits. It implements high-speed signal processing in radar baseband subsystems with deterministic latency and multi-gigabit I/O.
For engineers reviewing the XC5VLX50-1FFG324CES datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (VSR, XAUI), DSP48E slice count (640), and -1 speed grade timing closure margin for aerospace-grade timing-critical designs.
Technical Context
The XC5VLX50-1FFG324CES integrates 640 DSP48E slices supporting 25×18-bit multiply-accumulate operations at 550 MHz, and 24 RocketIO GTP transceivers compliant with PCIe 1.1, SATA, and Serial RapidIO standards. Its SelectIO interface supports differential standards including LVDS, RSDS, and HSTL up to 1.25 Gbps per pin.
This device uses a 6-input LUT architecture with dual-register flip-flops per slice, enabling high-density synchronous logic implementation. Configuration occurs via Master SelectMAP or JTAG, with bitstream encryption supported through AES-256 keys stored in on-chip eFUSE.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 46,080 - total configurable logic resources for complex state machines and control logic |
| DSP Slices | 640 DSP48E - enables parallel 25×18-bit MAC operations at 550 MHz for real-time filtering |
| Block RAM | 2,002 kbits - distributed across 288 BRAM blocks, each 18 kbits, supporting dual-port FIFOs |
| Transceivers | 24 GTP - 2.5 Gbps serial I/O supporting PCIe 1.1, SATA, and Serial RapidIO protocols |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns Tco and 311 MHz system clock in worst-case industrial temp |
| I/O Standards | LVDS, RSDS, HSTL, SSTL - supports 1.25 Gbps differential signaling with programmable drive strength |
| Configuration | Master SelectMAP/JTAG - supports encrypted bitstream loading via AES-256 key in eFUSE |
Pinout & Package
XC5VLX50-1FFG324CES is housed in a 324-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 1.0 mm pitch, 19×19 array, and thermal lid. The package supports industrial temperature range (–40°C to +100°C) and meets JEDEC J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Input clock for Master SelectMAP configuration mode; must be stable before INIT_B assertion |
| INIT_B | Configuration Status | Open-drain output indicating bitstream load readiness; pulled high during valid configuration |
| DONE | Configuration Completion | Open-drain output signaling successful bitstream loading; requires external pull-up |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and resets internal state |
| M0–M2 | Mode Select | Three-pin bus defining configuration mode (e.g., Master SelectMAP, JTAG, Slave Parallel) |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Clock Management | Four DCMs and two PLLs per device enable precise clock phase alignment and jitter reduction for multi-clock domain systems |
| Embedded Memory Architecture | 288 × 18-kbit BRAM blocks support true dual-port operation with independent read/write clocks for buffer management |
| High-Speed Serial Connectivity | 24 GTP transceivers with built-in 8B/10B encoding/decoding eliminate external SerDes ICs in protocol-constrained designs |
| Security Enforcement | AES-256 bitstream encryption with eFUSE key storage prevents unauthorized configuration and IP theft |
| Thermal & Power Optimization | Dynamic power gating per CLB column reduces static power by up to 35% in partial reconfiguration scenarios |
Applications
| Radar Baseband Processing | Avionics Data Concentrator |
|---|---|
Use Scenario: Real-time pulse-Doppler processing of phased-array radar returns with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric implements matched filter chains, CFAR detection, and beamforming logic with deterministic timing paths. Use Value: 640 DSP48E slices enable concurrent 16-channel FFT + correlation pipelines at 311 MHz system clock without external co-processors. | Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and Ethernet avionics buses in flight control computers. IC Role / Device Role / Timing Role: XC5VLX50-1FFG324CES acts as a deterministic interconnect bridge with hard-wired bus controllers and time-stamped packet routing. Use Value: Embedded 24 GTP transceivers and SelectIO support simultaneous ARINC 429 (100 kbps) and MIL-STD-1553 (1 Mbps) I/O with <100 ns jitter tolerance. |
| Medical Imaging Backend | Test Equipment Signal Generator |
Use Scenario: High-fidelity ultrasound beamformer backend processing requiring synchronized channel data alignment and dynamic focusing. IC Role / Device Role / Timing Role: XC5VLX50-1FFG324CES provides real-time delay-and-sum computation across 128 channels using distributed BRAM and DSP slices. Use Value: 2,002 kbits of Block RAM enables 128-channel, 256-sample deep channel buffers with zero-cycle access for interpolation kernels. | Use Scenario: Arbitrary waveform generation with sub-nanosecond edge placement accuracy for semiconductor ATE calibration. IC Role / Device Role / Timing Role: FPGA fabric implements high-resolution digital pattern generators with deterministic timing control over DAC interfaces. Use Value: -1 speed grade ensures 1.0 ns clock-to-output delay stability across –40°C to +100°C, critical for picosecond-level timing calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX30-1FFG324C | 30,816 logic cells, 480 DSP48E slices, 1,334 kbits BRAM - lower density and reduced transceiver count (12 GTP) | Suitable for cost-sensitive avionics I/O concentrators with fewer protocol stacks | Select when full XC5VLX50-1FFG324CES resources are unused and BOM cost reduction is prioritized |
| XC5VLX110-1FFG1136C | 110,592 logic cells, 1,472 DSP48E slices, 4,608 kbits BRAM - larger die, 1136-pin FFG package, higher power | Required for multi-standard wireless baseband with LTE + 5G NR channel processing in single device | Choose when XC5VLX50-1FFG324CES lacks sufficient DSP or memory for target algorithm complexity |
Compared with XC5VLX30-1FFG324C, XC5VLX50-1FFG324CES delivers 49% more logic, 33% more DSP slices, and full 24-GTP capability-enabling consolidated radar processing without external SerDes. Against XC5VLX110-1FFG1136C, it offers identical speed grade and I/O standards but in a smaller footprint and lower thermal envelope for space-constrained modules.
Availability
XC5VLX50-1FFG324CES is available at Aetrix Electronics and suitable for radar subsystems, avionics data concentrators, and medical imaging backend processing requiring stable component supply across extended lifecycle programs.
Supply support for XC5VLX50-1FFG324CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Virtex FPGA product line for high-end signal processing and adaptive computing applications.
The Virtex-5 family was engineered for deterministic, high-bandwidth digital signal processing in aerospace, defense, and medical imaging systems where latency, reliability, and protocol flexibility are critical.
FAQ
What is the maximum guaranteed operating frequency for XC5VLX50-1FFG324CES in industrial temperature range?
The XC5VLX50-1FFG324CES -1 speed grade guarantees 311 MHz system clock operation under worst-case industrial conditions (–40°C to +100°C) with full timing closure. This applies to synchronous logic paths meeting setup/hold constraints defined in UG192, and assumes proper PCB layout, power delivery, and thermal management per Xilinx DS106.
Does XC5VLX50-1FFG324CES support bitstream encryption?
Yes, XC5VLX50-1FFG324CES supports AES-256 bitstream encryption using keys stored in one-time-programmable eFUSE. The encryption engine operates during Master SelectMAP configuration, and decrypted bitstream never appears on external pins-ensuring IP protection against physical probing or cloning attacks targeting the XC5VLX50-1FFG324CES.
How many RocketIO GTP transceivers does XC5VLX50-1FFG324CES include?
XC5VLX50-1FFG324CES integrates 24 RocketIO GTP transceivers, each capable of 625 Mbps to 2.5 Gbps operation. These transceivers natively support PCIe 1.1, SATA I/II, and Serial RapidIO 1.x protocols with integrated 8B/10B encoding, making them suitable for high-speed interconnect in radar and avionics systems using the XC5VLX50-1FFG324CES.
What configuration modes are supported by XC5VLX50-1FFG324CES?
XC5VLX50-1FFG324CES supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. JTAG is used for debugging and programming; Master SelectMAP enables standalone configuration from external flash, which is standard for field-deployed XC5VLX50-1FFG324CES systems.
Is XC5VLX50-1FFG324CES qualified for extended temperature operation?
Yes, XC5VLX50-1FFG324CES is rated for industrial temperature range (–40°C to +100°C) and is commonly deployed in radar front-ends and avionics modules where ambient thermal cycling exceeds commercial limits. Its FFG324 package meets JEDEC J-STD-020 MSL3 handling requirements, and thermal performance is validated per Xilinx DS106 specification for the XC5VLX50-1FFG324CES.
XC5VLX50-1FFG324CES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 324-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3600
- Number of Logic Elements/Cells:
- 46080
- Total RAM Bits:
- 1769472
- Number of I/O:
- 220
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-FCBGA (19x19)
XC5VLX50-1FFG324CES FAQ
1.How can I place an order for XC5VLX50-1FFG324CES through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX50-1FFG324CES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX50-1FFG324CES reliable?
The price and inventory of XC5VLX50-1FFG324CES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX50-1FFG324CES is usually 5 days.
3.What payment methods are accepted for XC5VLX50-1FFG324CES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX50-1FFG324CES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX50-1FFG324CES?
XC5VLX50-1FFG324CES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX50-1FFG324CES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX50-1FFG324CES?
For technical support, including XC5VLX50-1FFG324CES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX50-1FFG324CES requirements.
6.How does Aetrix verify that XC5VLX50-1FFG324CES is sourced from the original manufacturer or authorized distributors?
All XC5VLX50-1FFG324CES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX50-1FFG324CES meets industry standards.
7.What is the process for return or replacement of XC5VLX50-1FFG324CES?
All XC5VLX50-1FFG324CES units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX50-1FFG324CES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX50-1FFG324CES part is unused and in its original packaging.
Return procedure for XC5VLX50-1FFG324CES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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